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91. 发明申请

US20080047939A1 PROCESS AND APPARATUS FOR JOINING AT LEAST TWO ELEMENTS 审中-公开
标题翻译：用于加入至少两个元素的过程和装置
公开(公告)号：US20080047939A1
公开(公告)日：2008-02-28
申请号：US11839686
申请日：2007-08-16
申请人： Stefan Hummelt
发明人： Stefan Hummelt
IPC分类号： B23K26/20
CPC分类号： B23K1/0056 , B23K26/067 , B23K26/0673 , B23K26/0838 , H05K3/3421 , H05K3/3494 , H05K2203/107
摘要： Process and apparatus for joining at least two elements, in particular an electronic component such as an LED with a substrate, such as a PCB. An imaging means divides a light beam into a plurality of partial light beams and images these partial light beams, forming a plurality of discrete light spots, which form a plurality of discrete material joining portions. The light beam is divided using a diffractive optical element (DOE) also enabling a beam shaping and beam processing. A plurality of material joining portions can be formed simultaneously enabling a high process rate. The method is suited for laser soldering of components, which are not exposed to high thermal loads, e.g. for forming electrical contacting portions of LEDs. These discrete light spots can also be used for material processing, in particular for simultaneously forming a plurality of preweakened material zones or perforations in a substrate.
摘要翻译：用于连接至少两个元件的工艺和装置，特别是诸如具有诸如PCB的基板的LED的电子部件。成像装置将光束分成多个部分光束并对这些部分光束进行成像，形成多个分立的光点，其形成多个分立的材料接合部分。使用衍射光学元件（DOE）分割光束，其也能够进行光束成形和光束处理。可以同时形成多个材料接合部，能够实现高处理速度。该方法适用于不暴露于高热负荷的部件的激光焊接。用于形成LED的电接触部分。这些离散的光点也可以用于材料加工，特别是用于在衬底中同时形成多个预浸造材料区域或穿孔。

92. 发明申请

US20070279878A1 Circuit board including hybrid via structures 有权
标题翻译：电路板包括混合通孔结构
公开(公告)号：US20070279878A1
公开(公告)日：2007-12-06
申请号：US11443763
申请日：2006-05-31
申请人： Xingjian Cai , Ke Wang , Qing-lun Chen
发明人： Xingjian Cai , Ke Wang , Qing-lun Chen
IPC分类号： H05K7/00
CPC分类号： H05K1/115 , H05K1/0237 , H05K1/0245 , H05K1/112 , H05K3/3415 , H05K3/3421 , H05K3/3447 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/09627 , H05K2201/09636 , H05K2201/09709 , H05K2201/10189 , H05K2201/10659 , Y02P70/613
摘要： A circuit board may include hybrid via structures configured to connect to components, such as connectors and electronic components, mounted on the circuit board. A hybrid via structure may include one or more micro-vias configured to provide an electrical connection to a signal trace in the circuit board and one or more through-vias configured to provide a ground connection to at least one reference plane in the circuit board. In one embodiment, a plurality of circuit boards including the hybrid via structures and signal traces may be connected to establish a channel supporting differential signaling and data transfer rates of at least about 5 Gb/s. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
摘要翻译：电路板可以包括被配置为连接到安装在电路板上的诸如连接器和电子部件的组件的混合通孔结构。混合通孔结构可以包括一个或多个微通孔，其被配置为提供与电路板中的信号迹线的电连接以及被配置为提供到电路板中的至少一个参考平面的接地连接的一个或多个通孔。在一个实施例中，可以连接包括混合通路结构和信号迹线的多个电路板，以建立支持至少约5Gb / s的差分信令和数据传输速率的信道。当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

93. 发明申请

US20070247581A1 Substrate mounting method, display device and substrate 审中-公开
标题翻译：基板安装方法，显示装置和基板
公开(公告)号：US20070247581A1
公开(公告)日：2007-10-25
申请号：US11785796
申请日：2007-04-20
申请人： Atsushi Kakiuchi
发明人： Atsushi Kakiuchi
IPC分类号： G02F1/1345
CPC分类号： H05K1/144 , H05K1/148 , H05K3/3421 , H05K3/3447 , H05K2201/09954 , H05K2201/10128 , H05K2201/10189
摘要： The present invention provide a substrate mounting method, a display device and a substrate for realizing sharing of the substrate without increasing the number of substrates. A substrate provided with through holes through which pins of a wire member connector are passed at an end for mounting the wire member connector and lands for mounting a board-to-board connector by soldering pins of the board-to-board connector to the vicinity of the through holes on a surface opposite to the surface on which the wire member connector is mounted, wherein the pins of the wire member connector are passed through the through holes and the pins of the wire member connector and the corresponding lands are electrically connected using conductive wires.
摘要翻译：本发明提供一种基板安装方法，显示装置和基板，用于在不增加基板数量的情况下实现基板共享。具有贯通孔的基板，线构件连接器的销一端通过，用于安装线构件连接器的端部和用于通过将板对板连接器的销钉焊接到附近来安装板对板连接器的平台在与安装有线构件连接器的表面相对的表面上的通孔中，线构件连接器的销穿过通孔，并且线构件连接器的销和相应的焊盘的电极使用导线。

94. 发明申请

US20070205898A1 Air coil and manufacturing method thereof 审中-公开
标题翻译：空气盘管及其制造方法
公开(公告)号：US20070205898A1
公开(公告)日：2007-09-06
申请号：US11705436
申请日：2007-02-13
申请人： Ru-Kuen Huang , Chieh-Cheng Chen
发明人： Ru-Kuen Huang , Chieh-Cheng Chen
IPC分类号： G08B13/14
CPC分类号： H01F41/10 , H01F17/02 , H01F27/292 , H05K3/3421
摘要： A manufacturing method of an air coil with leads includes the following steps. Firstly, at least one conductive bump is formed on a base, and the base has at least one lead. Then, at least one end of at least one coil body is disposed on the lead, and is correspondingly contacted with the conductive bump. Finally, the shape of the conductive bump is changed to connect the lead and the coil body.
摘要翻译：具有引线的空气线圈的制造方法包括以下步骤。首先，在基座上形成至少一个导电凸块，并且底座具有至少一个引线。然后，至少一个线圈体的至少一端设置在引线上，并且相应地与导电凸块接触。最后，改变导电凸块的形状以连接引线和线圈体。

95. 发明授权

US07265315B2 Method of joining terminals by soldering 有权
标题翻译：通过焊接连接端子的方法
公开(公告)号：US07265315B2
公开(公告)日：2007-09-04
申请号：US10963570
申请日：2004-10-14
申请人： Atsushi Oohashi , Shoichiro Nishitani , Takahiro Yamada
发明人： Atsushi Oohashi , Shoichiro Nishitani , Takahiro Yamada
IPC分类号： B23K26/20 , B23K26/42
CPC分类号： H01R43/0214 , B23K1/0056 , H01R43/0221 , H01R43/0242 , H05K3/3421 , H05K3/3494 , H05K2203/0195 , H05K2203/0278 , H05K2203/107 , H05K2203/111 , Y02P70/613
摘要： A method of joining terminals by soldering is provided which allows control of increasing gas supply even in soldering performed in a gas atmosphere within a gas chamber. Utilizing a springback phenomenon occurring at a flat portion of a terminal, a solder joint of the terminal is immersed in molten solder. Then, laser soldering is performed using a gas chamber made of a material which transmits a laser beam at least in part.
摘要翻译：提供了通过焊接连接端子的方法，其允许即使在气体室内的气体气氛中进行的焊接中也可以控制增加的气体供应。利用在端子的平坦部分发生的回弹现象，将端子的焊点浸入熔融焊料中。然后，使用由至少部分透射激光束的材料制成的气室进行激光焊接。

96. 发明授权

US07259452B2 Leaded package integrated circuit stacking 有权
标题翻译：引线封装集成电路堆叠
公开(公告)号：US07259452B2
公开(公告)日：2007-08-21
申请号：US11248662
申请日：2005-10-11
申请人： James Douglas Wehrly, Jr. , David Roper
发明人： James Douglas Wehrly, Jr. , David Roper
IPC分类号： H01L23/02
CPC分类号： H05K1/147 , H01L23/49827 , H01L23/5387 , H01L25/105 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H05K1/141 , H05K1/189 , H05K3/3421 , H05K2201/049 , H05K2201/056 , H05K2201/09445 , H05K2201/10515 , H05K2201/10689 , H01L2924/00
摘要： A system and method for electrically and thermally coupling adjacent IC packages to one another in a stacked configuration is provided. A flex circuit is inserted in part between ICs to be stacked and provides a connective field that provides plural contact areas that connect to respective leads of the ICs. Thus, the flex does not require discrete leads which must be individually aligned with the individual leads of the constituent ICs employed in the stack. The principle may be employed to aggregate two or more contact areas for respective connection to leads of constituent ICs but is most profitably employed with a continuous connective field that provides contact areas for many leads of the ICs.
摘要翻译：提供了一种用于将堆叠配置中的相邻IC封装彼此电和热耦合的系统和方法。将柔性电路部分地插入待堆叠的IC之间，并提供连接到IC的各个引线的多个接触区域的连接场。因此，flex不需要离散引线，它们必须与堆叠中采用的构成IC的单个引线单独对准。该原理可以用于聚合两个或更多个接触区域，以用于分别连接到构成IC的引线，但是对于提供IC的许多引线的接触面积的连续连接场最有利地使用。

97. 发明申请

US20070187842A1 PRINTED CIRCUIT, METHOD OF MANUFACTURING THE PRINTED CIRCUIT, PRINTED CIRCUIT/ELECTRONIC ELEMENT ASSEMBLY, AND METHOD OF MANUFACTURING THE PRINTED CIRCUIT/ELECTRONIC ELEMENT ASSEMBLY 审中-公开
标题翻译：印刷电路，制造印刷电路的方法，印刷电路/电子元件组件以及制造印刷电路/电子元件组件的方法
公开(公告)号：US20070187842A1
公开(公告)日：2007-08-16
申请号：US11673230
申请日：2007-02-09
申请人： Sang-chul SHIN , Woo-cheol Jeong
发明人： Sang-chul SHIN , Woo-cheol Jeong
IPC分类号： H01L23/48
CPC分类号： H05K3/3452 , H05K1/189 , H05K3/0023 , H05K3/284 , H05K3/303 , H05K3/3421 , H05K2201/0154 , H05K2201/10189 , H05K2201/10568 , H05K2201/10977 , H05K2201/2036 , Y02P70/613
摘要： Provided is a printed circuit. The printed circuit includes a base layer, a plurality of bonding pads formed on the base layer, and an insulation barrier formed between the bonding pads. The insulation barrier prevents a short circuit caused by whisker growth on solder portions electrically connecting the bonding pads to bonding portions of an electronic element.
摘要翻译：提供了一种印刷电路。印刷电路包括基底层，形成在基底层上的多个接合焊盘以及形成在接合焊盘之间的绝缘屏障。绝缘屏障防止了将焊接部分电连接到电子元件的结合部分的焊料部分上的晶须生长引起的短路。

99. 发明申请

US20070109758A1 Printed circuit board of semiconductor package and method for mounting semiconductor package using the same 失效
标题翻译：半导体封装的印刷电路板和使用其的半导体封装的安装方法
公开(公告)号：US20070109758A1
公开(公告)日：2007-05-17
申请号：US11598755
申请日：2006-11-14
申请人： Seong-Chan Han , Dong-Chun Lee , Kwang-Su Yu , Dong-Woo Shin , Hyo-Jae Bang , Hyun-Seok Choi , Si-Suk Kim
发明人： Seong-Chan Han , Dong-Chun Lee , Kwang-Su Yu , Dong-Woo Shin , Hyo-Jae Bang , Hyun-Seok Choi , Si-Suk Kim
IPC分类号： H05K7/00
CPC分类号： H05K3/3421 , H05K3/243 , H05K3/282 , H05K3/3452 , H05K2201/0989 , H05K2201/099 , H05K2201/10689 , H05K2203/046 , Y02P70/613
摘要： Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.
摘要翻译：示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。半导体封装的引线可以安装在绝缘基板上。连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊锡涂层移动到半导体封装引线的肩部。

100. 发明申请

US20070102490A1 CIRCUIT BOARD,METHOD OF MOUNTING SURFACE MOUNTING COMPONENT ON CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT USING THE SAME CIRCUIT BOARD 审中-公开
标题翻译：电路板，电路板上安装表面安装部件的方法以及使用相同电路板的电子设备
公开(公告)号：US20070102490A1
公开(公告)日：2007-05-10
申请号：US11612873
申请日：2006-12-19
申请人： Yuki Momokawa , Eiichi Kono , Masaru Saitou , Kazuhiko Tanabe
发明人： Yuki Momokawa , Eiichi Kono , Masaru Saitou , Kazuhiko Tanabe
IPC分类号： A47J36/02
CPC分类号： H05K3/3426 , H05K1/0201 , H05K1/09 , H05K1/114 , H05K3/0094 , H05K3/3415 , H05K3/3421 , H05K3/3452 , H05K3/3463 , H05K3/3468 , H05K3/3494 , H05K3/42 , H05K3/429 , H05K2201/062 , H05K2201/09263 , H05K2201/09572 , H05K2201/09727 , H05K2201/10909 , H05K2201/2054 , H05K2203/0191 , H05K2203/047 , H05K2203/081 , H05K2203/1105 , H05K2203/1121 , H05K2203/1394 , H05K2203/304 , Y02P70/613 , Y10T29/49144
摘要： A through hole 2 in a circuit board 1 and to be joined to a lead 5 in a surface mounting component 6 is prepared from a material such as nickel, and palladium having a thermal conductivity equal to or less than 100 W/m.K, the circuit board 1 involving a alloy layer composed of at least a member selected from elements of solder 8, a pad 7, and the lead 5 in a solder joined site of the lead 5 and the pad 7, whereby a quantity of heat transmitted to the joined site via the through hole 2 is reduced at the time when wave-soldering is applied to the back of the circuit board 1 after the surface mounting component 6 was mounted, so that the joined site is maintained at a temperature equal to or less than a melting point of the alloy layer, and hence, exfoliation in an interface of the joined site is prevented, and reliability in the joint of the lead 5 and the pad 7 is elevated.
摘要翻译：电路板1中的通孔2并且与表面安装部件6中的引线5接合，由诸如镍的材料和热导率等于或小于100W / mK的钯制成，电路板1，其包括在引线5和焊盘7的焊料接合部位中至少由焊料8，焊盘7和引线5的元件组成的合金层，由此传递到接合部在安装表面安装部件6之后，当在电路板1的背面上施加波峰焊时，通过通孔2的位置被减小，使得接合部位保持在等于或小于合金层的熔点，因此防止了接合部位的界面的剥离，引线5和焊盘7的接头的可靠性提高。

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