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1. 发明申请

US20070279878A1 Circuit board including hybrid via structures 有权
标题翻译：电路板包括混合通孔结构
公开(公告)号：US20070279878A1
公开(公告)日：2007-12-06
申请号：US11443763
申请日：2006-05-31
申请人： Xingjian Cai , Ke Wang , Qing-lun Chen
发明人： Xingjian Cai , Ke Wang , Qing-lun Chen
IPC分类号： H05K7/00
CPC分类号： H05K1/115 , H05K1/0237 , H05K1/0245 , H05K1/112 , H05K3/3415 , H05K3/3421 , H05K3/3447 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/09627 , H05K2201/09636 , H05K2201/09709 , H05K2201/10189 , H05K2201/10659 , Y02P70/613
摘要： A circuit board may include hybrid via structures configured to connect to components, such as connectors and electronic components, mounted on the circuit board. A hybrid via structure may include one or more micro-vias configured to provide an electrical connection to a signal trace in the circuit board and one or more through-vias configured to provide a ground connection to at least one reference plane in the circuit board. In one embodiment, a plurality of circuit boards including the hybrid via structures and signal traces may be connected to establish a channel supporting differential signaling and data transfer rates of at least about 5 Gb/s. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
摘要翻译：电路板可以包括被配置为连接到安装在电路板上的诸如连接器和电子部件的组件的混合通孔结构。混合通孔结构可以包括一个或多个微通孔，其被配置为提供与电路板中的信号迹线的电连接以及被配置为提供到电路板中的至少一个参考平面的接地连接的一个或多个通孔。在一个实施例中，可以连接包括混合通路结构和信号迹线的多个电路板，以建立支持至少约5Gb / s的差分信令和数据传输速率的信道。当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

2. 发明申请

US20060067540A1 Method for signal nonlinear distortion detection and adaptive gain control 审中-公开
标题翻译：用于信号非线性失真检测和自适应增益控制的方法
公开(公告)号：US20060067540A1
公开(公告)日：2006-03-30
申请号：US10952068
申请日：2004-09-28
申请人： Xiao Gao , Qing-lun Chen
发明人： Xiao Gao , Qing-lun Chen
IPC分类号： H04R3/00
CPC分类号： H04R3/00
摘要： An apparatus includes a microphone to generate a voice signal. The apparatus further includes an adjustable gain circuit coupled to the microphone to selectively apply a gain to the voice signal. In addition the apparatus includes an analog front end circuit coupled to the adjustable gain circuit to transmit the voice signal via a telephone line. Also, the apparatus includes a control circuit coupled to the adjustable gain circuit. The control circuit is operative to detect an average level of energy of the voice signal outside of a voice frequency band. The control circuit is further operative to control, based at least in part on the detected average level of energy, an amount of gain applied to the voice signal by the adjustable gain circuit.
摘要翻译：一种装置包括麦克风以产生语音信号。该装置还包括耦合到麦克风的可调节增益电路，以选择性地向语音信号施加增益。此外，该装置包括耦合到可调增益电路的模拟前端电路，以经由电话线传输语音信号。此外，该装置包括耦合到可调增益电路的控制电路。控制电路用于检测语音频带外的语音信号的平均能量水平。控制电路进一步操作以至少部分地基于检测到的平均能量水平来控制由可调增益电路施加到语音信号的增益的量。

3. 发明授权

US08044305B2 Circuit board including hybrid via structures 有权
标题翻译：电路板包括混合通孔结构
公开(公告)号：US08044305B2
公开(公告)日：2011-10-25
申请号：US11443763
申请日：2006-05-31
申请人： Xingjian Cai , Ke Wang , Qing-lun Chen
发明人： Xingjian Cai , Ke Wang , Qing-lun Chen
IPC分类号： H05K1/16
CPC分类号： H05K1/115 , H05K1/0237 , H05K1/0245 , H05K1/112 , H05K3/3415 , H05K3/3421 , H05K3/3447 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/09627 , H05K2201/09636 , H05K2201/09709 , H05K2201/10189 , H05K2201/10659 , Y02P70/613
摘要： A circuit board may include hybrid via structures configured to connect to components, such as connectors and electronic components, mounted on the circuit board. A hybrid via structure may include one or more micro-vias configured to provide an electrical connection to a signal trace in the circuit board and one or more through-vias configured to provide a ground connection to at least one reference plane in the circuit board. In one embodiment, a plurality of circuit boards including the hybrid via structures and signal traces may be connected to establish a channel supporting differential signaling and data transfer rates of at least about 5 Gb/s. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
摘要翻译：电路板可以包括被配置为连接到安装在电路板上的诸如连接器和电子部件的组件的混合通孔结构。混合通孔结构可以包括一个或多个微通孔，其被配置为提供与电路板中的信号迹线的电连接以及被配置为提供到电路板中的至少一个参考平面的接地连接的一个或多个通孔。在一个实施例中，可以连接包括混合通路结构和信号迹线的多个电路板，以建立支持至少约5Gb / s的差分信令和数据传输速率的信道。当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

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