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    • 100. 发明申请
    • Electronic device and pressure sensor
    • 电子设备和压力传感器
    • US20040238940A1
    • 2004-12-02
    • US10855344
    • 2004-05-28
    • Hiromichi EbineKatsuhiko KikuchiSatoshi ShimadaMasahide Hayashi
    • H01L023/48
    • H05K3/3442H01L2924/0002H05K3/202H05K3/284H05K2201/09036H05K2201/09745H05K2201/10636Y02P70/611Y02P70/613H01L2924/00
    • An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.
    • 电子设备需要为了静电屏蔽而安装电子部件。 这种电子部件的安装提出了避免由于部件材料的线性膨胀系数之间的差异而产生的热应力和裂纹的问题。 在各引线的电子部件安装部中,以组合的方式形成定位凹部,接合物质厚度确保凹部,接合物质厚度确保凹部等,由此在接合物质中产生的裂纹的扩散可以 可以提高抑制和可靠性。 填充密封材料以密封和限制安装在电子部件安装部分中的电子部件而不留空隙有助于进一步抑制在接合物质中产生的裂纹的扩散,并确保接合物质的可靠性更好。