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    • 3. 发明授权
    • Device for control of the excitation current for a three phase generator
    • 用于控制三相发电机的励磁电流的装置
    • US06791301B2
    • 2004-09-14
    • US10030507
    • 2002-01-09
    • Achim HenkelReinhard Milich
    • Achim HenkelReinhard Milich
    • H02H706
    • H02P9/305H02J7/166H02P9/006
    • The invention relates to an apparatus for regulating the exciter current for a rotary-current generator. It has a voltage source, a rectifier, three phase windings, an evaluation unit, and a voltage regulator. The evaluation unit has three input terminals, and each of these input terminals is connected to one of the phase windings. The evaluation unit is intended for evaluating the phase voltages derived from the three phase windings, in order to detect error functions of the rectifier and/or of the phase windings. If such unauthorized work states are detected, then via the voltage regulator, the exciter current flowing through the exciter winding is reduced.
    • 本发明涉及一种用于调节旋转电流发生器的励磁电流的装置。 它具有电压源,整流器,三相绕组,评估单元和电压调节器。 评估单元具有三个输入端子,并且这些输入端子中的每一个连接到一个相绕组。 评估单元用于评估从三相绕组导出的相电压,以便检测整流器和/或相绕组的误差函数。 如果检测到这种未授权的工作状态,则经由电压调节器,减小了流过励磁机绕组的励磁机电流。
    • 7. 发明授权
    • Method for electrically connecting a semiconductor component to an electrical subassembly
    • 一种用于将半导体部件电连接到电子组件的方法
    • US07069653B2
    • 2006-07-04
    • US10343873
    • 2001-07-20
    • Rainer ToppDirk BalszunatStephan ErnstAchim HenkelDoerte Eimers-KloseReinhard Milich
    • Rainer ToppDirk BalszunatStephan ErnstAchim HenkelDoerte Eimers-KloseReinhard Milich
    • H01R43/00
    • H01L23/49558H01L23/32H01L23/36H01L23/49861H01L2924/0002Y10T29/49117Y10T29/49121Y10T29/4913Y10T29/49147Y10T29/49156Y10T29/49169H01L2924/00
    • A method of establishing an electric connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module by using a punched grid having internal terminal ends and external terminal ends that are electrically connected to the internal terminal ends by metal strip conductors, the semiconductor component and the punched grid are joined so that at least two electric terminals of the semiconductor component are positioned on corresponding internal terminal ends so that a slip-proof mounting of the semiconductor component on the two internal terminal ends is then possible, this mechanical mounting at the same time establishing an electric connection between the electric terminals of the semiconductor component and the internal terminal ends, whereby a metal strip grid, e.g., a punched grid, which, even before being joined to the semiconductor component, has already been embedded on at least one side in at least one partial area in a material that is not electrically conductive, is used as the metal strip grid. This procedure is used for bond-free contacting of semiconductor components for high-power applications in which a power loss of more than 1 Watt may occur.
    • 一种通过使用具有内部末端的冲压格栅和外部末端与电子模块的一部分建立电连接的电连接的方法,所述外部端子通过 金属带状导体,半导体部件和冲孔格栅被接合,使得半导体部件的至少两个电端子位于相应的内部端子端上,使得半导体部件在两个内部端子上的防滑安装 可能的是,这种机械安装同时在半导体部件的电端子和内部端子端之间建立电连接,由此即使在连接到半导体部件之前的金属条格栅,例如冲压格栅, 已经至少在一个部分中嵌入至少一侧 不导电的材料中的区域用作金属带网格。 该方法用于可能发生功率损耗大于1瓦特的大功率应用的半导体元件的无键接触。