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91. 发明授权

US07956472B2 Packaging substrate having electrical connection structure and method for fabricating the same 有权
标题翻译：具有电连接结构的封装基板及其制造方法
公开(公告)号：US07956472B2
公开(公告)日：2011-06-07
申请号：US12188663
申请日：2008-08-08
申请人： Shih-Ping Hsu
发明人： Shih-Ping Hsu
IPC分类号： H01L23/48
CPC分类号： H05K3/3473 , H01L21/4853 , H01L23/49816 , H01L2224/0401 , H01L2224/05563 , H01L2224/05571 , H01L2224/13006 , H01L2224/13022 , H01L2224/13109 , H01L2924/0002 , H01L2924/01327 , H05K3/244 , H05K3/3452 , H05K3/4007 , H05K2201/0367 , H05K2201/0989 , H05K2203/043 , H05K2203/054 , Y10T428/24331 , H01L2924/00 , H01L2224/05552
摘要： A packaging substrate having an electrical connection structure and a method for fabricating the same are provided. The packaging substrate have a substrate body with a plurality of conductive pads on a surface thereof; a solder mask layer disposed on the substrate body with a plurality of openings corresponding to the conductive pads, the size of each of the openings being larger than each of the conductive pads; and electroplated solder bumps for covering the conductive pads to provide better bond strength and reliability.
摘要翻译：提供具有电连接结构的封装基板及其制造方法。封装基板具有在其表面上具有多个导电焊盘的基板主体; 焊接掩模层，其设置在所述基板主体上，具有对应于所述导电焊盘的多个开口，每个所述开口的尺寸大于每个所述导电焊盘; 以及用于覆盖导电焊盘的电镀焊料凸块，以提供更好的粘合强度和可靠性。

92. 发明授权

US07952372B2 Contacting component, method of producing the same, and test tool having the contacting component 有权
标题翻译：接触部件，其制造方法以及具有接触部件的试验工具
公开(公告)号：US07952372B2
公开(公告)日：2011-05-31
申请号：US12968350
申请日：2010-12-15
申请人： Osamu Sugihara
发明人： Osamu Sugihara
IPC分类号： G01R31/20 , G01R31/00
CPC分类号： G01R3/00 , G01R1/0735 , H05K1/09 , H05K3/4007 , H05K3/423 , H05K2201/0323 , H05K2201/0367 , H05K2203/0733 , Y10T29/49204
摘要： A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact is made of a conductive material and formed on the other surface of the insulating substrate. The conductive circuit and the probe contact are electrically connected in a through hole penetrating the insulating substrate. The probe contact includes a bump contact of a convex shape, the bump contact is formed by plating and having a surface which has a shape of a semispherical protrusion to be contacted with the target portion. The bump contact is made of a material containing a metal and carbon, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive.
摘要翻译：接触部件具有由电镀形成的适于与目标部分接触的探针接触。接触部件包括绝缘基板，形成在绝缘基板的一个表面上的导电电路，并且探针接触件由导电材料制成并形成在绝缘基板的另一个表面上。导电电路和探针接触电连接在穿过绝缘基板的通孔中。探针接触包括凸起的凸起接触，凸起接触通过电镀形成，并且具有与目标部分接触的具有半球形突起的形状的表面。凸点接触由含有金属和碳的材料制成，碳含量在0.2at％至1.2at％之间的范围内。

93. 发明授权

US07943863B2 Wiring substrate and manufacturing method thereof, and semiconductor device 有权
标题翻译：配线基板及其制造方法以及半导体装置
公开(公告)号：US07943863B2
公开(公告)日：2011-05-17
申请号：US11882198
申请日：2007-07-31
申请人： Junichi Nakamura
发明人： Junichi Nakamura
IPC分类号： H05K1/11
CPC分类号： H01L23/49816 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/16 , H01L2221/68345 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/16225 , H01L2224/73203 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H05K3/108 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K3/4682 , H05K2201/0367 , H05K2201/09527 , Y10T29/4913 , Y10T29/49165 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A wiring substrate includes a first insulation layer, a connection terminal, a second insulation layer, a via, and a wiring pattern. The connection terminal is disposed in the first insulation layer so as to be exposed from a first main surface of the first insulation layer, and is electrically connected with a semiconductor chip. The second insulation layer is disposed on a second main surface of the first insulation layer situated on the opposite side from the first main surface. The via is disposed in the second insulation layer, and is electrically connected with the connection terminal. The via is separated from the connection terminal. The wiring pattern is disposed on the second main surface of the first insulation layer and electrically connects the connection terminal and the via.
摘要翻译：布线基板包括第一绝缘层，连接端子，第二绝缘层，通孔和布线图案。连接端子设置在第一绝缘层中，以从第一绝缘层的第一主表面露出，并与半导体芯片电连接。第二绝缘层设置在位于与第一主表面相反一侧的第一绝缘层的第二主表面上。通孔设置在第二绝缘层中，并与连接端子电连接。通孔与连接端子分离。布线图案设置在第一绝缘层的第二主表面上，并且电连接连接端子和通孔。

94. 发明申请

US20110100952A1 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING BUMP 有权
标题翻译：印刷电路板制作方法
公开(公告)号：US20110100952A1
公开(公告)日：2011-05-05
申请号：US12892047
申请日：2010-09-28
申请人： Ji-Eun KIM , Nam-Keun Oh , Jung-Hyun Park , Young-Ji Kim , Jong-Gyu Choi , Sang-Duck Kim
发明人： Ji-Eun KIM , Nam-Keun Oh , Jung-Hyun Park , Young-Ji Kim , Jong-Gyu Choi , Sang-Duck Kim
IPC分类号： H05K3/06
CPC分类号： H05K3/4007 , H05K3/061 , H05K3/205 , H05K2201/0367 , H05K2203/0152 , H05K2203/0376
摘要： A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented.
摘要翻译：公开了一种制造具有凸块的印刷电路板的方法。该方法包括制备其上形成有第一电路的第一载体，将第一载体压缩到绝缘层的一个表面，使得第一电路被掩埋，根据凸点将在第一载体上堆叠抗蚀剂通过蚀刻第一载体形成和形成凸块。根据本发明的实施例，可以减小印刷电路板中的凸块与其相邻凸块之间的高度差，从而可以更好地实现电子部件和印刷电路板之间的电连接。

95. 发明申请

US20110100696A1 DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE 失效
标题翻译：器件安装板和半导体模块
公开(公告)号：US20110100696A1
公开(公告)日：2011-05-05
申请号：US12915852
申请日：2010-10-29
申请人： Masayuki NAGAMATSU , Kiyoshi Shibata , Takanori Hayashi
发明人： Masayuki NAGAMATSU , Kiyoshi Shibata , Takanori Hayashi
IPC分类号： H05K1/11
CPC分类号： H05K3/3452 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L24/29 , H01L24/45 , H01L24/48 , H01L25/105 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01028 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H05K1/111 , H05K3/3436 , H05K3/368 , H05K2201/0367 , H05K2201/10515 , H05K2201/10734 , H05K2203/0588 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device is of a PoP structure such that first electrode portions provided on a first device mounting board constituting a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. A first insulating layer having an opening is provided on one main surface of an insulating resin layer which is a substrate, and an electrode portion, whose top portion protrudes above the top surface of the first insulating layer, is formed in the opening. A second insulating layer is provided on top of the first insulating layer in the periphery of the top portion of the first electrode portion; the second insulting layer is located slightly apart from the top portion of the first electrode portion. The first electrode portion is shaped such that the top portion is formed by a curved surface or formed by a curved surface and a plane surface smoothly connected to the curved surface.
摘要翻译：半导体器件具有PoP结构，使得设置在构成第一半导体模块的第一器件安装板上的第一电极部分和设置在第二半导体器件中的第二电极部分通过焊球接合在一起。具有开口的第一绝缘层设置在作为基板的绝缘树脂层的一个主表面上，并且其顶部突出于第一绝缘层的顶表面上方的电极部分形成在开口中。在第一电极部分的顶部周边的第一绝缘层的顶部上设置第二绝缘层; 第二绝缘层位于与第一电极部分的顶部稍微分开的位置。第一电极部分被成形为使得顶部由弯曲表面形成或由曲面形成并且平坦表面平滑地连接到弯曲表面。

96. 发明申请

US20110075391A1 Electronic Apparatus and Circuit Module 审中-公开
标题翻译：电子设备和电路模块
公开(公告)号：US20110075391A1
公开(公告)日：2011-03-31
申请号：US12786192
申请日：2010-05-24
申请人： Kazuyoshi Sasaki
发明人： Kazuyoshi Sasaki
IPC分类号： H05K1/14 , H05K7/18
CPC分类号： H05K3/361 , G03B21/145 , H05K1/148 , H05K3/403 , H05K2201/0367 , H05K2201/09181
摘要： According to one embodiment, an electronic apparatus has a circuit module. The circuit module includes a first circuit board having a first side end face on which a first circuit pattern is formed, a second circuit board having a second side end face on which a second circuit pattern is formed, and a flexible wiring board which is in contact with the first side end face and the second side end face to electrically connect the first circuit pattern and the second circuit pattern.
摘要翻译：根据一个实施例，电子设备具有电路模块。电路模块包括具有形成有第一电路图案的第一侧端面的第一电路板，具有形成第二电路图案的第二侧端面的第二电路板，以及形成有第二电路图案的柔性布线板与第一侧端面和第二侧端面接触以电连接第一电路图案和第二电路图案。

97. 发明申请

US20110048786A1 PRINTED CIRCUIT BOARD HAVING A BUMP AND A METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有BUMP的印刷电路板及其制造方法
公开(公告)号：US20110048786A1
公开(公告)日：2011-03-03
申请号：US12870137
申请日：2010-08-27
申请人： Suk Hyeon Cho , Jin Yong Ahn , Soon Oh Jung , Dong Ju Jeon , Ki Hwan Kim , Byung Moon Kim
发明人： Suk Hyeon Cho , Jin Yong Ahn , Soon Oh Jung , Dong Ju Jeon , Ki Hwan Kim , Byung Moon Kim
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K3/4015 , H05K3/007 , H05K3/20 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2201/10242 , H05K2203/0338 , Y10T29/49155
摘要： Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.
摘要翻译：这里公开了具有凹凸的印刷电路板及其制造方法。具有凸块的印刷电路板包括绝缘层，内部电路层被浸渍到该绝缘层中; 形成在所述绝缘层之下并具有暴露所述内部电路层的焊盘单元的开口的保护层; 以及与所述垫单元一体形成并从所述保护层的内侧通过所述开口突出到所述保护层的外侧的凸块。凸块与焊盘单元一体地形成，从而提高凸块和印刷电路板之间的接合强度，并且凸块的表面积形成为宽，从而提高焊球和印刷电路板之间的接合强度。

98. 发明申请

US20110034022A1 SEMICONDUCTOR PACKAGE AND FABRICATION METHOD 有权
标题翻译：半导体封装和制造方法
公开(公告)号：US20110034022A1
公开(公告)日：2011-02-10
申请号：US12905540
申请日：2010-10-15
申请人： Junichi Nakamura
发明人： Junichi Nakamura
IPC分类号： H01L21/28
CPC分类号： H05K3/4007 , H01L21/6835 , H01L23/13 , H01L23/49811 , H01L23/49822 , H01L2224/0401 , H01L2224/05568 , H01L2224/16 , H01L2224/16225 , H01L2924/0002 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15159 , H05K3/205 , H05K3/4644 , H05K2201/0367 , H05K2201/09045 , H05K2201/09481 , H05K2203/1536 , H01L2224/05552
摘要： A semiconductor package and a fabrication method thereof are disclosed, whereby an environmental problem is solved by using external connection terminals or semiconductor element-mounting terminals containing a smaller amount of lead, while at the same time achieving a fine pitch of the terminals. The semiconductor package includes a board (20) including a plurality of insulating resin layers, semiconductor element-mounting terminals (18) formed on the uppermost surface of the board, and external connection terminals (12) formed on the bottom surface thereof. Each external connection terminal (12) is formed as a bump projected downward from the bottom surface of the package, and each bump is filled with the insulating resin (14) while the surface thereof is covered by a metal (16). Wiring 124), (26) including a conductor via (26a) electrically connect the metal of the metal layer 16 and the semiconductor element-mounting terminals (18).
摘要翻译：公开了一种半导体封装及其制造方法，通过使用包含较少量的引线的外部连接端子或半导体元件安装端子，同时实现端子的精细间距来解决环境问题。半导体封装包括：多个绝缘树脂层的基板（20），形成在基板的最上表面上的半导体元件安装端子（18）和形成在其底面上的外部连接端子（12）。每个外部连接端子（12）形成为从封装的底表面向下突出的凸起，并且每个凸起都填充有绝缘树脂（14），同时其表面被金属（16）覆盖。包括导体通孔（26a）的布线124），（26）将金属层16的金属与半导体元件安装端子（18）电连接。

99. 发明申请

US20110024180A1 PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110024180A1
公开(公告)日：2011-02-03
申请号：US12559449
申请日：2009-09-14
申请人： Young Gwan Ko
发明人： Young Gwan Ko
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K1/114 , H05K3/0097 , H05K3/107 , H05K3/4007 , H05K3/4682 , H05K2201/0352 , H05K2201/0367 , H05K2203/1536
摘要： Disclosed is a printed circuit board, which includes an insulating member having a circuit pattern embedded in one surface thereof, a bump pad formed in the insulating member so as to be connected to the circuit pattern and protruding from an outer surface of the insulating member, a build-up layer formed on one surface of the insulating member and including a build-up insulating layer and a circuit layer formed in the build-up insulating layer and having a via connected to the circuit pattern, and a solder resist layer formed on the build-up layer. A method of fabricating the printed circuit board is also provided. The printed circuit board is fabricated using a build-up process and the outermost circuit layer thereof is formed to have an embedded structure using an imprinting process, thus minimizing the separation of the circuit layer and reducing the lead time and the fabrication cost.
摘要翻译：公开了一种印刷电路板，其包括具有嵌入其一个表面中的电路图案的绝缘构件，形成在所述绝缘构件中以与所述电路图案连接并从所述绝缘构件的外表面突出的凸块焊盘，形成在所述绝缘构件的一个表面上并包括积聚绝缘层和形成在所述积层绝缘层中并且具有连接到所述电路图案的通孔的电路层的堆积层，以及形成在所述绝缘层上的阻焊层积层。还提供了制造印刷电路板的方法。印刷电路板使用积聚工艺制造，并且其最外面的电路层被形成为具有使用压印工艺的嵌入式结构，从而最小化电路层的分离并减少了交货时间和制造成本。

100. 发明授权

US07875807B2 Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin 有权
标题翻译：弹性导电树脂和由弹性导电树脂制成的弹性导电凸块的电子器件
公开(公告)号：US07875807B2
公开(公告)日：2011-01-25
申请号：US11673904
申请日：2007-02-12
申请人： Takeshi Sano , Hirofumi Kobayashi , Hideaki Ohkura
发明人： Takeshi Sano , Hirofumi Kobayashi , Hideaki Ohkura
IPC分类号： H05K1/02
CPC分类号： H05K3/325 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/1319 , H01L2224/1329 , H01L2224/13386 , H01L2224/13439 , H01L2224/13444 , H01L2224/13447 , H01L2224/13455 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/4007 , H05K2201/0248 , H05K2201/0314 , H05K2201/0367 , H01L2924/00014 , H01L2924/0542 , H01L2224/05639 , H01L2224/05644 , H01L2224/05147
摘要： An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.
摘要翻译：电子设备包括电子部件，其包括至少一个第一电极，包括至少一个第二电极的基板和形成在所述至少一个第一电极上的至少一个凸块，并由包括具有橡胶弹性的树脂的弹性导电树脂形成，以及包括涂覆有金，银，镍和铜之一的表面层的针状导电填料。所述至少一个第一电极和所述至少一个第二电极通过使所述至少一个凸块与所述至少一个第二电极机械接触而彼此电连接。

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