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    • 1. 发明授权
    • Method of manufacturing an ion-exchanged glass article
    • 离子交换玻璃制品的制造方法
    • US08919150B2
    • 2014-12-30
    • US13608659
    • 2012-09-10
    • Mitsugu ImaiKazuaki HashimotoOsamu Sugihara
    • Mitsugu ImaiKazuaki HashimotoOsamu Sugihara
    • C03C21/00G11B5/84C03C3/083G11B5/71
    • G11B5/8404C03C3/083C03C21/002
    • An ion-exchanged glass article manufacturing method includes an ion-exchange step of bringing a glass article with a composition containing Li into contact with a molten salt dissolved solution containing an alkali metal element having an ionic radius larger than an ionic radius of the Li contained in the glass article, thereby ion-exchanging the Li in the glass article with the alkali metal element in the molten salt dissolved solution. At least one kind of additive selected from the group consisting of NaF, KF, K3AlF6, Na2CO3, NaHCO3, K2CO3, KHCO3, Na2SO4, K2SO4, KAl(SO4)2, Na3PO4, and K3PO4 is added to the molten salt dissolved solution so that the ion-exchange step is carried out while the additive is in a solid state.
    • 离子交换玻璃制品的制造方法包括使含有Li的组合物的玻璃制品与含有离子半径大于Li的离子半径的碱金属元素的熔融盐溶解溶液接触的离子交换工序 在玻璃制品中,使熔融盐溶解溶液中的碱金属元素与玻璃制品中的Li离子交换。 将至少一种选自NaF,KF,K 3 AlF 6,Na 2 CO 3,NaHCO 3,K 2 CO 3,KHCO 3,Na 2 SO 4,K 2 SO 4,KAl(SO 4)2,Na 3 PO 4和K 3 PO 4的添加剂加入到熔融盐溶解溶液中,使得 离子交换步骤在添加剂处于固态的同时进行。
    • 2. 发明申请
    • CONTACTING COMPONENT, METHOD OF PRODUCING THE SAME, AND TEST TOOL HAVING THE CONTACTING COMPONENT
    • 接触元件及其制造方法以及具有接触元件的测试工具
    • US20110080186A1
    • 2011-04-07
    • US12968350
    • 2010-12-15
    • Osamu SUGIHARA
    • Osamu SUGIHARA
    • G01R1/067
    • G01R3/00G01R1/0735H05K1/09H05K3/4007H05K3/423H05K2201/0323H05K2201/0367H05K2203/0733Y10T29/49204
    • A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact is made of a conductive material and formed on the other surface of the insulating substrate. The conductive circuit and the probe contact are electrically connected in a through hole penetrating the insulating substrate. The probe contact includes a bump contact of a convex shape, the bump contact is formed by plating and having a surface which has a shape of a semispherical protrusion to be contacted with the target portion. The bump contact is made of a material containing a metal and carbon, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive.
    • 接触部件具有由电镀形成的适于与目标部分接触的探针接触。 接触部件包括绝缘基板,形成在绝缘基板的一个表面上的导电电路,并且探针接触件由导电材料制成并形成在绝缘基板的另一个表面上。 导电电路和探针接触电连接在穿过绝缘基板的通孔中。 探针接触包括凸起的凸起接触,凸起接触通过电镀形成,并且具有与目标部分接触的具有半球形突起的形状的表面。 凸点接触由含有金属和碳的材料制成,碳含量在0.2at%至1.2at%之间的范围内。
    • 7. 发明授权
    • Contacting component, method of producing the same, and test tool having the contacting component
    • 接触部件,其制造方法以及具有接触部件的试验工具
    • US07952372B2
    • 2011-05-31
    • US12968350
    • 2010-12-15
    • Osamu Sugihara
    • Osamu Sugihara
    • G01R31/20G01R31/00
    • G01R3/00G01R1/0735H05K1/09H05K3/4007H05K3/423H05K2201/0323H05K2201/0367H05K2203/0733Y10T29/49204
    • A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact is made of a conductive material and formed on the other surface of the insulating substrate. The conductive circuit and the probe contact are electrically connected in a through hole penetrating the insulating substrate. The probe contact includes a bump contact of a convex shape, the bump contact is formed by plating and having a surface which has a shape of a semispherical protrusion to be contacted with the target portion. The bump contact is made of a material containing a metal and carbon, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive.
    • 接触部件具有由电镀形成的适于与目标部分接触的探针接触。 接触部件包括绝缘基板,形成在绝缘基板的一个表面上的导电电路,并且探针接触件由导电材料制成并形成在绝缘基板的另一个表面上。 导电电路和探针接触电连接在穿过绝缘基板的通孔中。 探针接触包括凸起的凸起接触,凸起接触通过电镀形成,并且具有与目标部分接触的具有半球形突起的形状的表面。 凸点接触由含有金属和碳的材料制成,碳含量在0.2at%至1.2at%之间的范围内。
    • 9. 发明授权
    • Polycrystalline contacting component and test tool having the contacting component
    • 具有接触组分的多晶接触组分和测试工具
    • US07482824B2
    • 2009-01-27
    • US11860169
    • 2007-09-24
    • Osamu Sugihara
    • Osamu Sugihara
    • G01R31/02
    • G01R3/00G01R1/0735H05K1/09H05K3/4007H05K3/423H05K2201/0323H05K2201/0367H05K2203/0733Y10T29/49204
    • A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact is made of a conductive material and formed on the other surface of the insulating substrate. The conductive circuit and the probe contact are electrically connected in a through hole penetrating the insulating substrate. The probe contact includes a bump contact of a convex shape, the bump contact is formed by plating and having a surface which has a shape of a semispherical protrusion to be contacted with the target portion. The bump contact is made of a material containing a metal and carbon, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive.
    • 接触部件具有由电镀形成的适于与目标部分接触的探针接触。 接触部件包括绝缘基板,形成在绝缘基板的一个表面上的导电电路,并且探针接触件由导电材料制成并形成在绝缘基板的另一个表面上。 导电电路和探针接触电连接在穿过绝缘基板的通孔中。 探针接触包括凸起的凸起接触,凸起接触通过电镀形成,并且具有与目标部分接触的具有半球形突起的形状的表面。 凸点接触由含有金属和碳的材料制成,碳含量在0.2at%至1.2at%之间的范围内。
    • 10. 发明申请
    • CONTACTING COMPONENT, METHOD OF PRODUCING THE SAME, AND TEST TOOL HAVING THE CONTACTING COMPONENT
    • 接触元件及其制造方法以及具有接触元件的测试工具
    • US20080136428A1
    • 2008-06-12
    • US11860169
    • 2007-09-24
    • Osamu Sugihara
    • Osamu Sugihara
    • G01R31/26
    • G01R3/00G01R1/0735H05K1/09H05K3/4007H05K3/423H05K2201/0323H05K2201/0367H05K2203/0733Y10T29/49204
    • A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact is made of a conductive material and formed on the other surface of the insulating substrate. The conductive circuit and the probe contact are electrically connected in a through hole penetrating the insulating substrate. The probe contact includes a bump contact of a convex shape, the bump contact is formed by plating and having a surface which has a shape of a semispherical protrusion to be contacted with the target portion. The bump contact is made of a material containing a metal and carbon, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive.
    • 接触部件具有由电镀形成的适于与目标部分接触的探针接触。 接触部件包括绝缘基板,形成在绝缘基板的一个表面上的导电电路,并且探针接触部由导电材料制成并形成在绝缘基板的另一个表面上。 导电电路和探针接触电连接在穿过绝缘基板的通孔中。 探针接触包括凸起的凸起接触,凸起接触通过电镀形成,并且具有与目标部分接触的具有半球形突起的形状的表面。 凸点接触由含有金属和碳的材料制成,碳含量在0.2at%至1.2at%之间的范围内。