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91. 发明授权

US08943684B2 Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board 有权
标题翻译：用于制造用于印刷电路板的Z定向部件的连续挤压工艺
公开(公告)号：US08943684B2
公开(公告)日：2015-02-03
申请号：US13284084
申请日：2011-10-28
申请人： Keith Bryan Hardin
发明人： Keith Bryan Hardin
IPC分类号： H05K1/02 , H05K1/18 , H05K3/40 , H01G4/33 , H01G4/35
CPC分类号： B29C47/0066 , B28B3/20 , B28B11/16 , B29C47/0004 , B29C47/0035 , B29K2995/0005 , B29K2995/0007 , B29L2031/3425 , H01G4/33 , H01G4/35 , H05K1/0221 , H05K1/0231 , H05K1/0251 , H05K1/0298 , H05K1/184 , H05K3/30 , H05K3/306 , H05K3/4046 , H05K2201/10015 , H05K2201/10053 , H05K2201/10984 , Y10T29/4913 , Y10T29/49135
摘要： A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials in the cross-sectional shape of the Z-directed component to form an extruded object with the plurality of materials arranged relative to each other in their operative positions for the Z-directed component. The extrusion of a first portion of at least one of the materials in the extruded object is staggered relative to the extrusion of a second portion of the at least one of the materials in the extruded object. At least a segment of the extruded object is fired. The fired segment forms the Z-directed component insertable into a mounting hole in a printed circuit board.
摘要翻译：根据一个示例性实施例的用于制造用于插入到印刷电路板的安装孔中的Z定向部件的方法包括同时挤出呈Z形部件的横截面形状的多个材料以形成具有所述多个材料在其用于Z指向部件的操作位置中相对于彼此布置。挤出物体中的至少一种材料的第一部分的挤出相对于挤压物体中的至少一种材料的第二部分的挤出而交错。至少一个挤压物体的一部分被点燃。烧制的段形成可插入到印刷电路板中的安装孔中的Z导向部件。

92. 发明授权

US08821778B2 Method for encapsulating electrical and/or electronic components in a housing 有权
标题翻译：将电气和/或电子部件封装在外壳中的方法
公开(公告)号：US08821778B2
公开(公告)日：2014-09-02
申请号：US12197699
申请日：2008-08-25
申请人： Hilmar Kraus
发明人： Hilmar Kraus
IPC分类号： B29C39/10
CPC分类号： H01L21/565 , B29C39/10 , B29C39/42 , B29L2031/3425 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a method for encapsulating electrical and/or electronic components in a housing, the components being arranged on a printed circuit or a strip conductor in an assembly. Said assembly is positioned in the housing and is encapsulated with a curing, electrically insulating molding compound. The method according to the invention is characterized by encapsulating preferably in a molding chamber at a pressure below atmospheric pressure and by removing the negative pressure after encapsulation and before curing.
摘要翻译：本发明涉及一种用于将电气和/或电子部件封装在壳体中的方法，所述部件布置在组件中的印刷电路或带状导体上。所述组件定位在壳体中并用固化的电绝缘模塑料封装。根据本发明的方法的特征在于优选在低于大气压的压力下封装在模制室中，并且在封装之后和固化前除去负压。

93. 发明授权

US08336588B2 Patch and electronic monitoring device for tire 有权
标题翻译：轮胎补片和电子监控装置
公开(公告)号：US08336588B2
公开(公告)日：2012-12-25
申请号：US12400838
申请日：2009-03-10
申请人： Russell W. Koch
发明人： Russell W. Koch
IPC分类号： B60C5/00 , B60C23/00
CPC分类号： B60C23/0493 , B29C33/0016 , B29C33/14 , B29C39/10 , B29C70/84 , B29D2030/0072 , B29L2031/3425 , B29L2031/3456 , Y10T152/10495 , Y10T152/10882 , Y10T156/10
摘要： A patch and method for mounting an electronic monitoring device to the innerliner of a pneumatic tire is provided wherein the monitoring device is potted directly to an attachment patch. A frame is built on an attachment patch and the electronic monitoring device is disposed inside the frame. An encapsulation material is poured into the frame and cured to encapsulate the monitoring device directly against the patch. The patch may then be connected to the innerliner of a pneumatic tire.
摘要翻译：提供了一种用于将电子监视装置安装到充气轮胎的内衬的贴片和方法，其中监测装置被直接灌封到附着贴片。框架构建在附件上，电子监控装置设置在框架内。将包封材料倒入框架中并固化以将监测装置直接封装在贴片上。然后可以将补片连接到充气轮胎的内衬层。

94. 发明授权

US07838791B2 Metal coating removing apparatus and metal coating removing method 失效
标题翻译：金属涂层去除装置和金属涂层去除方法
公开(公告)号：US07838791B2
公开(公告)日：2010-11-23
申请号：US10557289
申请日：2004-10-29
申请人： Takashi Nagashima , Takao Hisazumi , Hidenori Akiyama , Takao Namihira
发明人： Takashi Nagashima , Takao Hisazumi , Hidenori Akiyama , Takao Namihira
IPC分类号： B23H1/00
CPC分类号： B29B17/02 , B29B2017/0262 , B29K2055/02 , B29K2705/00 , B29K2705/08 , B29K2705/10 , B29L2009/005 , B29L2031/3425 , Y02W30/622
摘要： A metal coating removing apparatus (1) includes a first electrode (13) arranged so as to be opposed to a metal coating (101) as an object to be removed, a second electrode 14 arranged so as to be opposed to the metal coating (101) at a predetermined distance from the first electrode (13), and a pulse power generator (11), for example, that functions as a discharge energy supply portion. The pulse power generator (11) supplies discharge energy between the first electrode (13) and the second electrode (14) so as to allow discharging to occur between the first electrode (13) and the second electrode (14). By allowing discharging to occur between the first electrode (13) and the second electrode (14), the metal coating (101) can be removed.
摘要翻译：金属涂层去除装置（1）包括：第一电极（13），被布置成与要去除的物体的金属涂层（101）相对;第二电极14，被布置成与金属涂层相对（ 101），以及例如用作放电能量供给部的脉冲发生器（11）。脉冲发生器（11）在第一电极（13）和第二电极（14）之间提供放电能量，以便在第一电极（13）和第二电极（14）之间发生放电。通过允许在第一电极（13）和第二电极（14）之间发生放电，可以去除金属涂层（101）。

95. 发明授权

US07811408B2 Metal-clad laminate and method for production thereof 有权
标题翻译：覆金属层压板及其制造方法
公开(公告)号：US07811408B2
公开(公告)日：2010-10-12
申请号：US11718843
申请日：2005-10-27
申请人： Minoru Onodera , Tadao Yoshikawa
发明人： Minoru Onodera , Tadao Yoshikawa
IPC分类号： B32B37/00 , B29C65/00
CPC分类号： B32B37/20 , B29C65/02 , B29C65/18 , B29C66/034 , B29C66/1122 , B29C66/45 , B29C66/73111 , B29C66/7352 , B29C66/742 , B29C66/83221 , B29C66/83413 , B29C66/9141 , B29C66/91421 , B29C66/91645 , B29C66/919 , B29C66/91931 , B29C66/91933 , B29C66/91935 , B29K2101/12 , B29K2105/0079 , B29K2305/00 , B29L2009/003 , B29L2031/3425 , B32B15/08 , B32B38/0036 , B32B2305/55 , B32B2307/734 , B32B2311/00 , H05K1/0313 , H05K3/0011 , H05K3/022 , H05K2201/0141 , H05K2201/068 , H05K2203/1105 , Y10T428/1086 , Y10T428/31678
摘要： A metal-clad laminate excellent in isotropy, appearance, bondability between a TLC polymer film and a metallic sheet, and dimensional stability is provided less costly with a first step of thermally compressing the film with the metallic sheet by passing them through a nipping region between heating rolls, and a second step of heat-treating the resultant metal-clad laminate at a temperature not higher than the melting point of the film, wherein the film has thermal expansion coefficient αL satisfying αL=βT+γ with thickness T, thickness coefficient β and anisotropy coefficient γ of the film; wherein the coefficient β is within the range of −0.08 to −0.01; the coefficient γ is within the range of αM+6≦γ≦αM+10 with thermal expansion coefficient αM of the metallic sheet; and thermal expansion coefficient αT of the film is within αM−2≦αT≦αM+3 with the coefficient αM.
摘要翻译：通过第一步骤，通过使金属片通过它们之间的夹持区域将第一步骤与金属片材热压缩，从而提供了薄膜聚合物膜和金属片材之间的各向同性，外观，粘结性以及尺寸稳定性的金属覆盖层压板，加热辊，在不高于膜熔点的温度下对所得的覆金属层压板进行热处理的第二步骤，其中所述膜的热膨胀系数αL满足αL=＆bgr; T +γ，具有厚度T，厚度系数和各向异性系数γ; 其中系数＆bgr; 在-0.08至-0.01的范围内; 系数γ在金属板的热膨胀系数αM的αM+ 6＆lt; 1lE;γ＆nlE;αM+ 10的范围内; 膜的热膨胀系数αT在αM-2＆lt; nlE;αT＆nlE;αM+ 3之间，系数αM。

96. 发明授权

US07803848B2 Method for selectively separating used fragmented organic materials by means of dense aqueous suspensions 有权
标题翻译：通过致密水性悬浮液选择性分离使用的碎片的有机材料的方法
公开(公告)号：US07803848B2
公开(公告)日：2010-09-28
申请号：US10576256
申请日：2004-10-15
申请人： Hugues De Feraudy , Henri Seinera
发明人： Hugues De Feraudy , Henri Seinera
IPC分类号： C08J11/04
CPC分类号： B03B9/061 , B03B5/442 , B29B17/02 , B29B2017/0203 , B29B2017/0224 , B29B2017/0241 , B29B2017/0244 , B29B2017/0484 , B29K2021/00 , B29K2023/06 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2055/02 , B29K2069/00 , B29K2075/00 , B29K2105/04 , B29K2705/00 , B29K2705/02 , B29K2705/08 , B29K2705/10 , B29K2705/12 , B29L2031/286 , B29L2031/3055 , B29L2031/3061 , B29L2031/3425 , B29L2031/7622 , Y02W30/521 , Y02W30/523 , Y02W30/524 , Y02W30/525 , Y02W30/622 , Y02W30/625
摘要： The invention relates to a method for selectively separating synthetic organic materials such as polymers and/or reinforced or non-reinforced copolymers in the form of wastes, in particular domestic wastes recyclable in order to be reused. Said synthetic organic materials are recuperated from broken used cars and obsolete consumer durable products. The inventive method for selective separation consists in separating materials which have an identical density threshold value and are selected from a dense medium comprising separate liquid fluid suspensions which consist of powdery disperses particles in an aqueous phase and are stabilized with respect to the density threshold value selected in such a way that a selective separation of a determined fraction of the mixture of separable used material is initiated.
摘要翻译：本发明涉及一种用于以废物形式选择性分离合成有机材料如聚合物和/或增强或非增强共聚物的方法，特别是可回收再利用的生活垃圾。所述合成有机材料由破旧的二手车和过时的耐用消费品回收。用于选择性分离的本发明的方法在于分离具有相同密度阈值的材料，并且选自致密介质，其包含分离的液体流体悬浮液，所述分离的液体流体悬浮液由水相中的粉末分散颗粒组成，并且相对于所选择的密度阈值被稳定以这种方式选择性分离所确定的可分离的二手材料混合物的份数。

97. 发明申请

US20090229762A1 MANUFACTURING METHOD OF BOARDS, MOLD-RELEASING SHEET, MANUFACTURING APPARATUS FOR BOARD 失效
标题翻译：板材制造方法，模板剥离板，板材制造设备
公开(公告)号：US20090229762A1
公开(公告)日：2009-09-17
申请号：US12471850
申请日：2009-05-26
申请人： Kunio Kishimoto , Toshiaki Takenaka , Yukihiro Hiraishi
发明人： Kunio Kishimoto , Toshiaki Takenaka , Yukihiro Hiraishi
IPC分类号： B32B37/00
CPC分类号： B29C70/46 , B29L2031/3425 , B32B37/26 , B32B2037/268 , B32B2305/08 , B32B2311/12 , B32B2398/10 , B32B2457/08 , C08J5/24 , H05K3/022 , H05K3/4069 , H05K3/4611 , H05K3/4614 , H05K3/4638 , H05K3/4652 , H05K3/4679 , H05K2201/0355 , H05K2203/0195 , H05K2203/0264 , H05K2203/065 , H05K2203/068 , Y10T29/49126 , Y10T29/49128 , Y10T156/16 , Y10T156/1712 , Y10T428/31
摘要： A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches (4a) and (4b) disposed above and under pressuring holes (24) provided on positioning stage (6) which positions and laminates board materials. The apparatus also includes a supplying and discharging means of a mold-releasing sheet, and the means is formed of supply reel (22), take-up reel (23), and guide rolls (25a) and (25b). The sheet is supplied and discharged passing between heater-punches (4a) placed above pressuring holes (24) and heater-punches (4b) placed under pressuring holes (24).
摘要翻译：提供了一种高可靠性高的制造方法和制造装置。制造装置包括设置在定位台（6）上的加压孔（24）的上方和下方的加热器冲头（4a）和（4b），定位台（6）上定位和层压板材。该装置还包括一个脱模片的供给和排出装置，该装置由供给卷轴（22），卷取卷轴（23）和导向辊（25a）和（25b）构成。通过设置在加压孔（24）之间的加热器冲头（4a）和放置在加压孔（24）下面的加热器冲头（4b）之间的片材供给和排出。

98. 发明申请

US20080070016A1 Polyimide composite flexible board and its preparation 审中-公开
标题翻译：聚酰亚胺复合柔性板及其制备
公开(公告)号：US20080070016A1
公开(公告)日：2008-03-20
申请号：US11657096
申请日：2007-01-24
申请人： Kuen Yuan Hwang , An Pang Tu , Sheng Yen Wu , Te Yu Lin
发明人： Kuen Yuan Hwang , An Pang Tu , Sheng Yen Wu , Te Yu Lin
IPC分类号： B32B15/08 , B05D3/02 , B32B37/00 , B29C65/00
CPC分类号： B32B15/08 , B29C65/02 , B29C65/18 , B29C66/001 , B29C66/00141 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/72321 , B29C66/73118 , B29C66/742 , B29C66/83413 , B29K2079/08 , B29K2305/10 , B29L2009/003 , B29L2031/3425 , B32B37/20 , B32B2311/00 , B32B2379/08 , B32B2457/08 , C08G73/1007 , C08J5/121 , H05K1/0346 , H05K1/036 , H05K1/0393 , H05K2201/0154 , Y10T428/2495 , Y10T428/264 , Y10T428/31681 , Y10T428/31721
摘要： The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids individually having a glass transition temperature of from 280 to 330° C. and from 190 to 280° C. after imidization on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, and then pressing the polyimide-containing metal foil with each other or with another metal foil under high temperature to produce a two-metal-side printed circuit flexible board.According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability without using an adhering agent.
摘要翻译：本发明涉及一种聚酰亚胺复合柔性板及其制备方法。该方法包括在酰亚胺化后在金属箔上依次施加玻璃化转变温度为280-330℃和190-280℃的聚酰胺酸，随后通过加热将聚酰胺酸酰亚胺化成聚酰亚胺，然后在高温下将含聚酰亚胺的金属箔彼此压制或与另一种金属箔压制以制造双金属侧印刷电路柔性板。根据本发明，可以获得具有优异的机械性能，高耐热性和优异的尺寸稳定性的聚酰亚胺复合柔性板，而不使用粘合剂。

99. 发明申请

US20070164475A1 Molding construction and a molding method for a resin-molded product 失效
标题翻译：树脂成形品的成型方法和成型方法
公开(公告)号：US20070164475A1
公开(公告)日：2007-07-19
申请号：US11652445
申请日：2007-01-11
申请人： Shinyu Nagashima , Akihito Maegawa
发明人： Shinyu Nagashima , Akihito Maegawa
IPC分类号： B29C45/14
CPC分类号： H01R43/18 , B29C45/0046 , B29C45/14418 , B29C45/14639 , B29C2045/14934 , B29L2031/3406 , B29L2031/3425
摘要： A connector (20) is placed in a first die (50) so that an end of a wall (41) of the connector (20) closely contacts a recess (55) of the first die (50) to define a cutoff (58). The dies then are closed to define a filling space (60C) between a surface (62) of a second die (51) and an outer surface (46) of the wall (41). The outer surface (46) of the wall (41) is inclined moderately upward. Molten resin is directed into the filling space (60C) and presses the inclined outer surface (46) of the wall (41) so that an inner surface (47) of the bottom wall (41) is pressed against the recess (55) of the first die (50) and strongly held in close contact by a component of this pressing force. Thus, molten resin cannot intrude through the cutoff (58).
摘要翻译：连接器（20）被放置在第一模具（50）中，使得连接器（20）的壁（41）的端部紧密地接触第一模具（50）的凹部（55），以限定切口（58 ）。然后关闭模具以在第二模具（51）的表面（62）和壁（41）的外表面（46）之间限定填充空间（60℃）。壁（41）的外表面（46）适度向上倾斜。熔融树脂被引导到填充空间（60C）中并压迫壁（41）的倾斜外表面（46），使得底壁（41）的内表面（47）被压靠在凹部（55）上，的第一模具（50），并且通过该按压力的一个部件牢固地保持紧密接触。因此，熔融树脂不能通过截止（58）侵入。

100. 发明申请

US20060076104A1 Film peeling apparatus and method of manufacturing wiring board 审中-公开
标题翻译：薄膜剥离装置及其制造方法
公开(公告)号：US20060076104A1
公开(公告)日：2006-04-13
申请号：US11226232
申请日：2005-09-15
申请人： Masashi Inaishi
发明人： Masashi Inaishi
IPC分类号： B65H41/00
CPC分类号： B29C63/0013 , B29L2031/3425 , B32B38/10 , B32B43/006 , B32B2457/08 , H05K3/4673 , H05K2203/0221 , H05K2203/0264 , H05K2203/066
摘要： A film peeling apparatus including a board support section 41, a hole forming jig 51, a punch unit 21, and a film peeling mechanism. The board support section 41 supports a board 15 to which an inter-layer insulating film and carrier film has been bonded, the carrier film being arranged on a side of the insulating material opposite the board. The hole forming jig 51 has needles 57 serving as a tip-sharpened member. The needles 57 pierce a peripheral portion of the carrier film so as to form through holes. The punch unit 21 drives the hole forming jig 51 so as to piercing the carrier film by use of the needles 57. The film peeling mechanism peels off the carrier film, starting from air pockets formed around the through holes. Also disclosed is a method of manufacturing a wiring board having an insulating layer, which includes a step of peeling a carrier film from a board to which the insulating material and carrier film has been bonded.
摘要翻译：一种膜剥离装置，包括板支撑部分41，孔形成夹具51，冲头单元21和膜剥离机构。板支撑部分41支撑已经结合了层间绝缘膜和载体膜的板15，载体膜布置在与板相对的绝缘材料的一侧。孔形成用夹具51具有用作尖锐部件的针57。针57刺穿载体膜的周边部分以形成通孔。打孔单元21驱动孔形成夹具51，以便通过针57刺穿载体膜。膜剥离机构从形成在通孔周围的气穴开始剥离载体膜。还公开了一种制造具有绝缘层的布线板的方法，其包括从绝缘材料和载体膜已经结合的基板上剥离载体膜的步骤。

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