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91. 发明授权

US06547655B1 Flame-resistant buffing wheel and method 失效
标题翻译：耐火抛光轮及方法
公开(公告)号：US06547655B1
公开(公告)日：2003-04-15
申请号：US09896639
申请日：2001-06-29
申请人： J. Allen Schaffner
发明人： J. Allen Schaffner
IPC分类号： B24B902
CPC分类号： B24D11/001 , B24D13/147
摘要： A flame-resistant buffing wheel and a method of making thereof. The buffing wheel is comprised of a buffing material which has been treated with an aqueous flame-retardant solution, and allowed to dry. The treatment may take place either before or after the buffing wheel is assembled.
摘要翻译：一种阻燃抛光轮及其制造方法。抛光轮由抛光材料组成，该抛光材料已用含水阻燃溶液处理，并使其干燥。处理可能在组装抛光轮之前或之后进行。

92. 发明授权

US06544306B2 Abrasive product and method of making the same 有权
公开(公告)号：US06544306B2
公开(公告)日：2003-04-08
申请号：US10008097
申请日：2001-11-13
申请人： Kazuo Suzuki , Fujio Hara
发明人： Kazuo Suzuki , Fujio Hara
IPC分类号： B24D1100
CPC分类号： B24D3/001 , B24D11/001 , B24D18/0018
摘要： The invention provides an abrasive product having a sheet-like backing including a plurality of concavoconvex portions, the backing also having a first major surface including convex portions and an opposite second major surface including concave portions opposite said convex portions. A coating of a binder is applied over the first major surface and the convex portions. A single layer of a plurality of substantially erectly oriented abrasive particles is bonded to the backing by the binder coating. The abrasive product is made by providing the backing as defined, coating the first major surface with an uncured composition which will cure to provide the binder, applying abrasive particles to the uncured composition coating with an electrostatic sprayer and curing the uncured composition to provide the binder coating.

93. 发明申请

US20030032287A1 Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool 失效
标题翻译：固定磨料基材的制备方法和装置，并用于集束CMP工具
公开(公告)号：US20030032287A1
公开(公告)日：2003-02-13
申请号：US10254810
申请日：2002-09-25
申请人： Lam Research Corporation
发明人： John M. Boyd , Michael S. Lacy
IPC分类号： H01L021/302 , H01L021/461
CPC分类号： B24D11/001 , B24B7/228
摘要： An apparatus enabling preparation and use of a fixed abrasive polishing member is described. The apparatus includes a patterned three-dimensional substrate, an abrasive coating a surface of the patterned substrate and a vacuum deposition chamber in which the abrasive is applied to the surface of the substrate. In addition, rather than a fixed abrasive, non-abrasive material may be applied to the surface of the patterned substrate, in which case, a conventional slurry may be used in planarization of an applied semiconductor wafer.
摘要翻译：描述了能够准备和使用固定研磨抛光构件的装置。该设备包括图案化三维基板，磨料涂层图案化基板的表面和真空沉积室，其中研磨剂施加到基板的表面。此外，可以将非研磨材料施加到图案化衬底的表面上，而不是固定的研磨剂，在这种情况下，常规的浆料可用于所施加的半导体晶片的平坦化。

94. 发明授权

US06475253B2 Abrasive article and method of making 有权
标题翻译：磨料制品及其制作方法
公开(公告)号：US06475253B2
公开(公告)日：2002-11-05
申请号：US09242989
申请日：1999-02-26
申请人： Scott R. Culler , John J. Gagliardi , Thomas W. Larkey , Eric G. Larson , Larry L. Martin , Jeffrey W. Nelson
发明人： Scott R. Culler , John J. Gagliardi , Thomas W. Larkey , Eric G. Larson , Larry L. Martin , Jeffrey W. Nelson
IPC分类号： B24D334
CPC分类号： B24D3/28 , B24D11/001 , B24D18/0009 , Y10T428/25 , Y10T428/252 , Y10T428/256 , Y10T428/257 , Y10T428/259
摘要： This invention pertains to a coated, bonded or non-woven abrasive article containing precisely shaped particles and a binder. These precisely shaped particles can contain abrasive grits, fillers, grinding aids and lubricants. The binder is preferably a mixture of a resole phenolic resin and a free radical curable resin, resulting in improved cutting and life span. Also disclosed is a method of forming the coated, bonded or non-woven abrasive article.
摘要翻译：本发明涉及包含精确成形的颗粒和粘合剂的涂布的，粘合的或非织造的磨料制品。这些精确成形的颗粒可以含有磨料砂粒，填料，助磨剂和润滑剂。粘合剂优选为甲阶酚醛树脂和可自由基固化树脂的混合物，从而改善了切割和使用寿命。还公开了一种形成涂覆的，粘合的或非织造的磨料制品的方法。

95. 发明授权

US06428586B1 Method of manufacturing a polymer or polymer/composite polishing pad 有权
标题翻译：制造聚合物或聚合物/复合抛光垫的方法
公开(公告)号：US06428586B1
公开(公告)日：2002-08-06
申请号：US09734089
申请日：2000-12-11
申请人： Paul J. Yancey
发明人： Paul J. Yancey
IPC分类号： B32
CPC分类号： B24B37/205 , B24D3/28 , B24D11/001 , B24D18/009 , Y10T428/249971 , Y10T428/249972 , Y10T428/249974 , Y10T428/249976 , Y10T428/249981 , Y10T428/249986
摘要： Manufacture of a polishing pad for polishing a semiconductor substrate, involves, transporting a backing layer to successive manufacturing stations, supplying a fluid phase polymer composition onto the transported backing layer, shaping the fluid phase polymer composition into a surface layer having a measured thickness, and curing the polymer composition on the transported backing layer in a curing oven to convert the liquid phase polymer composition to a solid phase polishing layer attached to the transported backing layer.
摘要翻译：用于抛光半导体衬底的抛光垫的制造涉及将背衬层输送到连续的制造站，将流体相聚合物组合物供应到所输送的背衬层上，将流体相聚合物组合物成形为具有测量厚度的表面层，以及在固化烘箱中固化所输送的背衬层上的聚合物组合物，以将液相聚合物组合物转化成附着于运输背衬层的固相抛光层。

96. 发明申请

US20020069591A1 Method of manufacturing a polymer or polymer/composite polishing pad 有权
公开(公告)号：US20020069591A1
公开(公告)日：2002-06-13
申请号：US09734089
申请日：2000-12-11
发明人： Paul J. Yancey
IPC分类号： B24D011/00
CPC分类号： B24B37/205 , B24D3/28 , B24D11/001 , B24D18/009 , Y10T428/249971 , Y10T428/249972 , Y10T428/249974 , Y10T428/249976 , Y10T428/249981 , Y10T428/249986
摘要： Manufacture of a polishing pad for polishing a semiconductor substrate, involves, transporting a backing layer to successive manufacturing stations, supplying a fluid phase polymer composition onto the transported backing layer, shaping the fluid phase polymer composition into a surface layer having a measured thickness, and curing the polymer composition on the transported backing layer in a curing oven to convert the liquid phase polymer composition to a solid phase polishing layer attached to the transported backing layer.

97. 发明申请

US20020068513A1 Unsupported chemical mechanical polishing belt 失效
公开(公告)号：US20020068513A1
公开(公告)日：2002-06-06
申请号：US10036624
申请日：2001-11-09
申请人： Lam Research Corporation
发明人： Cangshan Xu , Brian S. Lombardo
IPC分类号： B24B001/00
CPC分类号： B24B37/205 , B24B37/26 , B24D11/001 , B24D18/0009
摘要： A belt for polishing a workpiece such as a semiconductor wafer in a chemical mechanical polishing system includes a polymeric layer forming an endless loop and having a polishing surface on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.

98. 发明授权

US06383064B1 Flexible abrasive body 有权
标题翻译：柔性研磨体
公开(公告)号：US06383064B1
公开(公告)日：2002-05-07
申请号：US09468350
申请日：1999-12-21
申请人： Martin Eggert , Bettina Weiss
发明人： Martin Eggert , Bettina Weiss
IPC分类号： B24D1100
CPC分类号： B24D11/02 , B24D3/06 , B24D11/001 , B24D18/0018
摘要： The invention relates to a flexible abrasive body having a pliable support which exhibits one layer made from a pliable substrate on one side of which there is a full-coverage first metal coating and on this a second metal coating in which the abrasive material is at least partly embedded. In order to obtain an abrasive body of this kind with high thermal conductance, excellent flexibility, high dimensional stability and compactness, the support 9 consisting of substrate 2 and first metal coating 10 exhibits a constant thickness and the first metal coating 10 exhibits a flat, smooth surface and minimized coating thickness. The second metal coating 14 and also the first metal coating 10 are preferably provided with breaking points 18.
摘要翻译：本发明涉及一种柔性研磨体，其具有柔韧的支撑体，其具有由柔性基底制成的一层，其一侧具有全覆盖的第一金属涂层，并且在该第二金属涂层上，研磨材料至少为部分嵌入。为了获得具有高导热性，优异的柔韧性，高尺寸稳定性和紧凑性的这种研磨体，由基材2和第一金属涂层10组成的载体9呈现恒定的厚度，第一金属涂层10呈现平坦的，光滑的表面和最小化的涂层厚度。第二金属涂层14以及第一金属涂层10优选设置有断点18。

99. 发明授权

US06371832B1 Particulate bonding process and products made according to the process 失效
标题翻译：颗粒粘接工艺和产品根据工艺制成
公开(公告)号：US06371832B1
公开(公告)日：2002-04-16
申请号：US09669809
申请日：2000-09-20
申请人： Roger C. Raguse
发明人： Roger C. Raguse
IPC分类号： B24B100
CPC分类号： B24D18/0072 , B24D3/28 , B24D11/001 , B24D11/02
摘要： An environmentally-safe heat-reactive curable melt adhesive in fine crystalline powder form is mixed with any of a large variety of compatible particulate materials and heated to a predetermined temperature for a predetermined time during which the powder liquifies and cross links. The preliminary mixture can be accomplished by gentle tumbling, and in the process, the powder crystals cling to the particles. Upon subsequent cooling, the powder adhesive cross link bonds the particles to each other and/or to each other and to a supporting member or surface. Application of pressure at the time of heating is particularly useful where the end product has some thickness. A grinding wheel can be made by sifting the dry mixture through a soft non-woven pad until its interstices are essentially filled. The pad is then placed under pressure during the heating process.
摘要翻译：将具有细晶形粉末形式的环境安全的热反应性可固化熔融粘合剂与各种相容的颗粒材料中的任何一种混合并加热到预定温度一段预定时间，在此期间粉末液化和交联。初步混合物可以通过轻轻滚动来完成，在此过程中，粉末晶体粘附到颗粒上。随后冷却时，粉末粘合剂交联部件将颗粒彼此和/或彼此粘合到支撑构件或表面。在最终产品具有一定厚度的情况下，在加热时的压力的施加是特别有用的。可以通过将干燥混合物通过柔软的无纺布垫筛，直到其空隙基本上被填充而制成砂轮。然后在加热过程中将垫放置在压力下。

100. 发明申请

US20020028646A1 Chemical mechanical planarization or polishing pad with sections having varied groove patterns 失效
标题翻译：化学机械平面化或抛光垫，具有不同凹槽图案的部分
公开(公告)号：US20020028646A1
公开(公告)日：2002-03-07
申请号：US09905332
申请日：2001-07-13
申请人： Lam Research Corporation.
发明人： Alan J. Jensen , Brian S. Thornton
IPC分类号： B24D011/00
CPC分类号： B24B37/26 , B24B21/04 , B24D11/001 , B24D11/04
摘要： A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.
摘要翻译： CMP抛光垫通过以串联方式组合多个抛光垫部分来提高整体材料去除速率均匀性，其中抛光垫部分的特征在于至少两种不同的材料去除速率曲线。抛光垫的设计是通过确定一组抛光垫中的每一个的晶片抛光轮廓来设计的，其中每个抛光垫具有唯一的凹槽构造，确定抛光垫片段的组合，每个片段由独特的凹槽配置之一构成，这将结合以实现抛光轮廓的改进的均匀性，以及制造具有对应于分析确定的垫部分的衬垫部分的抛光垫。

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