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91. 发明授权

US06991520B2 Abrasive machine and method of abrading work piece 有权
公开(公告)号：US06991520B2
公开(公告)日：2006-01-31
申请号：US10303156
申请日：2002-11-22
申请人： Toshiroh Doy
发明人： Toshiroh Doy
IPC分类号： B24B1/00
CPC分类号： B24B37/042 , B24B37/04 , B24B41/047
摘要： The abrasive machine of the present invention is capable of changing pressure applied to a work piece and easily defining optimum abrading conditions. The abrasive machine comprises: a pressure vessel capable of increasing and reducing inner pressure; an abrasive plate provided in the pressure vessel; a pressing plate provided on the abrasive plate, the pressing plate pressing the work piece onto the abrasive plate; a driving unit relatively moving the abrasive plate with respect to the pressing plate so as to abrade the work piece; and a pressure source connected to the pressure vessel, the pressure source increasing or reducing the inner pressure of the pressure vessel.

92. 发明申请

US20050260938A1 Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer 审中-公开
标题翻译：晶片抛光装置的表，半导体晶片的研磨方法以及半导体晶片的制造方法
公开(公告)号：US20050260938A1
公开(公告)日：2005-11-24
申请号：US11192846
申请日：2005-07-28
申请人： Yuji Okuda , Naoyuki Jimbo , Kazutaka Majima , Masahiro Tsuji , Hideki Takagi , Shigeharu Ishikawa , Hiroyuki Yasuda
发明人： Yuji Okuda , Naoyuki Jimbo , Kazutaka Majima , Masahiro Tsuji , Hideki Takagi , Shigeharu Ishikawa , Hiroyuki Yasuda
IPC分类号： B24B1/00 , B24B37/015 , B24B37/12 , B24B37/14 , B24B37/16 , B24B41/047 , B24B49/14
CPC分类号： B24B55/02 , B24B37/015 , B24B37/12 , B24B37/14 , B24B37/16 , B24B41/047
摘要： A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table includes a plurality of superimposed bases each of which is formed of silicide ceramic or carbide ceramic. The bases are joined together by an adhesive layer. A fluid passage is formed in a joining interface between the bases.
摘要翻译：一种用于晶片抛光装置的桌子，其具有优异的耐热，抗热冲击和抗磨损特性，并且能够在提高晶片的质量的同时增加半导体晶片的直径。该表包括多个叠加的基底，每个基底由硅化物陶瓷或碳化物陶瓷形成。基底通过粘合剂层连接在一起。在基座之间的接合界面中形成流体通道。

93. 发明申请

US20050164615A1 Bearing arrangement for vibrationally mounting a grinding disk in a grinder 失效
标题翻译：用于将研磨盘振动地安装在研磨机中的轴承装置
公开(公告)号：US20050164615A1
公开(公告)日：2005-07-28
申请号：US10516585
申请日：2003-07-11
申请人： Justus Lamprecht , Tobias Lutz , Christoph Cramer
发明人： Justus Lamprecht , Tobias Lutz , Christoph Cramer
IPC分类号： B24B23/04 , B24B41/047 , B24B23/00
CPC分类号： B24B41/047 , B24B23/04
摘要： The invention is based on a bearing arrangement for vibratingly supporting a grinding disk (24) on a grinding apparatus (10), in particular in a vibrating grinder, having a plurality of elastic vibration bodies (48), which can be connected on the one hand to the grinding disk (24) and on the other to the grinding apparatus (10). It is proposed that the vibration bodies (48) are disposed, individually or in groups of a plurality of vibration bodies (48) each, in a plurality of modules (42) that are separate from one another.
摘要翻译：本发明基于一种用于在研磨装置（10）上振动地支撑研磨盘（24）的轴承装置，特别是在具有多个弹性振动体（48）的振动研磨机中，该研磨装置可以连接在该研磨装置手到研磨盘（24），另一个送到研磨装置（10）。提出在彼此分离的多个模块（42）中分别或多个振动体（48）分别设置振动体（48）。

94. 发明申请

US20050164614A1 Sanding machine 失效
标题翻译：砂光机
公开(公告)号：US20050164614A1
公开(公告)日：2005-07-28
申请号：US10511330
申请日：2003-04-29
申请人： Eligio Bau , Nevio Zanuso
发明人： Eligio Bau , Nevio Zanuso
IPC分类号： B24B7/06 , B24B7/28 , B24B41/047 , B24B21/00
CPC分类号： B24B41/047 , B24B7/06 , B24B7/28
摘要： A sanding machine (1; 300) comprising a support structure (2; 302) for the piece (3) to be processed and a sanding unit (4) for the piece (3) itself. The sanding unit (4) comprises a frame (40) that supports a winding element (8) cooperating with kinematic means (9) suitable for setting it in motion according to a closed ring configuration on a plane (π1) substantially parallel to the plane (π2) defined by the support structure (2; 302) and a plurality of abrasive elements (10) combined with the winding element (8) spaced from one another and provided with an abrasive surface (16; 416) that comes in contact with the piece (3) during the movement of the winding element (8).
摘要翻译：一种砂光机（1; 300），包括用于待处理的片（3）的支撑结构（2; 302）和用于片（3）本身的打磨单元（4）。打磨单元（4）包括框架（40），其支撑与运动装置（9）配合的缠绕元件（8），该运动装置适合于根据基本平行于由所述支撑结构（2; 302）限定的平面（pi 2）和与所述绕组元件（8）组合的多个研磨元件（10）彼此间隔开并设置有进入的研磨表面（16; 416）在绕组元件（8）移动期间与片（3）接触。

95. 发明申请

US20050130570A1 Continuous through-feed grinding machine for machining a workpiece surface and method 审中-公开
标题翻译：连续进给磨床用于加工工件表面和方法
公开(公告)号：US20050130570A1
公开(公告)日：2005-06-16
申请号：US11007908
申请日：2004-12-09
申请人： Friedrich von Schumann
发明人： Friedrich von Schumann
IPC分类号： B24B7/06 , B24B7/28 , B24B27/00 , B24B29/00 , B24B41/047 , B24D13/04 , B24B49/00
CPC分类号： B24D13/04 , B24B7/06 , B24B7/28 , B24B27/0076 , B24B29/005 , B24B41/047
摘要： The subject matter of the invention is a continuous through-feed grinding machine for machining a workpiece surface, said grinding machine having a grinding station with at least two rotating grinding tools, more specifically disc or roll grinders, with the grinding tools being continuously advanced along an endless path. The objective of providing a continuous through-feed grinding machine allowing for even machining of the workpiece surface with even wear of the grinding tools is accomplished by providing the endless path (128) with two work segments (140, 142) alternating with two transfer segments (144, 146) or by continuously advancing grinding tools that are moved along an endless path configured as an oval or elliptical shape.
摘要翻译：本发明的主题是用于加工工件表面的连续通过进给研磨机，所述研磨机具有研磨站，该研磨站具有至少两个旋转研磨工具，更具体地是圆盘或辊式研磨机，其中研磨工具沿着无尽的道路。提供连续通过进给研磨机的目的是通过提供具有两个工件段（140,142）的两个工作段（140,142）与两个传送段（144,146），或者通过连续推进沿着构造为椭圆形或椭圆形的环形路径移动的研磨工具。

96. 发明授权

US06869350B2 Polishing pads and methods relating thereto 有权
标题翻译：抛光垫及其相关方法
公开(公告)号：US06869350B2
公开(公告)日：2005-03-22
申请号：US10659889
申请日：2003-09-11
申请人： John H. V. Roberts , David B. James , Lee Melbourne Cook
发明人： John H. V. Roberts , David B. James , Lee Melbourne Cook
IPC分类号： B24B37/26 , B24B41/047 , B24D3/26 , B24D3/28 , B24D13/14 , B24B1/00
CPC分类号： B24D3/28 , B24B37/26 , B24B41/047 , B24D3/26
摘要： This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
摘要翻译：本发明描述了可用于制造半导体器件等的改进的抛光垫。本发明的垫具有有利的亲水性抛光材料，并且具有创新的表面形貌和纹理，其通常改善了可预测性和抛光性能。

97. 发明申请

US20050054279A1 Floor resurfacing disks for rotary floor resurfacing machines 失效
标题翻译：用于旋转地板重铺机的地板重铺盘
公开(公告)号：US20050054279A1
公开(公告)日：2005-03-10
申请号：US10655902
申请日：2003-09-05
申请人： Todd Jordan
发明人： Todd Jordan
IPC分类号： B24B7/18 , B24B41/047 , B24B23/00
CPC分类号： B24B7/186 , B24B41/047
摘要： A resurfacing disk which mounts to a rotatable disk mount of a conventional rotary floor resurfacing machine. The resurfacing disk includes a rigid upper disk with four counterbored holes through an upper surface corresponding to four downwardly open holes of each disk mount. A resilient, flanged grommet is retained extending through corresponding holes of a retaining plate mounted to the upper surface. The grommets include respective vertically oriented longitudinal bores closely receive a mounting pin which extends from a corresponding hole of the disk mount. A plurality of rotary cutters each include a bracket which mounts to the upper disk opposite the grommets and an externally toothed cutter rotatably mounted thereto. The rotatable toothed cutters are oriented radially outwardly of the resurfacing disk so as to rotate while engaging the floor as the resurfacing disk spins with the disk mount. A resiliently deformable lower disk may be mounted in place of the rotary cutters and a sandpaper disk is removably affixed thereto using sheets interconnectable hook and a loop fastener material. The grommets and the lower disk deform to permit the floor resurfacing device to more closely follow contours of the floor surface and are easily replaceable if damaged or worn out.
摘要翻译：一种重新铺绕的盘，其安装到常规的旋转地板表面重铺机的可旋转盘安装件上。表面盘包括刚性上盘，其具有通过上表面的四个沉孔，其对应于每个盘安装座的四个向下开孔。弹性法兰的索环被保持延伸穿过安装到上表面的保持板的相应孔。索环包括相应的垂直取向的纵向孔紧密地接收从盘安装件的相应孔延伸的安装销。多个旋转切割器各自包括安装到与盘孔相对的上盘的托架和可旋转地安装在其上的外齿刀。可旋转的有齿切割器被定向在表面覆盖盘的径向外侧，以便当表面刷盘与盘安装件旋转时，可以同时接合地板而转动。可以安装可弹性变形的下盘代替旋转切割器，并且砂纸盘可拆卸地固定到其上，使用片材可互连钩和环紧固件材料。垫圈和下盘变形，以允许地板重铺装置更紧密地跟随地板表面的轮廓，并且如果损坏或磨损就容易更换。

98. 发明授权

US06682402B1 Polishing pads and methods relating thereto 有权
标题翻译：抛光垫及其相关方法
公开(公告)号：US06682402B1
公开(公告)日：2004-01-27
申请号：US09711008
申请日：2000-11-10
申请人： John H. V Roberts , David B. James , Lee Melbourne Cook
发明人： John H. V Roberts , David B. James , Lee Melbourne Cook
IPC分类号： B24B100
CPC分类号： B24D3/28 , B24B37/26 , B24B41/047 , B24D3/26
摘要： This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrofoil polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
摘要翻译：本发明描述了可用于制造半导体器件等的改进的抛光垫。本发明的垫具有有利的水翼抛光材料，并且具有创新的表面形貌和纹理，其通常改善了可预测性和抛光性能。

99. 发明授权

US06616517B2 Wood floor sanding machine 有权
公开(公告)号：US06616517B2
公开(公告)日：2003-09-09
申请号：US09935070
申请日：2001-08-22
申请人： Simon Palushi
发明人： Simon Palushi
IPC分类号： B24B2300
CPC分类号： B24B7/186 , B24B41/047
摘要： A power sanding machine (10) has three circumferentially spaced cogged belts (40) that are under tension via bearings (36) to drive three discs (52). A grounded vacuum (16) with a metal canister (74) is mounted on the operating handle (14). An attachment has sanding rollers (85) that freewheel as the sander is operated.

100. 发明申请

US20030104766A1 Abrasive machine and method of abrading work piece 有权
标题翻译：研磨机和研磨工件的方法
公开(公告)号：US20030104766A1
公开(公告)日：2003-06-05
申请号：US10303156
申请日：2002-11-22
申请人： Toshiroh Doy
发明人： Toshiroh Doy
IPC分类号： B24B001/00
CPC分类号： B24B37/042 , B24B37/04 , B24B41/047
摘要： The abrasive machine of the present invention is capable of changing pressure applied to a work piece and easily defining optimum abrading conditions. The abrasive machine comprises: a pressure vessel capable of increasing and reducing inner pressure; an abrasive plate provided in the pressure vessel; a pressing plate provided on the abrasive plate, the pressing plate pressing the work piece onto the abrasive plate; a driving unit relatively moving the abrasive plate with respect to the pressing plate so as to abrade the work piece; and a pressure source connected to the pressure vessel, the pressure source increasing or reducing the inner pressure of the pressure vessel.
摘要翻译：本发明的研磨机能够改变施加到工件上的压力，并且能够容易地确定最佳研磨条件。研磨机包括：能够增加和降低内部压力的压力容器; 设置在压力容器内的研磨板; 设置在所述研磨板上的压板，所述压板将所述工件压在所述研磨板上; 驱动单元，相对于所述压板相对地移动所述研磨板，以便研磨所述工件; 以及连接到压力容器的压力源，压力源增加或降低压力容器的内部压力。

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