专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明申请

US20070032177A1 Wafer processing apparatus and wafer processing method using the same 审中-公开
标题翻译：晶圆加工装置及使用其的晶片加工方法
公开(公告)号：US20070032177A1
公开(公告)日：2007-02-08
申请号：US11397853
申请日：2006-04-05
申请人： Soon-Jong Park
发明人： Soon-Jong Park
IPC分类号： B24B1/00
CPC分类号： B24B7/228 , B24B41/047 , B24D7/14
摘要： A wafer processing apparatus and a wafer processing method using the same are provided. A grinding wheel may include a wheel body having a plurality of wheel blades to remove a backside of a wafer, each of the plurality of wheel blades in an annular array with respect to each other and configured to move individually. A method of processing a wafer may include preparing a wafer for a backside processing, a first processing the backside of the wafer using a first wheel blade or a second wheel blade, and a second processing the backside of the wafer using only the second wheel blade.
摘要翻译：提供了一种晶片处理装置和使用其的晶片处理方法。砂轮可以包括具有多个轮叶片以移除晶片背面的轮体，所述多个轮叶片中的每一个相对于彼此呈环形阵列并且被配置为单独移动。处理晶片的方法可以包括准备用于背面处理的晶片，使用第一轮叶片或第二轮叶片对晶片的背面进行第一处理，以及仅使用第二轮叶片对晶片的背面进行第二处理。

92. 发明申请

US20060199483A1 Grinding head 审中-公开
标题翻译：磨头
公开(公告)号：US20060199483A1
公开(公告)日：2006-09-07
申请号：US10552566
申请日：2004-03-16
申请人： Ranko Effenberger
发明人： Ranko Effenberger
IPC分类号： B24B23/00
CPC分类号： B24B41/047
摘要： The aim of the invention is to provide a simply structured grinding head which is characterized in that the speed of the individual grinding wheels (36) substantially exceeds that of the discoid base (3) carrying them and which can be combined with grinding attachments of a different type, even with grinding attachments of already known types. This aim is attained with the provision of the grinding head of the aforementioned type in that the grinding head is configured from three structural components that can be detached from one another, namely a drive element (1) mounted in a housing, a transmission element (2) and a discoid base (3). The transmission element (2) comprises a center body (15) for coaxially receiving the connection piece (9) so that it can be rotated. The strongly reducing bearing section (18) is disposed radially outside the center body (15) and is fixated on the housing (4) and its strongly reducing part (20) is connected to the radially inner disk body (30) of the discoid base (24) so as to transmit the rotational movement. The disc body (30) is received on a hub (28) so as to be rotated, said hub engaging with a seat (25) of the transmission element (2) in a form fit. A center driver plate (32) is non-rotationally disposed on the hub (28) to drive the grinding wheels.
摘要翻译：本发明的目的是提供一种简单结构化的研磨头，其特征在于，单个磨轮（36）的速度基本上超过承载它们的盘状基座（3）的速度，并且可以与磨削附件不同类型，即使具有已知类型的磨削附件。该目的是通过提供上述类型的研磨头来实现的，因为研磨头由可以彼此分离的三个结构部件构成，即安装在壳体中的驱动元件（1），传动元件（ 2）和圆盘状基部（3）。传动元件（2）包括用于同轴地接收连接件（9）的中心体（15），使得其能够旋转。强降低轴承部分（18）径向设置在中心体（15）的外侧，并被固定在壳体（4）上，并且其强力还原部分（20）连接到圆盘状基体的径向内盘体（30）（24），以便传递旋转运动。盘体（30）被接收在轮毂（28）上以便旋转，所述轮毂与配合的形式的传动元件（2）的座（25）啮合。中心驱动器板（32）非旋转地设置在轮毂（28）上以驱动砂轮。

93. 发明授权

US07040963B1 Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer 有权
标题翻译：晶片抛光装置的表，半导体晶片的研磨方法以及半导体晶片的制造方法
公开(公告)号：US07040963B1
公开(公告)日：2006-05-09
申请号：US10018708
申请日：2000-06-15
申请人： Yuji Okuda , Naoyuki Jimbo , Kazutaka Majima , Masahiro Tsuji , Hideki Takagi , Shigeharu Ishikawa , Hiroyuki Yasuda
发明人： Yuji Okuda , Naoyuki Jimbo , Kazutaka Majima , Masahiro Tsuji , Hideki Takagi , Shigeharu Ishikawa , Hiroyuki Yasuda
IPC分类号： B24B1/00
CPC分类号： B24B55/02 , B24B37/015 , B24B37/12 , B24B37/14 , B24B37/16 , B24B41/047
摘要： A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table (2) includes a plurality of superimposed bases (11) each of which is formed of silicide ceramic or carbide ceramic. The bases (11) are joined together by an adhesive layer (14). A fluid passage (12) is formed in a joining interface between the bases (11).
摘要翻译：一种用于晶片抛光装置的桌子，其具有优异的耐热，抗热冲击和抗磨损特性，并且能够在提高晶片的质量的同时增加半导体晶片的直径。工作台（2）包括多个由硅化物陶瓷或碳化物陶瓷形成的重叠基座（11）。基底（11）通过粘合剂层（14）连接在一起。流体通道（12）形成在基部（11）之间的接合界面中。

94. 发明授权

US06991520B2 Abrasive machine and method of abrading work piece 有权
公开(公告)号：US06991520B2
公开(公告)日：2006-01-31
申请号：US10303156
申请日：2002-11-22
申请人： Toshiroh Doy
发明人： Toshiroh Doy
IPC分类号： B24B1/00
CPC分类号： B24B37/042 , B24B37/04 , B24B41/047
摘要： The abrasive machine of the present invention is capable of changing pressure applied to a work piece and easily defining optimum abrading conditions. The abrasive machine comprises: a pressure vessel capable of increasing and reducing inner pressure; an abrasive plate provided in the pressure vessel; a pressing plate provided on the abrasive plate, the pressing plate pressing the work piece onto the abrasive plate; a driving unit relatively moving the abrasive plate with respect to the pressing plate so as to abrade the work piece; and a pressure source connected to the pressure vessel, the pressure source increasing or reducing the inner pressure of the pressure vessel.

95. 发明申请

US20050260938A1 Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer 审中-公开
标题翻译：晶片抛光装置的表，半导体晶片的研磨方法以及半导体晶片的制造方法
公开(公告)号：US20050260938A1
公开(公告)日：2005-11-24
申请号：US11192846
申请日：2005-07-28
申请人： Yuji Okuda , Naoyuki Jimbo , Kazutaka Majima , Masahiro Tsuji , Hideki Takagi , Shigeharu Ishikawa , Hiroyuki Yasuda
发明人： Yuji Okuda , Naoyuki Jimbo , Kazutaka Majima , Masahiro Tsuji , Hideki Takagi , Shigeharu Ishikawa , Hiroyuki Yasuda
IPC分类号： B24B1/00 , B24B37/015 , B24B37/12 , B24B37/14 , B24B37/16 , B24B41/047 , B24B49/14
CPC分类号： B24B55/02 , B24B37/015 , B24B37/12 , B24B37/14 , B24B37/16 , B24B41/047
摘要： A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table includes a plurality of superimposed bases each of which is formed of silicide ceramic or carbide ceramic. The bases are joined together by an adhesive layer. A fluid passage is formed in a joining interface between the bases.
摘要翻译：一种用于晶片抛光装置的桌子，其具有优异的耐热，抗热冲击和抗磨损特性，并且能够在提高晶片的质量的同时增加半导体晶片的直径。该表包括多个叠加的基底，每个基底由硅化物陶瓷或碳化物陶瓷形成。基底通过粘合剂层连接在一起。在基座之间的接合界面中形成流体通道。

96. 发明申请

US20050164615A1 Bearing arrangement for vibrationally mounting a grinding disk in a grinder 失效
标题翻译：用于将研磨盘振动地安装在研磨机中的轴承装置
公开(公告)号：US20050164615A1
公开(公告)日：2005-07-28
申请号：US10516585
申请日：2003-07-11
申请人： Justus Lamprecht , Tobias Lutz , Christoph Cramer
发明人： Justus Lamprecht , Tobias Lutz , Christoph Cramer
IPC分类号： B24B23/04 , B24B41/047 , B24B23/00
CPC分类号： B24B41/047 , B24B23/04
摘要： The invention is based on a bearing arrangement for vibratingly supporting a grinding disk (24) on a grinding apparatus (10), in particular in a vibrating grinder, having a plurality of elastic vibration bodies (48), which can be connected on the one hand to the grinding disk (24) and on the other to the grinding apparatus (10). It is proposed that the vibration bodies (48) are disposed, individually or in groups of a plurality of vibration bodies (48) each, in a plurality of modules (42) that are separate from one another.
摘要翻译：本发明基于一种用于在研磨装置（10）上振动地支撑研磨盘（24）的轴承装置，特别是在具有多个弹性振动体（48）的振动研磨机中，该研磨装置可以连接在该研磨装置手到研磨盘（24），另一个送到研磨装置（10）。提出在彼此分离的多个模块（42）中分别或多个振动体（48）分别设置振动体（48）。

97. 发明申请

US20050164614A1 Sanding machine 失效
标题翻译：砂光机
公开(公告)号：US20050164614A1
公开(公告)日：2005-07-28
申请号：US10511330
申请日：2003-04-29
申请人： Eligio Bau , Nevio Zanuso
发明人： Eligio Bau , Nevio Zanuso
IPC分类号： B24B7/06 , B24B7/28 , B24B41/047 , B24B21/00
CPC分类号： B24B41/047 , B24B7/06 , B24B7/28
摘要： A sanding machine (1; 300) comprising a support structure (2; 302) for the piece (3) to be processed and a sanding unit (4) for the piece (3) itself. The sanding unit (4) comprises a frame (40) that supports a winding element (8) cooperating with kinematic means (9) suitable for setting it in motion according to a closed ring configuration on a plane (π1) substantially parallel to the plane (π2) defined by the support structure (2; 302) and a plurality of abrasive elements (10) combined with the winding element (8) spaced from one another and provided with an abrasive surface (16; 416) that comes in contact with the piece (3) during the movement of the winding element (8).
摘要翻译：一种砂光机（1; 300），包括用于待处理的片（3）的支撑结构（2; 302）和用于片（3）本身的打磨单元（4）。打磨单元（4）包括框架（40），其支撑与运动装置（9）配合的缠绕元件（8），该运动装置适合于根据基本平行于由所述支撑结构（2; 302）限定的平面（pi 2）和与所述绕组元件（8）组合的多个研磨元件（10）彼此间隔开并设置有进入的研磨表面（16; 416）在绕组元件（8）移动期间与片（3）接触。

98. 发明申请

US20050130570A1 Continuous through-feed grinding machine for machining a workpiece surface and method 审中-公开
标题翻译：连续进给磨床用于加工工件表面和方法
公开(公告)号：US20050130570A1
公开(公告)日：2005-06-16
申请号：US11007908
申请日：2004-12-09
申请人： Friedrich von Schumann
发明人： Friedrich von Schumann
IPC分类号： B24B7/06 , B24B7/28 , B24B27/00 , B24B29/00 , B24B41/047 , B24D13/04 , B24B49/00
CPC分类号： B24D13/04 , B24B7/06 , B24B7/28 , B24B27/0076 , B24B29/005 , B24B41/047
摘要： The subject matter of the invention is a continuous through-feed grinding machine for machining a workpiece surface, said grinding machine having a grinding station with at least two rotating grinding tools, more specifically disc or roll grinders, with the grinding tools being continuously advanced along an endless path. The objective of providing a continuous through-feed grinding machine allowing for even machining of the workpiece surface with even wear of the grinding tools is accomplished by providing the endless path (128) with two work segments (140, 142) alternating with two transfer segments (144, 146) or by continuously advancing grinding tools that are moved along an endless path configured as an oval or elliptical shape.
摘要翻译：本发明的主题是用于加工工件表面的连续通过进给研磨机，所述研磨机具有研磨站，该研磨站具有至少两个旋转研磨工具，更具体地是圆盘或辊式研磨机，其中研磨工具沿着无尽的道路。提供连续通过进给研磨机的目的是通过提供具有两个工件段（140,142）的两个工作段（140,142）与两个传送段（144,146），或者通过连续推进沿着构造为椭圆形或椭圆形的环形路径移动的研磨工具。

99. 发明授权

US06869350B2 Polishing pads and methods relating thereto 有权
标题翻译：抛光垫及其相关方法
公开(公告)号：US06869350B2
公开(公告)日：2005-03-22
申请号：US10659889
申请日：2003-09-11
申请人： John H. V. Roberts , David B. James , Lee Melbourne Cook
发明人： John H. V. Roberts , David B. James , Lee Melbourne Cook
IPC分类号： B24B37/26 , B24B41/047 , B24D3/26 , B24D3/28 , B24D13/14 , B24B1/00
CPC分类号： B24D3/28 , B24B37/26 , B24B41/047 , B24D3/26
摘要： This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
摘要翻译：本发明描述了可用于制造半导体器件等的改进的抛光垫。本发明的垫具有有利的亲水性抛光材料，并且具有创新的表面形貌和纹理，其通常改善了可预测性和抛光性能。

100. 发明申请

US20050054279A1 Floor resurfacing disks for rotary floor resurfacing machines 失效
标题翻译：用于旋转地板重铺机的地板重铺盘
公开(公告)号：US20050054279A1
公开(公告)日：2005-03-10
申请号：US10655902
申请日：2003-09-05
申请人： Todd Jordan
发明人： Todd Jordan
IPC分类号： B24B7/18 , B24B41/047 , B24B23/00
CPC分类号： B24B7/186 , B24B41/047
摘要： A resurfacing disk which mounts to a rotatable disk mount of a conventional rotary floor resurfacing machine. The resurfacing disk includes a rigid upper disk with four counterbored holes through an upper surface corresponding to four downwardly open holes of each disk mount. A resilient, flanged grommet is retained extending through corresponding holes of a retaining plate mounted to the upper surface. The grommets include respective vertically oriented longitudinal bores closely receive a mounting pin which extends from a corresponding hole of the disk mount. A plurality of rotary cutters each include a bracket which mounts to the upper disk opposite the grommets and an externally toothed cutter rotatably mounted thereto. The rotatable toothed cutters are oriented radially outwardly of the resurfacing disk so as to rotate while engaging the floor as the resurfacing disk spins with the disk mount. A resiliently deformable lower disk may be mounted in place of the rotary cutters and a sandpaper disk is removably affixed thereto using sheets interconnectable hook and a loop fastener material. The grommets and the lower disk deform to permit the floor resurfacing device to more closely follow contours of the floor surface and are easily replaceable if damaged or worn out.
摘要翻译：一种重新铺绕的盘，其安装到常规的旋转地板表面重铺机的可旋转盘安装件上。表面盘包括刚性上盘，其具有通过上表面的四个沉孔，其对应于每个盘安装座的四个向下开孔。弹性法兰的索环被保持延伸穿过安装到上表面的保持板的相应孔。索环包括相应的垂直取向的纵向孔紧密地接收从盘安装件的相应孔延伸的安装销。多个旋转切割器各自包括安装到与盘孔相对的上盘的托架和可旋转地安装在其上的外齿刀。可旋转的有齿切割器被定向在表面覆盖盘的径向外侧，以便当表面刷盘与盘安装件旋转时，可以同时接合地板而转动。可以安装可弹性变形的下盘代替旋转切割器，并且砂纸盘可拆卸地固定到其上，使用片材可互连钩和环紧固件材料。垫圈和下盘变形，以允许地板重铺装置更紧密地跟随地板表面的轮廓，并且如果损坏或磨损就容易更换。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式