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    • 91. 发明授权
    • Lightguide preform fabrication
    • 光导预制件制造
    • US4304581A
    • 1981-12-08
    • US175982
    • 1980-08-07
    • Mansoor A. Saifi
    • Mansoor A. Saifi
    • C03B37/018G02B6/00C03B37/07C03B37/075
    • C03B37/01869C03B2201/31
    • A lightguide preform (13) is fabricated by depositing and consolidating a plurality of doped silica layers (12), containing volatile germania, on the inside surface of a silica glass tube (11). The tube (11) is rotated while repeatedly traversing a hot zone therealong to shrink and collapse the tube in a final heat zone traversal. A gas mixture containing oxygen and germanium tetrachloride flow from an input gas line (23) and through the tube (11) during the shrinking traversals. The gas mixture continues to flow through at least a portion of the input gas line (23) during the final heat zone traversal.
    • 通过在石英玻璃管(11)的内表面上沉积并固化含有挥发性锗的多个掺杂二氧化硅层(12)来制造光导预制件(13)。 管(11)旋转,同时重复地穿过其中的热区域,以在最终热区穿越中收缩并塌缩管。 含氧和四氯化锗的气体混合物在收缩过程中从输入气体管线(23)流过管道(11)。 气体混合物在最终加热区域穿越期间继续流过输入气体管线(23)的至少一部分。
    • 93. 发明授权
    • Method for removing heat from a workpiece during processing in a vacuum
chamber
    • 在真空室中加工过程中从工件上除热的方法
    • US4297190A
    • 1981-10-27
    • US211603
    • 1980-12-01
    • Robert W. Garrett
    • Robert W. Garrett
    • C23C14/54F28D15/06H01F41/18H01L21/00C23C15/00
    • H01L21/67103C23C14/541F28D15/06H01F41/18
    • A workpiece (16), for example a magnetic bubble memory wafer, is held in place, and heat is removed from it by an expandable heat pipe (22) during a process performed in a vacuum as, for example, a sputter etch process. The expandable heat pipe (22) includes two plates (24, 26) joined by a bellows (28) to form a sealed chamber containing a vaporizable liquid such as water. During loading of the wafers the heat pipe (22) is compressed by atmospheric pressure and thereby facilitates easy assembly of the wafer (16) and heat pipe (22) into a holding fixture (10) which in turn is bolted to a cooling plate (30) situated inside a vacuum chamber. When the chamber is evacuated, the heat pipe (22) expands to hold the wafer (16) in place and form a good thermal path from the wafer (16) to the cooling plate (30). In an alternate embodiment the heat pipe (22) does not completely fill the gap from the wafer (16) to the cooling plate (30) in a vacuum at room temperature, but rather expands to fill the gap when the heat pipe (22) is heated by the wafer (16). The expanding heat pipe (22) holds the wafer (16) at a constant, predetermined temperature above the temperature of the cold plate.
    • 工件(16),例如磁性气泡存储器晶片被保持在适当的位置,并且在例如溅射蚀刻工艺的真空中进行的工艺期间,可膨胀热管(22)从其中除去热量。 可膨胀热管(22)包括由波纹管(28)连接的两个板(24,26),以形成容纳诸如水的可蒸发液体的密封室。 在加载晶片期间,热管(22)被大气压力压缩,从而便于将晶片(16)和热管(22)容易地组装到保持夹具(10)中,固定夹具(10)又被螺栓连接到冷却板 30)位于真空室内。 当腔室被排空时,热管(22)膨胀以将晶片(16)保持在适当位置,并且形成从晶片(16)到冷却板(30)的良好的热路径。 在替代实施例中,热管(22)在室温下的真空中不会完全填满晶片(16)到冷却板(30)的间隙,而是当热管(22) 被晶片(16)加热。 膨胀的热管(22)将晶片(16)保持在高于冷板温度的恒定的预定温度。
    • 96. 发明授权
    • Method of bonding semiconductor devices to carrier tapes
    • US4283839A
    • 1981-08-18
    • US166440
    • 1980-07-07
    • Michael T. Gursky
    • Michael T. Gursky
    • H01L21/60H01L23/495H01L21/50
    • H01L24/86H01L23/49565H01L24/26H01L24/83H01L2224/8319H01L2224/83801H01L2924/01027H01L2924/01029H01L2924/01033H01L2924/01078H01L2924/01079H01L2924/01082H01L2924/30105H01L2924/351
    • A carrier tape (20) is provided for assembling components to make semiconductor devices. The tape (20) is made from soft, copper foil (21) and eliminates a plastic substrate (12) of the prior art. Patterns (27) containing clusters (24) of inner leads (28) and (30) are accurately formed into tape (20) for bonding to chips (52). Patterns (27) also contain precisely located sprocket holes (22) for indexing the tape (20) for chip and lead bonding.Tape (20) is indexed for bonding the free ends (36) of inner leads (28) and (30) to pads (54) of chip (52). Then tape (20) is indexed for bonding fixed ends (34) of leads (28) and (30) to stiff outer leads (86).Leads (28) and (30) in cluster (24) are deformed into a precise bell-like shape called a "bug" with chip (52) riding horizontally on top of the bell. Bugging develops flexural and tensile stresses and bonding causes thermal stresses in leads (28) and (30). Such stresses can shift or twist bug (51); warp the structural margin (26) and holes (22) of tape (20), and they can distort adjacent lead clusters (24) on tape (20).One or more stress relief sites (39) are provided in leads (28) and (30) to uniformly control such stresses. Sites (39) advantageously prevent stresses from being transmitted outside cluster (24). Also sites (39) aid in deformation of leads (28) and (30) to form bug (51).Tape (20) contains a high density of lead clusters (24) per linear foot of web (21). Costly plastic substrates (12) are eliminated. More precise registration of leads occurs at bonding. And good bonding improves thermal cycling performance of assembled devices. Also proper bugging assures good posture of chip (52) on top of bug (51). And good bugging reduces likelihood of short circuiting in the assembled devices.
    • 97. 发明授权
    • Leak testing hermetically sealed electronic articles
    • 泄漏检测密封电子物品
    • US4282744A
    • 1981-08-11
    • US90799
    • 1979-11-02
    • Bernard M. Dick
    • Bernard M. Dick
    • G01M3/18G01M3/16
    • G01M3/186
    • Hermetically sealed electronic articles (11) such as, for example, diodes are leak tested by exposing the articles to a fluid (28) under pressure. The fluid is capable of altering the electrical characteristics of the articles to a value outside of an acceptable range of values upon penetrating through faulty hermetic seals of the articles (11). After such exposure the articles (11) are routinely tested and the articles with values of their characteristics outside the range of acceptable values are identified or discarded. Ethylene glycol is an example of a preferred fluid (28) in that it has conductive properties which significantly increase the reverse bias leakage current of the diodes.
    • 气密密封的电子制品(11)例如二极管通过在压力下将制品暴露于流体(28)而被泄漏测试。 当穿透物品(11)的错误的气密密封时,流体能够将制品的电气特性改变到可接受的值范围之外的值。 在这种曝光之后,常规地测试物品(11),并且识别或丢弃其特性值在可接受值范围之外的物品。 乙二醇是优选流体(28)的一个实例,因为它具有显着增加二极管的反向偏置漏电流的导电性能。
    • 98. 发明授权
    • Apparatus for and methods of orienting and centering an article having
lateral protrusions
    • 用于定向和定心具有侧向突起的制品的装置和方法
    • US4264268A
    • 1981-04-28
    • US061954
    • 1979-07-30
    • Jack J. Monahan
    • Jack J. Monahan
    • B25J3/00H05K13/00
    • H05K13/0015
    • An article (11) which has a body portion (12) and lateral protrusions (14) at fixed angular positions is oriented and centered with respect to predetermined axes. Sloped walls (61) of a plurality of channels (62) located about a central axis (24) engage lateral edges of the protrusions to urge the protrusions laterally toward desirable positions in relationship to the axes. The disclosed methods and apparatus are advantageously applied to a four-leaded electronic chip as a typical example of the article with respect to which orienting and centering offers desirable precision for handling such article during packaging operations.
    • 具有在固定角度位置处的主体部分(12)和横向突起(14)的物品(11)相对于预定轴线定向和居中。 围绕中心轴线(24)定位的多个通道(62)的倾斜壁(61)与突出物的横向边缘相接合,以将突起侧向推动到与轴相关的期望位置。 所公开的方法和装置有利地应用于作为制品的典型实例的四引线电子芯片,关于哪个定向和定心提供了在包装操作期间处理这种物品所需的精度。