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91. 发明申请

US20110227603A1 Secure Anti-Tamper Integrated Layer Security Device Comprising Nano-Structures 审中-公开
标题翻译：包含纳米结构的安全防篡改集成层安全设备
公开(公告)号：US20110227603A1
公开(公告)日：2011-09-22
申请号：US13045880
申请日：2011-03-11
申请人： John Leon , James Yamaguchi , W. Eric Boyd , Volkan Ozguz
发明人： John Leon , James Yamaguchi , W. Eric Boyd , Volkan Ozguz
IPC分类号： H03K19/00 , H02H3/08 , G01R27/26 , G01R27/08
CPC分类号： H01L23/576 , H01L24/24 , H01L25/0657 , H01L25/16 , H01L2225/06513 , H01L2225/06524 , H01L2225/06541 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2924/00
摘要： A device and method using one or more electrically conductive nano-structures defined on one or more surfaces of a microelectronic circuit such as an integrated circuit die, microelectronic circuit package a stacked microelectronic circuit package, or on the surface of one or more layers in a stack of layers containing one or more ICs. The nano-structure is in connection with a monitoring circuit and acts as a “trip wire” to detect unauthorized tampering with the device or module. Such a monitoring circuit may include a power source such as an in-circuit or in-module battery and a “zeroization” circuit within the chip or package to erase the contents of a memory when the nano-structure is breached or altered. One or more electrically conductive nano-structures interconnect and reroute one or more electrical connections between one or more ICs to create an “invisible” set of electrical connections on the chip or stack to obfuscate an attempt to reverse engineer the device. microscope.
摘要翻译：限定在微电子电路的一个或多个表面上的一个或多个导电纳米结构的装置和方法，所述微电子电路例如集成电路管芯，微电子电路封装堆叠的微电子电路封装，或者在一个或多个层的表面上一堆包含一个或多个IC的层。纳米结构与监控电路相连，并用作“跳闸线”，以检测未经授权篡改设备或模块。这种监视电路可以包括芯片或封装内的诸如电路内或模块内电池的电源和“归零”电路，以在纳米结构被破坏或改变时擦除存储器的内容物。一个或多个导电纳米结构互连并重新路由一个或多个IC之间的一个或多个电连接，以在芯片或堆栈上产生“不可见”的电连接集合，以模糊设备的反向工程尝试。显微镜。

92. 发明申请

US20110193587A1 Anti-Tampering Obscurity Using Firmware Power Mirror Compiler 有权
标题翻译：使用固件电源镜面编译器防篡改
公开(公告)号：US20110193587A1
公开(公告)日：2011-08-11
申请号：US13018253
申请日：2011-01-31
申请人： Ellwood Payson
发明人： Ellwood Payson
IPC分类号： H03K19/00
CPC分类号： G06F21/75 , G06F21/755
摘要： In a preferred embodiment of the invention, a mirror compiler is provided for each protected device or circuit resulting in a program that is embedded into the protected device's source code. The mirror compiler can be configured to have multiple selectable compilation parameters offering the programmer flexible options for mirrored power cancellations.In the preferred embodiment, the mirror compiler comprises a digital-to-analog converter and a digital-to-analog load to sink current. These elements serve to define a complement of the normal (i.e., unprotected) programmed device's output current. The digital-to-analog load currents are output and thus act to cancel the expected variations in the currents of the protected programmed device.
摘要翻译：在本发明的优选实施例中，为每个被保护的设备或电路提供镜像编译器，从而产生嵌入到受保护设备的源代码中的程序。镜像编译器可以配置为具有多个可选择的编译参数，为程序员提供镜像功率消除的灵活选项。在优选实施例中，反射镜编译器包括数模转换器和数模模拟负载以吸收电流。这些元件用于定义正常（即，未受保护）编程设备的输出电流的补码。数字到模拟负载电流被输出，从而起到抵消受保护编程设备的电流的预期变化的作用。

93. 发明申请

US20110168838A1 Launch tube deployable surveillance and reconnaissance system 审中-公开
标题翻译：发射管部署监视和侦察系统
公开(公告)号：US20110168838A1
公开(公告)日：2011-07-14
申请号：US12799297
申请日：2010-04-21
申请人： William Hornback , Michael Holly
发明人： William Hornback , Michael Holly
IPC分类号： B64F1/04
CPC分类号： B64C39/028 , B64C2201/021 , B64C2201/042 , B64C2201/084 , B64C2201/102 , B64C2201/127 , B64C2201/165 , B64C2201/201 , B64C2201/203 , F41A23/42 , F41B7/00 , F41B11/62 , F41F3/042 , F41F3/052 , F41F7/00 , F42B10/16 , F42B15/08
摘要： An unmanned aerial surveillance and reconnaissance system are disclosed wherein an unmanned aerial vehicle is launchable from a launch tube, for instance, the bore of an existing weapons system mounted on a mobile vehicle, such as a weapon barrel of a tank or armored combat vehicle and which the launch may be remotely initiated from the protected armored compartment of the mobile vehicle.
摘要翻译：公开了一种无人驾驶的空中监视和侦察系统，其中无人驾驶飞行器可从发射管发射，例如安装在诸如坦克或装甲战斗车辆的武器枪的移动车辆上的现有武器系统的钻孔，该发射可以从移动车辆的受保护的装甲舱远程地发起。

94. 发明申请

US20110168378A1 Thermal power distribution system 审中-公开
标题翻译：火电配电系统
公开(公告)号：US20110168378A1
公开(公告)日：2011-07-14
申请号：US12657090
申请日：2010-01-14
申请人： Ying Hsu
发明人： Ying Hsu
IPC分类号： F28F27/00
CPC分类号： F28F27/00 , B64G1/50 , B64G1/506 , F28F13/00 , F28F2013/008
摘要： The invention is comprised of one or more variably conductive thermal switches.The thermal switches are sandwiched between two thermal conductors (e.g., heat pipes). Within each thermal switch is an array of micro-switches with a number of finger-like structures that are electrically actuated to form one or more thermal connection between two thermally conductive layers. The net thermal conductance of the switch is scalable based on the number of activated micro-switches. By changing the thermal conductance between the source and the sink, the temperature of the source may be adjusted based on the needs of the system in which it is employed.
摘要翻译：本发明包括一个或多个可变导电的热开关。热开关夹在两个热导体（例如热管）之间。在每个热开关内是具有多个手指状结构的微动开关的阵列，其被电致动以在两个导热层之间形成一个或多个热连接。基于激活的微动开关的数量，开关的净热导率是可扩展的。通过改变源和水槽之间的热传导，源的温度可以根据其采用的系统的需要进行调整。

95. 发明申请

US20110134245A1 Compact intelligent surveillance system comprising intent recognition 审中-公开
标题翻译：紧凑的智能监控系统包括意图识别
公开(公告)号：US20110134245A1
公开(公告)日：2011-06-09
申请号：US12928083
申请日：2010-12-01
申请人： Vitaliy Khizhnichenko
发明人： Vitaliy Khizhnichenko
IPC分类号： H04N7/18
CPC分类号： H04N7/183 , G06K9/00771 , G06K9/00791 , G06K9/209 , G08B13/19647 , G08B31/00
摘要： An intelligent surveillance system is disclosed for the identification of suspicious behavior near the exterior of a vehicle. The system of the invention is comprised of a “fish-eye” visible camera imaging system installed on the interior ceiling of an automobile for the 360-degree imaging and observation of the lower hemisphere around the perimeter of the vehicle. The camera of the system is augmented with an embedded processor based on DSP (digital signal processor) or FPGA (field-programmable gate array) technology to provide for the automatic detection of suspicious/hostile activities around the vehicle. The system is preferably provided with wireless transmitter means for alerting a person (e.g. the owner) of detected suspicious behavior.
摘要翻译：公开了一种用于识别车辆外部附近的可疑行为的智能监控系统。本发明的系统包括安装在汽车内部天花板上的“鱼眼”可视摄像机成像系统，用于360度摄像和观察围绕车辆周边的下半球。该系统的摄像机增强了基于DSP（数字信号处理器）或FPGA（现场可编程门阵列）技术的嵌入式处理器，以提供自动检测车辆周围的可疑/敌对活动。系统优选地设置有用于向人（例如所有者）警告检测到的可疑行为的无线发射机装置。

96. 发明申请

US20110085304A1 Thermal management device comprising thermally conductive heat spreader with electrically isolated through-hole vias 审中-公开
标题翻译：热管理装置包括具有电隔离通孔的导热散热器
公开(公告)号：US20110085304A1
公开(公告)日：2011-04-14
申请号：US12925147
申请日：2010-10-13
申请人： Randy Bindrup , Michael Miyake
发明人： Randy Bindrup , Michael Miyake
IPC分类号： H05K7/20 , F28F7/00 , B21D53/02 , H05K13/00
CPC分类号： H01L23/49833 , H01L21/4871 , H01L23/36 , H01L23/3677 , H01L23/4006 , H01L23/49827 , H01L25/03 , H01L25/0657 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , H01L2924/15311 , Y10T29/4935
摘要： A thermally conductive heat spreader is disclosed comprising one or more electrically isolated through-hole vias to provide, for instance, one or more thermal management layers having one or more electrically insulated and electrically conductive through-hole vias in a microelectronic module for the rerouting of one or more electrical signals to one or more layers in a stack of integrated circuit chip layers.The method of the invention comprises disposing an electrically conductive member within an aperture in a heat spreader blank wherein the electrically conductive member is electrically insulated from the heat spreader blank by means of a dielectric layer to provide a vertical through-hole via for the vertical routing of an electrical signal through the heat spreader.
摘要翻译：公开了一种导热散热器，其包括一个或多个电隔离的通孔通孔，以提供例如在微电子模块中具有一个或多个电绝缘和导电通孔通孔的一个或多个热管理层，用于重新布线一个或多个电信号到集成电路芯片层堆叠中的一个或多个层。本发明的方法包括将导电构件设置在散热器坯料的孔内，其中导电构件借助于电介质层与散热器坯件电绝缘，以提供用于垂直布线的垂直通孔通孔的电信号通过散热器。

97. 发明申请

US20110084212A1 Multi-layer photon counting electronic module 审中-公开
标题翻译：多层光子计数电子模块
公开(公告)号：US20110084212A1
公开(公告)日：2011-04-14
申请号：US12924141
申请日：2010-09-20
申请人： Stewart Clark
发明人： Stewart Clark
IPC分类号： H01L27/144
CPC分类号： H01J31/26 , H01J31/507
摘要： A multilayer electronic module for photon counting such as in the solar blind region of the ultraviolet electromagnetic spectrum is provided.The device comprises a photocathode for detecting photons and generating an electron output, a micro-channel plate for receiving the output electrons emitted from the photocathode in response to the photon input and amplifying same, readout circuitry and one or more bit-counting circuit layers used to count the electron output of the micro-channel plate.
摘要翻译：提供了一种用于光子计数的多层电子模块，例如在紫外线电磁光谱的太阳盲区。该装置包括用于检测光子并产生电子输出的光电阴极，用于响应于光子输入和放大从光电阴极接收从光电子发射的输出电子的微通道板，读出电路和使用的一个或多个位计数电路层计数微通道板的电子输出。

98. 发明申请

US20110032593A1 Gravity operated, rotatable lens curtain for thermal imager 有权
标题翻译：用于热成像仪的重力操作，可旋转镜片帘
公开(公告)号：US20110032593A1
公开(公告)日：2011-02-10
申请号：US12803134
申请日：2010-06-18
申请人： Itzhak Sapir
发明人： Itzhak Sapir
IPC分类号： G02B26/02
CPC分类号： G02B26/02
摘要： A device for in-situ calibration of a thermal imager on a UAS is disclosed. A rotatable lens curtain is provided with an aperture for the lens of a thermal imager to observe a field of view. The lens curtain comprises a balancing weight and blocking portion having a thermally uniform interior surface that functions as a calibration surface. The lens curtain is disposed with respect to the lens such that when the UAS is in a substantially level flight path, the lens is exposed to the field of view through the aperture. The lens curtain is provided such that when the UAS is rotated about an axis, the lens curtain maintains its absolute position relative to the Earth by virtue of the balance weight and the lens rotates within the lens curtain such that the blocking position obscures the lens from the field of view and the lens is exposed to the thermally uniform interior surface such that a calibration operation can be performed by the thermal imager.
摘要翻译：公开了一种用于在UAS上原位校准热像仪的装置。可旋转镜片帘幕设置有用于热成像仪的透镜的孔以观察视场。镜片帘幕包括平衡重和阻挡部分，其具有用作校准表面的热均匀内表面。透镜帘布相对于透镜设置，使得当UAS处于基本上水平的飞行路径时，透镜通过孔暴露于视场。透镜帘设置成使得当UAS围绕轴线旋转时，由于平衡重并且透镜在透镜帘幕内旋转，镜片帘幕相对于地球保持其绝对位置，使得遮挡位置遮挡透镜视场和透镜暴露于热均匀的内表面，使得可以通过热像仪进行校准操作。

99. 发明申请

US20110031982A1 Tamper-resistant electronic circuit and module incorporating electrically conductive nano-structures 审中-公开
标题翻译：具有防篡改电子电路和包含导电纳米结构的模块
公开(公告)号：US20110031982A1
公开(公告)日：2011-02-10
申请号：US12806127
申请日：2010-08-04
申请人： John Leon , James Yamaguchi , Volkan Ozguz , W. Eric Boyd
发明人： John Leon , James Yamaguchi , Volkan Ozguz , W. Eric Boyd
IPC分类号： G01R27/28 , H02H3/08 , H05K7/00
CPC分类号： H01L23/576 , H01L25/0657 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A device and method are disclosed comprising one or more electrically conductive nano-structures defined on one or more surfaces of a microelectronic circuit such as an integrated circuit die, microelectronic circuit package (such as a TSOP, BGA or other prepackaged IC) a stacked microelectronic circuit package, or on the surface of one or more layers in a stack of layers containing one or more ICs.In one embodiment, the electrically conductive nano-structure is in electrical connection with a monitoring circuit and acts as a “trip wire” to detect unauthorized tampering with the device or module. Such a monitoring circuit may include a power source such as an in-circuit or in-module battery and a “zeroization” circuit within the chip or package to erase the contents of a memory when the electrically conductive nano-structure is breached or altered. The device may be configured to blow one or more fuses or overcurrent protection devices when the electrically conductive nano-structure is breached or altered.In a further embodiment, one or more electrically conductive nano-structures are used to interconnect and reroute one or more electrical connections between one or more ICs (or dummy leads and vias) to create an “invisible” set of electrical connections on the chip or stack to obfuscate an attempt to reverse engineer the device, i.e., a set of connections that cannot be observed by standard test means such as by X-ray or conventional microscope.
摘要翻译：公开了一种器件和方法，其包括限定在微电子电路的一个或多个表面上的一个或多个导电纳米结构，例如集成电路管芯，微电子电路封装（例如TSOP，BGA或其它预封装IC）堆叠微电子或者在包含一个或多个IC的层叠层中的一个或多个层的表面上。在一个实施例中，导电纳米结构与监控电路电连接，并用作“跳闸线”，以检测未经授权的篡改设备或模块。这样的监视电路可以包括诸如电路内或模块内电池的电源和芯片或封装内的“零化”电路，以在导电纳米结构被破坏或改变时擦除存储器的内容物。该装置可以被配置为当导电纳米结构被破坏或改变时吹送一个或多个保险丝或过电流保护装置。在另一个实施例中，使用一个或多个导电纳米结构来互连和重新路由一个或多个IC（或虚拟引线和通孔）之间的一个或多个电连接，以在芯片上产生“不可见”的电连接集合，或堆叠以模糊化设备的反向工程，即通过X射线或常规显微镜的标准测试手段无法观察到的一组连接。

100. 发明申请

US20070102803A1 Method for making stacked integrated circuits (ICs) using prepackaged parts 审中-公开
标题翻译：使用预包装部件制造堆叠集成电路（IC）的方法
公开(公告)号：US20070102803A1
公开(公告)日：2007-05-10
申请号：US11644438
申请日：2006-12-22
申请人： Keith Gann
发明人： Keith Gann
IPC分类号： H01L23/02
CPC分类号： H01L24/97 , H01L23/3114 , H01L23/49833 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/81 , H01L24/82 , H01L24/86 , H01L24/98 , H01L25/105 , H01L25/16 , H01L25/18 , H01L2224/16 , H01L2224/2402 , H01L2224/32014 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48599 , H01L2224/73253 , H01L2224/81052 , H01L2224/81801 , H01L2224/82 , H01L2224/85205 , H01L2224/86 , H01L2224/97 , H01L2225/1029 , H01L2225/1064 , H01L2225/107 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01079 , H01L2924/014 , H01L2924/078 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19043 , H05K1/0203 , H05K1/0207 , H05K1/144 , H05K1/186 , H05K3/403 , H05K3/429 , H05K3/4611 , H05K3/4641 , Y10T29/49004 , Y10T29/49121 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49171 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2924/00015 , H01L2224/85399 , H01L2224/05599
摘要： A method of making a stacked assembly of integrated circuits (ICs) from prepackaged semiconductor chips is disclosed. The method involves the steps of first starting with a commercially available prepackaged semiconductor chip (e.g. a thin small outline package (TSOP)), that contains bare silicon die within an encapsulant and removing at least part of the encapsulant from the lateral sides to expose the wire bonds. More such prepackaged chips are modified and stacked upon one another. Metalization is performed on the stack to interconnect the layers. An additional embodiment discloses the use of lead frames to the stack of integrated circuits. Additional disclosure covers a method of stacking printed circuit boards (PCBs). A compact and low cost mini-computer is also disclosed that is made using methods of the present invention.
摘要翻译：公开了一种从预先封装的半导体芯片制造集成电路（IC）的叠层组件的方法。该方法包括首先从市售的预包装半导体芯片（例如薄的小外形封装（TSOP））开始的步骤，其在封装材料中包含裸硅裸片，并从侧面移除至少一部分密封剂以暴露电线债券。更多这样的预先包装的芯片被相互修改和堆叠。在堆叠上执行金属化以互连层。另外的实施例公开了使用引线框架到集成电路堆叠。另外的公开内容涉及堆叠印刷电路板（PCB）的方法。还公开了使用本发明的方法制造的紧凑且低成本的微型计算机。

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