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91. 发明授权

US08320076B1 Method and system for providing a magnetic recording transducer including an assist pole having surfaces angled with respect to the ABS 有权
标题翻译：用于提供包括具有相对于ABS成角度的表面的辅助杆的磁记录换能器的方法和系统
公开(公告)号：US08320076B1
公开(公告)日：2012-11-27
申请号：US12147364
申请日：2008-06-26
申请人： Yong Shen , Zhigang Bai
发明人： Yong Shen , Zhigang Bai
IPC分类号： G11B5/127 , G11B5/147
CPC分类号： G11B5/3116 , G11B5/3163 , Y10T29/49041 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A method and system provide a magnetic transducer that includes an underlayer. The method and system include providing a recessed region in the underlayer. The recessed region includes a front having an angle from horizontal. The angle is greater than zero and less than ninety degrees. The method and system further includes providing an assist pole layer in the recessed region and providing a main pole layer. A portion of the main pole layer resides on the assist pole layer. A main pole is defined from the assist pole layer and the main pole layer.
摘要翻译：一种方法和系统提供包括底层的磁换能器。该方法和系统包括在底层中设置凹陷区域。凹陷区域包括具有与水平方向成角度的前部。角度大于零，小于九十度。该方法和系统还包括在凹陷区域中提供辅助极层并提供主极层。主极层的一部分位于辅助极层上。主极由辅助极层和主极层限定。

92. 发明授权

US09589928B2 Combined QFN and QFP semiconductor package 有权
标题翻译：组合QFN和QFP半导体封装
公开(公告)号：US09589928B2
公开(公告)日：2017-03-07
申请号：US14552497
申请日：2014-11-25
申请人： Zhigang Bai , Jinzhong Yao , Lan Chu Tan
发明人： Zhigang Bai , Jinzhong Yao , Lan Chu Tan
IPC分类号： H01L23/48 , H01L23/00 , H01L23/495 , H01L23/498 , H01L21/56 , H01L23/31
CPC分类号： H01L24/85 , H01L21/565 , H01L23/3121 , H01L23/49537 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L23/49861 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05599 , H01L2224/2919 , H01L2224/29339 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/456 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/1434 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package includes a first lead frame type having a first type of package leads and a pre-molded portion, and a second lead frame type having a second type of package leads that surround a die pad and are supported by the pre-molded portion. An integrated circuit is attached to the die pad and electrically connected to the first and second types of leads with bond wires. A mold compound, which forms a mold cap, covers the first and second lead frame types, the integrated circuit and the bond wires. The first lead frame type may be a QFP type and the second lead frame type may be a QFN type.
摘要翻译：半导体封装包括具有第一类型的封装引线和预成型部分的第一引线框架型和具有围绕芯片焊盘并由预模制部分支撑的第二类型的封装引线的第二引线框架型。集成电路附接到管芯焊盘并且用接合线电连接到第一和第二类型的引线。形成模具帽的模具复合体覆盖第一和第二引线框架类型，集成电路和接合线。第一引线框类型可以是QFP型，第二引线框类型可以是QFN型。

93. 发明申请

US20150371957A1 DIE EDGE SEAL EMPLOYING LOW-K DIELECTRIC MATERIAL 有权
标题翻译： DIE EDGE密封采用低K电介质材料
公开(公告)号：US20150371957A1
公开(公告)日：2015-12-24
申请号：US14555558
申请日：2014-11-26
申请人： Zhijie Wang , Zhigang Bai , Jiyong Niu , Dehong Ye , Huchang Zhang
发明人： Zhijie Wang , Zhigang Bai , Jiyong Niu , Dehong Ye , Huchang Zhang
IPC分类号： H01L23/00
CPC分类号： H01L23/562 , H01L21/78 , H01L22/34 , H01L23/585 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor wafer has a multi-stage structure that damps and contains nascent cracks generated during dicing and inhibits moisture penetration into the active region of a die. The wafer includes an array of die regions separated by scribe lanes. The die regions include an active region and a first ring that surrounds the active region. A portion of the first ring includes a low-k dielectric material. A second ring includes a stack of alternating layers of metal and interlayer dielectric (ILD) material. A dummy metal region around the rings includes a stacked dummy metal features and surrounds the active region. A regular or irregular staggered arrangement of saw grid process control (SGPC) features reduces mechanical stress during dicing.
摘要翻译：半导体晶片具有多级结构，其能够阻止并包含切割期间产生的新生裂纹并且抑制水分渗透到模具的有源区域。该晶片包括由划线所隔开的芯片区域阵列。管芯区域包括有源区和围绕有源区的第一环。第一环的一部分包括低k电介质材料。第二环包括金属和层间电介质（ILD）材料的交替层叠。围绕环的虚设金属区域包括堆叠的虚拟金属特征并围绕有源区域。锯格过程控制（SGPC）特征的规则或不规则交错排列降低了切割时的机械应力。

94. 发明申请

US20150097278A1 SURFACE MOUNT SEMICONDUCTOR DEVICE WITH ADDITIONAL BOTTOM FACE CONTACTS 审中-公开
标题翻译：表面安装半导体器件与附加底部表面接触
公开(公告)号：US20150097278A1
公开(公告)日：2015-04-09
申请号：US14459328
申请日：2014-08-14
申请人： Zhigang Bai , Yin Kheng Au , Lan Chu Tan , Jinzhong Yao
发明人： Zhigang Bai , Yin Kheng Au , Lan Chu Tan , Jinzhong Yao
IPC分类号： H01L23/495
CPC分类号： H01L21/4842 , H01L23/49541 , H01L23/49551 , H01L23/49558 , H01L24/73 , H01L2224/04042 , H01L2224/05554 , H01L2224/06135 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
摘要： Assembling a surface mount semiconductor device includes providing a lead frame structure with peripheral leads and additional bottom face contacts integral with frame members. Outer portions of the bottom face contact members are interposed between inner portions of adjacent pairs of the peripheral leads. A package body is formed by encapsulating the lead frame structure in which the frame members are positioned outside a side edge surface. The peripheral leads and the bottom face contact members project between the side edge surface of the package body and the frame members. The frame members are cut and the peripheral leads and the bottom face contact members are separated and electrically isolated from each other.
摘要翻译：组装表面贴装半导体器件包括提供具有周边引线的引线框结构和与框架构件一体的附加底面接触。底面接触构件的外部部分位于相邻的外围引线对的内部之间。通过封装框架构件定位在侧边缘表面外侧的引线框架结构形成封装体。外围引线和底面接触构件在封装主体的侧边缘表面和框架构件之间突出。框架构件被切割，并且周边引线和底面接触构件彼此分离并电隔离。

95. 发明授权

US08837081B1 Laminated touchdown sensor for hard disk drives 有权
标题翻译：用于硬盘驱动器的层压触地传感器
公开(公告)号：US08837081B1
公开(公告)日：2014-09-16
申请号：US13312107
申请日：2011-12-06
申请人： Chengtao R. Yu , Dehua Han , Ying Hong , Feng Liu , Laurence L. Chen , Zhanjie Li , Zhigang Bai , Yu Lo , Yunfei Ding
发明人： Chengtao R. Yu , Dehua Han , Ying Hong , Feng Liu , Laurence L. Chen , Zhanjie Li , Zhigang Bai , Yu Lo , Yunfei Ding
IPC分类号： G11B5/127
CPC分类号： G11B5/6076
摘要： A method and system provide a touchdown sensor for use in disk drive. The touchdown sensor includes a sensor layer including a plurality of magnetic layers interleaved with at least one nonmagnetic layer. The plurality of magnetic layers are magnetically coupled and single domain. Further, the sensor has a temperature coefficient of resistivity (TCR) of at least 0.15%/° C.
摘要翻译：一种方法和系统提供用于磁盘驱动器的触地传感器。触地传感器包括传感器层，传感器层包括与至少一个非磁性层交错的多个磁性层。多个磁性层是磁耦合的和单一的结构域。此外，传感器的电阻率（TCR）的温度系数至少为0.15％/℃。

96. 发明授权

US08797686B1 Magnetic recording transducer with short effective throat height and method of fabrication 有权
标题翻译：磁记录传感器具有短的喉部高度和制造方法
公开(公告)号：US08797686B1
公开(公告)日：2014-08-05
申请号：US12978242
申请日：2010-12-23
申请人： Zhigang Bai , Peng Luo , Shaoping Li , Ut Tran
发明人： Zhigang Bai , Peng Luo , Shaoping Li , Ut Tran
IPC分类号： G11B5/31 , G11B5/23
CPC分类号： G11B5/3163 , G11B5/1278 , G11B5/232 , G11B5/235 , G11B5/3116 , G11B5/315
摘要： A magnetic recording transducer for use in a data storage device includes a writer pole with a ABS surface, trailing edge bevel and a trailing shield. The effective throat height of the writer main pole is reduced by the use two gap layers between the writer main pole and the trailing shield. A first gap layer is on and in contact with the writer pole trailing surface, and a second gap layer is on a section of the first gap layer on the writer pole trailing edge bevel, from a point removed from the ABS surface and absent from a part on a section of the first gap layer on the writer pole trailing edge bevel nearest the ABS. A method of fabricating the transducer is also provided.
摘要翻译：用于数据存储装置的磁记录传感器包括具有ABS表面的写入极，后缘斜面和后屏蔽。通过使用写主机和后盾之间的两个间隙层，减小了作者主极的有效喉部高度。第一间隙层与写入器极后表面接触并接触，并且第二间隙层位于写入器极后缘斜面上的第一间隙层的一部分上，从从ABS表面移除的点不在部分位于最靠近ABS的作者极后缘的第一间隙层的一部分。还提供了制造换能器的方法。

97. 发明授权

US08786983B1 Magnetic writer having a low aspect ratio two layer coil 有权
标题翻译：具有低纵横比的两层线圈的磁性写入器
公开(公告)号：US08786983B1
公开(公告)日：2014-07-22
申请号：US13532658
申请日：2012-06-25
申请人： Feng Liu , Zhanjie Li , Zhigang Bai , Ut Tran , Kevin K. Lin
发明人： Feng Liu , Zhanjie Li , Zhigang Bai , Ut Tran , Kevin K. Lin
IPC分类号： G11B5/17
CPC分类号： G11B5/17 , G11B5/3123
摘要： A method and system provide a magnetic transducer having an air-bearing surface (ABS). The magnetic transducer includes a write pole and at least one coil. The write pole has a pole tip and a yoke. The coil(s) energize the write pole. The coil(s) include a plurality of turns a first distance from the pole and at least one additional turn a second distance from the pole. The first distance is different from the second distance. The at least one additional turn extends over at least part of two of the plurality of turns, has a length in a stripe height direction perpendicular to the ABS and has a height in a down track direction. The length is greater than the height.
摘要翻译：一种方法和系统提供具有空气轴承表面（ABS）的磁换能器。磁换能器包括写极和至少一个线圈。写极具有极尖和轭。线圈使写入极点通电。所述线圈包括与所述极点第一距离的多个匝和距离所述极点至少一个第二距离的至少一个附加匝。第一距离与第二距离不同。所述至少一个附加转弯在所述多个匝中的两个匝中的至少一部分上延伸，具有垂直于所述ABS的条带高度方向上的长度，并且具有向下轨道方向的高度。长度大于高度。

98. 发明授权

US08709875B2 Power device and method of packaging same 有权
标题翻译：动力装置及其包装方法
公开(公告)号：US08709875B2
公开(公告)日：2014-04-29
申请号：US13549518
申请日：2012-07-16
申请人： Jinzhong Yao , Zhigang Bai , Xuesong Xu
发明人： Jinzhong Yao , Zhigang Bai , Xuesong Xu
IPC分类号： H01L21/48
CPC分类号： H01L23/49537 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/4334 , H01L23/49551 , H01L23/49568 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/13101 , H01L2224/1329 , H01L2224/16245 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/49171 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/83192 , H01L2224/92242 , H01L2224/97 , H01L2924/00014 , H01L2924/0781 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/0665 , H01L2924/014 , H01L2924/00012
摘要： A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers.
摘要翻译：封装功率半导体管芯的方法包括提供双量规引线框架的第一引线框架。第一引线框架包括厚的芯片焊盘。磁带附着到厚芯片焊盘的第一侧，并且功率管芯附接到厚芯片焊盘的第二侧。提供了双量规引线框架的第二引线框架。第二引线框架具有薄的引线指。引线指的一端连接到功率管芯的有源表面，使得引线指电连接到功率管芯的焊盘。然后将模塑料分配到双量规引线框架的顶表面上，使得模制化合物覆盖电源模具和引线指。

99. 发明授权

US08643153B2 Semiconductor device with staggered leads 有权
标题翻译：具有交错引线的半导体器件
公开(公告)号：US08643153B2
公开(公告)日：2014-02-04
申请号：US13461801
申请日：2012-05-02
申请人： Shunan Qiu , Zhigang Bai , Xuesong Xu , Beiyue Yan , You Ge
发明人： Shunan Qiu , Zhigang Bai , Xuesong Xu , Beiyue Yan , You Ge
IPC分类号： H01L23/495 , H01L23/48
CPC分类号： H01L23/49555 , H01L21/4842 , H01L2924/0002 , H01L2924/00
摘要： A process for assembling a semiconductor device includes providing a lead frame having a native plane and a plurality of leads having a native lead pitch. The process includes trimming and forming a first subset of the plurality of leads to provide a first row of leads. The process includes trimming and forming a second subset of the plurality of leads to provide a second row of leads. At least one subset of leads is formed with an obtuse angle relative to the native plane such that lead pitch associated with the first or second subset of leads is greater than the native lead pitch.
摘要翻译：一种用于组装半导体器件的方法包括提供具有天然平面的引线框架和具有天然引线间距的多个引线。该过程包括修剪和形成多个引线的第一子集以提供第一行引线。该过程包括修剪和形成多个引线的第二子集以提供第二排引线。引线的至少一个子集以相对于天平平面的钝角形成，使得与引线的第一或第二子集相关联的引线间距大于原始引线间距。

100. 发明授权

US08628672B1 Process for manufacturing a perpendicular magnetic recording writer pole with nonmagnetic bevel 失效
标题翻译：制造具有非磁性斜面的垂直磁记录刻录机的方法
公开(公告)号：US08628672B1
公开(公告)日：2014-01-14
申请号：US13535091
申请日：2012-06-27
申请人： Weimin Si , Ying Hong , Zhigang Bai , Yunhe Huang , Fenglin Liu , Hong Zhang , Jikou Zhou , Xiaoyu Yang , Yuan Yao , Iulica Zana , Feng Liu , Ling Wang
发明人： Weimin Si , Ying Hong , Zhigang Bai , Yunhe Huang , Fenglin Liu , Hong Zhang , Jikou Zhou , Xiaoyu Yang , Yuan Yao , Iulica Zana , Feng Liu , Ling Wang
IPC分类号： B44C1/22
CPC分类号： G11B5/315 , G11B5/1278 , G11B5/3116 , G11B5/3163
摘要： A method for fabricating a magnetic recording transducer having a magnetic writer pole with a short effective throat height is provided. In an embodiment, a writer structure comprising a magnetic writer pole having a trailing bevel and a nonmagnetic stack on the top surface of the writer pole is provided. A dielectric write gap layer comprising alumina is deposited over the trailing bevel section and the nonmagnetic stack; and at least one etch stop layer is deposited over the dielectric write gap layer. A layer of nonmagnetic fill material is deposited over the etch stop layer and to form a nonmagnetic bevel by performing a dry etch process. The etch stop layer(s) are removed from the short throat section; and a trailing shield is deposited over the short throat section, nonmagnetic bevel, and nonmagnetic stack top surface.
摘要翻译：提供一种制造具有具有短的有效喉部高度的磁性写入极的磁记录换能器的方法。在一个实施例中，提供了一种写入器结构，其包括在写入器极的顶表面上具有后斜面和非磁性堆叠的磁性写入极。包含氧化铝的电介质写入间隙层沉积在后斜面部分和非磁性层上; 并且至少一个蚀刻停止层沉积在电介质写间隙层上。一层非磁性填充材料沉积在蚀刻停止层上并通过执行干法蚀刻工艺形成非磁性斜面。蚀刻停止层从短喉部分移除; 并且尾部屏蔽层沉积在短喉部分，非磁性斜面和非磁性堆叠顶表面上。

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