专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明申请

US20110122597A1 DRIVING DEVICE AND A LIQUID CRYSTAL DISPLAY INCLUDING THE SAME 有权
标题翻译：驱动装置和包括其的液晶显示器
公开(公告)号：US20110122597A1
公开(公告)日：2011-05-26
申请号：US13014227
申请日：2011-01-26
申请人： Hyoung-Hak Kim , Tae-Hyeong Park , Dong-Ho Lee
发明人： Hyoung-Hak Kim , Tae-Hyeong Park , Dong-Ho Lee
IPC分类号： H05K9/00
CPC分类号： G02F1/13452
摘要： A driving device including a board on which a timing controller for signal processing and a memory are mounted, the board having a conductive field, in which the conductive field has a non-contact region which is coated with an insulating material, and an exposed contact region which is not covered with the insulating material, the exposed contact region formed adjacent to the timing controller or the memory, a conductive member disposed in the exposed contact region, and a shield covering the board and electrically connected to the conductive field via the conductive member
摘要翻译：一种驱动装置，包括其上安装有用于信号处理的定时控制器和存储器的板，所述板具有导电场，其中导电场具有涂覆有绝缘材料的非接触区域，以及暴露的触点未被绝缘材料覆盖的区域，与定时控制器或存储器相邻形成的暴露的接触区域，设置在暴露的接触区域中的导电部件，以及覆盖该基板并通过导电性电连接到导电场的屏蔽会员

92. 发明授权

US07916246B2 Color filtering device for improved brightness 有权
标题翻译：彩色滤光装置，提高亮度
公开(公告)号：US07916246B2
公开(公告)日：2011-03-29
申请号：US12720583
申请日：2010-03-09
申请人： Dong-Ho Lee , Yong-Ho Yang
发明人： Dong-Ho Lee , Yong-Ho Yang
IPC分类号： G02F1/1335
CPC分类号： G02F1/133514 , G02F1/133555 , G02F2001/133519
摘要： A color filtering member for improving the brightness of a display device is presented. The color filtering member includes colored regions (e.g., regions with RBG color filters) and black-and-white regions for transmitting white light. The black-and-white regions may be colorless gaps between adjacent colored regions. Multiple planarizing layers may be deposited on the colored regions and the black-and-white regions to form a surface that is sufficiently even. The color filtering member may include an intercepting region that extends between neighboring colored regions. The position of the intercepting region is not centered between the two colored regions that it separates. Rather, the intercepting region is shifted in the direction of rubbing (in the direction of liquid crystal alignment) to more effectively cover the regions where light leakage occurs. This color filtering member may be combined with an array member and a liquid crystal layer to form a display device.
摘要翻译：提出了一种用于提高显示装置的亮度的滤色构件。滤色构件包括着色区域（例如具有RBG滤色器的区域）和用于透射白光的黑白区域。黑色和白色区域可以是相邻着色区域之间的无色间隙。可以在着色区域和黑色和白色区域上沉积多个平坦化层以形成足够均匀的表面。滤色构件可以包括在相邻的着色区域之间延伸的截取区域。拦截区域的位置不在其分离的两个着色区域之间。相反，截止区域沿着摩擦方向（在液晶取向方向）移动，以更有效地覆盖发生漏光的区域。该滤色构件可以与阵列构件和液晶层组合以形成显示装置。

93. 发明授权

US07868438B2 Multi-chip package for reducing parasitic load of pin 有权
标题翻译：用于减少引脚寄生负载的多芯片封装
公开(公告)号：US07868438B2
公开(公告)日：2011-01-11
申请号：US12238894
申请日：2008-09-26
申请人： Byung-Se So , Dong-Ho Lee , Hyun-Soon Jang
发明人： Byung-Se So , Dong-Ho Lee , Hyun-Soon Jang
IPC分类号： H01L23/02 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/49 , G11C5/00 , G11C5/06 , H01L23/50 , H01L24/48 , H01L2224/05553 , H01L2224/48091 , H01L2224/49113 , H01L2924/00014 , H01L2924/01006 , H01L2924/01055 , H01L2924/01075 , H01L2924/30105 , H01L2224/45099 , H01L2224/05599
摘要： Multi-chip package includes first through Nth semiconductor chips, each of which includes an input/output pad, an input/output driver coupled to the input/output pad, and an internal circuit. Each of the first through Nth semiconductor chips includes an internal pad for coupling the internal input/output driver and the internal circuit. The internal pads of the first through Nth semiconductor chips are coupled to each other such as via a common pad installed at a substrate. The input/output pad of the first semiconductor chip directly receives an input/output signal transmitted via a corresponding pin of the multi-chip package. The second through Nth semiconductor chips indirectly receive the input/output signal via the internal pads coupled to each other. The multi-chip package can improve signal compatibility by maintaining a parasitic load of a pin to at least the level of a single chip, when a signal is transmitted to the pin at high speed. Also, when a signal that is not necessarily transmitted at high speed is applied to a pin, semiconductor chips can be packaged according to the preexisting methods.
摘要翻译：多芯片封装包括第一至第N个半导体芯片，每个半导体芯片包括输入/输出焊盘，耦合到输入/输出焊盘的输入/输出驱动器和内部电路。第一至第N半导体芯片中的每一个包括用于耦合内部输入/输出驱动器和内部电路的内部焊盘。第一至第N半导体芯片的内部焊盘彼此耦合，例如经由安装在基板上的公共焊盘。第一半导体芯片的输入/输出焊盘直接接收通过多芯片封装的相应引脚传输的输入/输出信号。第二至第N半导体芯片通过彼此耦合的内部焊盘间接接收输入/输出信号。当信号以高速传输到引脚时，多芯片封装可以通过将引脚的寄生负载保持在至少单个芯片的电平来提高信号兼容性。此外，当不需要高速传输的信号被施加到引脚时，可以根据预先存在的方法来封装半导体芯片。

94. 发明授权

US07768115B2 Stack chip and stack chip package having the same 有权
标题翻译：堆栈芯片和堆栈芯片封装有相同的
公开(公告)号：US07768115B2
公开(公告)日：2010-08-03
申请号：US12267343
申请日：2008-11-07
申请人： Jong-Joo Lee , Dong-Ho Lee
发明人： Jong-Joo Lee , Dong-Ho Lee
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/66 , H01L24/48 , H01L24/73 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73257 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided are a stack chip and a stack chip package having the stack chip. Internal circuits of two semiconductor chips are electrically connected to each other through an input/output buffer connected to an external connection terminal. The semiconductor chip has chip pads, input/output buffers and internal circuits connected through circuit wirings. The semiconductor chip also has connection pads connected to the circuit wirings connecting the input/output buffers to the internal circuits. The semiconductor chips include a first chip and a second chip. The connection pads of the first chip are electrically connected to the connection pads of the second chip through electrical connection means. Input signals input through the external connection terminals are input to the internal circuits of the first chip or the second chip via the chip pads and the input/output buffers of the first chip, and the connection pads of the first chip and the second chip.
摘要翻译：提供了具有堆叠芯片的堆叠芯片和堆叠芯片封装。两个半导体芯片的内部电路通过连接到外部连接端子的输入/输出缓冲器彼此电连接。半导体芯片具有芯片焊盘，输入/输出缓冲器和通过电路布线连接的内部电路。半导体芯片还具有连接到将输入/输出缓冲器连接到内部电路的电路布线的连接焊盘。半导体芯片包括第一芯片和第二芯片。第一芯片的连接焊盘通过电连接装置电连接到第二芯片的连接焊盘。通过外部连接端子输入的输入信号经由芯片焊盘和第一芯片的输入/输出缓冲器以及第一芯片和第二芯片的连接焊盘输入到第一芯片或第二芯片的内部电路。

95. 发明授权

US07697089B2 Liquid crystal display apparatus 失效
标题翻译：液晶显示装置
公开(公告)号：US07697089B2
公开(公告)日：2010-04-13
申请号：US10552088
申请日：2004-03-16
申请人： Jong-Soo Yoon , Dong-Ho Lee
发明人： Jong-Soo Yoon , Dong-Ho Lee
IPC分类号： G02F1/133 , G02F1/13357 , F21V8/00
CPC分类号： G09G3/3413 , G02F1/133555 , G02F2001/133342 , G02F2001/133622 , G02F2001/133626 , G02F2201/40 , G09G3/3406 , G09G3/342 , G09G3/3648 , G09G2300/023 , G09G2300/0456 , G09G2310/0235 , G09G2310/024
摘要： In an LCD apparatus (400) having simplified structure and improved luminance, a light supplying unit (100) supplies an LCD panel (280) with red light during a time corresponding to one-third of a frame, green light during the time and blue light during the time. A light reflective-transmissive unit is disposed between the light supplying unit (100) and the LCD panel assembly (200) to transmit the red light, the green light and the blue light and to reflect an external light from exterior of the LCD panel assembly (200). The LCD apparatus displays an image by means of white light as well as red light, green light and blue light, thereby improving luminance and simplifying structure.
摘要翻译：在具有简化的结构和改善的亮度的LCD装置（400）中，光供给单元（100）在对应于帧的三分之一的时间期间向LCD面板（280）供应红光，在时间期间为绿色光，蓝色光在时间。光反射透射单元设置在光供给单元（100）和LCD面板组件（200）之间以透射红光，绿光和蓝光，并且从LCD面板组件的外部反射外部光（200）。 LCD装置通过白光以及红光，绿光和蓝光显示图像，从而提高亮度并简化结构。

96. 发明申请

US20090186780A1 Biochip 审中-公开
标题翻译：生物芯片
公开(公告)号：US20090186780A1
公开(公告)日：2009-07-23
申请号：US12349299
申请日：2009-01-06
申请人： June-Young Lee , Dong-Ho Lee , Nam Huh
发明人： June-Young Lee , Dong-Ho Lee , Nam Huh
IPC分类号： C40B60/12
CPC分类号： G01N21/6454 , B01J2219/00527 , B01J2219/00585 , B01J2219/00596 , B01J2219/00605 , B01J2219/00617 , B01J2219/00653 , B01J2219/00704 , B01J2219/00722
摘要： A biochip for qualitatively analyzing a biological sample using probes includes a probe cell array comprising a plurality of probe cells capable of coupling with biomolecules of a biological sample, an optical sensor for detecting optical signals from probe cells selectively coupling with the biomolecules of the biological sample and converting the optical signals to digital electrical signals, and a memory cell array for storing the digital electrical signals.
摘要翻译：用于使用探针定性分析生物样品的生物芯片包括探针单元阵列，其包括能够与生物样品的生物分子偶联的多个探针细胞，用于检测来自与生物样品的生物分子选择性偶联的探针细胞的光学信号的光学传感器并将光信号转换为数字电信号，以及用于存储数字电信号的存储单元阵列。

97. 发明申请

US20090109642A1 SEMICONDUCTOR MODULES AND ELECTRONIC DEVICES USING THE SAME 审中-公开
标题翻译：半导体模块和使用它的电子器件
公开(公告)号：US20090109642A1
公开(公告)日：2009-04-30
申请号：US12249047
申请日：2008-10-10
申请人： Hyun-Soo Chung , Dong-Ho Lee , Seong-Deok Hwang , Sun-Won Kang , Ki-Hyuk Kim
发明人： Hyun-Soo Chung , Dong-Ho Lee , Seong-Deok Hwang , Sun-Won Kang , Ki-Hyuk Kim
IPC分类号： H05K7/00
CPC分类号： H05K1/0271 , H01L23/498 , H01L25/0652 , H01L2224/16 , H01L2924/12044 , H05K1/181 , H05K2201/0133 , H05K2201/10674 , H05K2203/1572
摘要： Semiconductor devices and electronic devices using the same. The semiconductor module may include a first semiconductor chip, and a module substrate having a top surface on which the first semiconductor chip is mounted and a second surface opposite the top surface, wherein the module substrate includes a first buffer layer to relieve stress occurring due to a difference of thermal expansions between the first semiconductor chip and the module substrate.
摘要翻译：半导体器件和使用其的电子器件。半导体模块可以包括第一半导体芯片和具有安装有第一半导体芯片的顶表面的模块衬底和与顶表面相对的第二表面，其中模块衬底包括第一缓冲层，以缓解由于第一半导体芯片和模块基板之间的热膨胀差异。

98. 发明申请

US20090075414A1 BIOCHIP AND METHOD OF FABRICATION 审中-公开
标题翻译：生物技术和制造方法
公开(公告)号：US20090075414A1
公开(公告)日：2009-03-19
申请号：US12194459
申请日：2008-08-19
申请人： June-Young Lee , Dong-Ho Lee , Hyeong-Jun Kim
发明人： June-Young Lee , Dong-Ho Lee , Hyeong-Jun Kim
IPC分类号： H01L21/50
CPC分类号： C40B80/00 , B01J19/0046 , B01J2219/00432 , B01J2219/00441 , B01J2219/00443 , B01J2219/00531 , B01J2219/0056 , B01J2219/00585 , B01J2219/00596 , B01J2219/00605 , B01J2219/00612 , B01J2219/00617 , B01J2219/00621 , B01J2219/00637 , B01J2219/00659 , B01J2219/00662 , B01J2219/00693
摘要： A method of fabricating a biochip and a biochip fabricated by the method are provided. The method can include providing a substrate including a plurality of first areas separated from each other by a second area, forming a plurality of activation patterns on each of the first areas, coupling a plurality of probes to each of the activation patterns, and cutting the substrate along the second area to form a plurality of chips.
摘要翻译：提供了一种通过该方法制造生物芯片和生物芯片的方法。该方法可以包括提供包括通过第二区域彼此分离的多个第一区域的衬底，在每个第一区域上形成多个激活图案，将多个探针耦合到每个激活模式，并切割基板沿着第二区域形成多个芯片。

99. 发明授权

US07481342B2 Spare tire carrier fixing holder 失效
标题翻译：备胎轮胎固定架
公开(公告)号：US07481342B2
公开(公告)日：2009-01-27
申请号：US11117208
申请日：2005-04-28
申请人： Dong-Ho Lee
发明人： Dong-Ho Lee
IPC分类号： B62D43/00
CPC分类号： B62D43/04
摘要： A spare tire carrier fixing holder includes a bolt penetrating a vehicle body member. A holder is equipped at the upper end with a nut screwed to the bolt while the lower end of the holder is formed with a hook onto which a carrier is engaged. A guide ring is formed within the holder to guide the bolt to minimize the eccentricity between the bolt and nut.
摘要翻译：备用轮胎载体固定保持器包括穿过车身构件的螺栓。在上端装有一个固定器，螺母与螺栓螺合，同时保持架的下端形成一个钩子，托架与托架接合。引导环形成在保持器内以引导螺栓以使螺栓和螺母之间的偏心度最小化。

100. 发明申请

US20090018035A1 Packages, biochip kits and methods of packaging 失效
标题翻译：包装，生物芯片套件和包装方法
公开(公告)号：US20090018035A1
公开(公告)日：2009-01-15
申请号：US12217169
申请日：2008-07-02
申请人： June-Young Lee , Dong-Ho Lee
发明人： June-Young Lee , Dong-Ho Lee
IPC分类号： C40B60/00 , B65B7/00
CPC分类号： C40B60/12 , B01L3/508 , B01L2200/16 , B01L2200/18 , B01L2300/047 , B01L2300/0636
摘要： A package having an improved yield is provided. The package includes a support on which a plurality of biochips are disposed, and a cover bonded to the support and defining a reaction space for each of the plurality of biochips together with the support, the cover including at least one inlet/outlet.
摘要翻译：提供了具有提高的产量的包装。该包装包括一个支撑件，多个生物芯片设置在该支架上，盖子与该支撑件结合并且与该支撑件一起为多个生物芯片中的每一个形成反应空间，该盖子包括至少一个入口/出口。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式