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    • 92. 发明授权
    • Head slider supporting device, disk device and suspension having thermal protection for head IC chip
    • 磁头滑块支持装置,磁盘装置和悬架,具有头部IC芯片的热保护功能
    • US06583962B2
    • 2003-06-24
    • US10174607
    • 2002-06-19
    • Takeshi OhweToru WatanabeRyosuke Koishi
    • Takeshi OhweToru WatanabeRyosuke Koishi
    • G11B548
    • G11B5/486G11B5/4833G11B7/122G11B21/00G11B21/16
    • A suspension has an extending end and the other end. A head IC chip mounting portion is provided between the extending end and the other end of the suspension. A head slider is loaded on a first surface of the suspension at a position on the side of the extending end with respect to the head IC chip mounting portion, the head slider integrally including a head. A head IC chip is mounted at the head IC chip mounting portion of the suspension. First wiring patterns extend along the suspension between a portion of the suspension, at which portion the head slider is loaded, and the head IC chip mounting portion. Second wiring patterns extend along the suspension between the head IC chip mounting portion and the other end of the suspension. The head IC chip is mounted at the head IC chip mounting portion in a condition in which a certain portion of the head IC chip is positioned on the side of a second surface of the suspension, which second surface is opposite to the first surface.
    • 悬架具有延伸端和另一端。 头部IC芯片安装部分设置在悬架的延伸端和另一端之间。 磁头滑块相对于头IC芯片安装部分在延伸端侧的位置处装载在悬架的第一表面上,磁头滑块整体地包括磁头。 磁头IC芯片安装在悬架的头部IC芯片安装部分。 第一布线图案沿着悬架的一部分在头部滑块被加载的部分和头部IC芯片安装部分之间延伸。 第二布线图案沿着头IC封装安装部分和悬架的另一端之间的悬架延伸。 头IC芯片安装在头IC芯片安装部分,其中头IC封装的某一部分位于悬架的第二表面侧,该第二表面与第一表面相对。
    • 93. 发明授权
    • Modular jack
    • 模块化插孔
    • US06561842B1
    • 2003-05-13
    • US10167496
    • 2002-06-13
    • Toru WatanabeAkio Suzuki
    • Toru WatanabeAkio Suzuki
    • H01R300
    • H01R13/6641H01R13/7175H01R24/64
    • A modular jack (21) comprises a housing (22), at least one fixing hole (31 and 32) provided in the housing and having a first compartment (33 and 34) and a pair of second compartments (35, 35′, 36, and 36′) extending rearwardly from the first compartment and at least one light emitting diode (LED) (24 and 25) having a display portion 47 and 48) accommodated in the first compartment and a pair of legs (49, 49′, 50, and 50′) accommodated in the second compartments. The modular jack further comprises a pair of leads (54) connected to the legs and a pair of connection terminals (53) for connecting the legs and leads so that the LED is connected to a circuit board through the leads.
    • 模块化插座(21)包括壳体(22),设置在壳体中的至少一个固定孔(31,32),并具有第一隔间(33和34)和一对第二隔室(35,35',36) 和36'),并且具有容纳在第一隔室中的至少一个具有显示部分47和48的发光二极管(LED)(24和25)和一对支腿(49,49',和36'), 50和50')。 模块化插座还包括连接到腿的一对引线(54)和用于连接腿和引线的一对连接端子(53),使得LED通过引线连接到电路板。
    • 98. 发明授权
    • Optical recording medium comprising (1,1,1) aluminum
    • 包括(1,1,1)铝的光学记录介质
    • US5283095A
    • 1994-02-01
    • US866358
    • 1992-04-10
    • Shigeo MatsumaruToru WatanabeAkira KubotsuShuichi NogawaKiyoshi OgataDaisuke Inoue
    • Shigeo MatsumaruToru WatanabeAkira KubotsuShuichi NogawaKiyoshi OgataDaisuke Inoue
    • C23C14/20B32B3/02
    • C23C14/20Y10S428/913Y10T428/31692
    • A metal film high in reflectivity and excellent in adhesion to a synthetic resin substrate even in the case where the metal film is sufficiently thin, is formed on a surface of the substrate by sputtering a metal target through an inert gas ion beam drawn out of an ion source in a vacuum vessel. An aluminum film coated matter formed by coating a surface of a synthetic resin substrate with an aluminum film, is characterized in that the aluminum film contains aluminum crystals at a portion in the film at a depth of not more than 600 .ANG. from a film surface thereof which contacts with the substrate. The aluminum crystals has a relation in which a crystal axis perpendicular to a (111) plane is perpendicular or substantially perpendicular to the film surface. Also, the aluminum crystals exhibits a diffraction X-ray spectrum of a (111) plane when measured by X-ray diffraction according to a diffractometer method under the following conditions: target: Cu, X-ray type: K.alpha. ray, measurement X-ray output: voltage 40 KeV, current 30 mA, longitudinal divergence limiting Sollar's slit: horizontal type, incident height limiting slit: 5 mm, incident slit: 0.4 mm, light-receiving Sollar's slit: vertical type, width limiting slit: 5 mm, diffraction X-ray monochromator: graphite horizontal plate, and diffraction method: .theta./2.theta. method.
    • 即使在金属膜充分薄的情况下,也能够通过溅射金属靶而在基板​​的表面上形成反射率高且对合成树脂基板的粘合性优异的金属膜,该惰性气体离子束从 离子源在真空容器中。 通过用铝膜涂布合成树脂基材的表面而形成的铝膜涂布物的特征在于,铝膜在薄膜的一部分的深度不超过600(Aangstroem)从膜中含有铝结晶 其表面与衬底接触。 铝晶体具有垂直于(111)面的晶轴<111>垂直于或基本垂直于膜表面的关系。 此外,当在以下条件下,根据衍射仪法通过X射线衍射测量时,铝晶体呈现出(111)面的衍射X射线光谱:靶:Cu,X射线型:K(α)射线, 测量X射线输出:电压40 KeV,电流30 mA,纵向发散限制Sollar狭缝:水平型,入射高度限制狭缝:5mm,入射狭缝:0.4mm,光接收Sollar狭缝:垂直型,宽度限制狭缝: 5mm,衍射X射线单色仪:石墨水平板和衍射法:(θ)/ 2(θ)法。