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    • 91. 发明申请
    • MANUFACTURING METHOD FOR ORGANIC ELECTROLUMINESCENT PANEL AND ORGANIC ELECTROLUMINESCENT PANEL MANUFACTURED USING THE SAME
    • 有机电致发光面板的制造方法及使用其制造的有机电致发光面板
    • US20130026910A1
    • 2013-01-31
    • US13640355
    • 2011-04-18
    • Masaaki MurayamaNobuaki TakahashiDaisuke Numakura
    • Masaaki MurayamaNobuaki TakahashiDaisuke Numakura
    • H05B33/10H05B33/14
    • H01L51/5246
    • A simple manufacturing method for an organic electroluminescent panel in which organic electroluminescent elements are arranged and sealed by a sealing adhesive. The electroluminescent panel has excellent sealing properties and excellent durability as a result of the organic electroluminescent elements being adhered to one another by a heat-curable adhesive. The manufacturing method is for an organic electroluminescent panel in which at least a first electrode, an organic functional layer containing a light-emitting layer, an organic electroluminescent element having a second electrode, and a sealing substrate are bonded together on a substrate by the heat-curable adhesive. The method includes forming a heat-curable adhesive layer on the sealing substrate, subjecting the heat-curable adhesive layer formed on the sealing substrate to pre-heating treatment, bonding the pre-heated heat-curable adhesive layer to the organic electroluminescent element, and subjecting the heat-curable adhesive layer to heat curing, in the given order.
    • 一种有机电致发光面板的简单制造方法,其中有机电致发光元件由密封胶布置和密封。 电致发光面板由于有机电致发光元件通过热固性粘合剂彼此粘合而具有优异的密封性和优异的耐久性。 该制造方法用于有机电致发光面板,其中至少第一电极,含有发光层的有机功能层,具有第二电极的有机电致发光元件和密封基板通过热量在基板上接合在一起 可固化粘合剂。 该方法包括在密封基板上形成热固性粘合剂层,对形成在密封基板上的热固性粘合剂层进行预热处理,将预热的可热固化粘合剂层接合到有机电致发光元件,以及 以给定的顺序对热固性粘合剂层进行热固化。
    • 93. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08183685B2
    • 2012-05-22
    • US12986716
    • 2011-01-07
    • Masaya KawanoKoji SoejimaNobuaki Takahashi
    • Masaya KawanoKoji SoejimaNobuaki Takahashi
    • H01L23/04H01L23/48
    • H01L21/76898H01L23/481H01L2224/13H01L2224/13025H01L2224/14181
    • A falling off of a through electrode is inhibited without decreasing a reliability of a semiconductor device including a through electrode. A semiconductor device 100 includes: a silicon substrate 101; a through electrode 129 extending through the silicon substrate 101; and a first insulating ring 130 provided in a circumference of a side surface of the through electrode 129 and extending through the semiconductor substrate 101. In addition, the semiconductor device 100 also includes a protruding portion 146, being provided at least in the vicinity of a back surface of a device-forming surface of the semiconductor substrate 101 so as to contact with the through electrode 129, and protruding in a direction along the surface of the semiconductor substrate 101 toward an interior of the through electrode 129.
    • 在不降低包括通孔的半导体器件的可靠性的情况下,抑制穿通电极的脱落。 半导体器件100包括:硅衬底101; 穿过硅衬底101的通孔电极129; 以及设置在贯通电极129的侧面的周围并延伸穿过半导体基板101的第一绝缘环130.此外,半导体器件100还包括突出部分146,其设置在至少在 半导体衬底101的器件形成表面的背表面与通孔129接触,并沿着半导体衬底101的表面朝向通孔129的内部突出。