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91. 发明授权

US08630441B2 Multi-magnetic speaker 有权
标题翻译：多磁扬声器
公开(公告)号：US08630441B2
公开(公告)日：2014-01-14
申请号：US13325622
申请日：2011-12-14
申请人： Lei Shi , Wen-Tao Jiang , Xiong Zhang , San-You Wu , Lin-Zhen Li
发明人： Lei Shi , Wen-Tao Jiang , Xiong Zhang , San-You Wu , Lin-Zhen Li
IPC分类号： H04R1/00 , H04R9/06 , H04R11/02
CPC分类号： H04R9/063 , H04R1/2896 , H04R2499/11
摘要： A multi-magnet speaker is disclosed. The multi-magnet speaker includes a frame defining a hollow space, a magnetic system defining a yoke and a plurality of magnetic gaps positioned in the hollow space, a diaphragm mounted on the frame and a plurality of coils attached to the bottom of the diaphragm. The diaphragm includes a plurality of vibrating membranes each defining a dome part and an arcuate portion radially extending from the periphery of the dome part. Each of the coils is received in the corresponding magnetic gap to drive the corresponding vibrating membrane to vibrate.
摘要翻译：公开了一种多磁体扬声器。多磁体扬声器包括限定中空空间的框架，限定磁轭的磁性系统和位于中空空间中的多个磁隙，安装在框架上的隔膜和附接到隔膜底部的多个线圈。隔膜包括多个振动膜，每个振动膜限定圆顶部分和从圆顶部分的周边径向延伸的弧形部分。每个线圈被接收在相应的磁隙中以驱动相应的振动膜振动。

92. 发明申请

US20140001617A1 METHOD OF USING BONDING BALL ARRAY AS HEIGHT KEEPER AND PASTE HOLDER IN SEMICONDUCTOR DEVICE PACKAGE 有权
标题翻译：在半导体器件包装中使用粘合球体阵列作为高度保持器和浆料夹持器的方法
公开(公告)号：US20140001617A1
公开(公告)日：2014-01-02
申请号：US13539304
申请日：2012-06-30
申请人： Lei Shi , Aihua Lu , Yan Xun Xue
发明人： Lei Shi , Aihua Lu , Yan Xun Xue
IPC分类号： H01L21/50 , H01L23/495
CPC分类号： H01L24/11 , H01L21/50 , H01L23/495 , H01L23/4952 , H01L23/49562 , H01L24/14 , H01L24/17 , H01L24/32 , H01L2224/0603 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49111 , H01L2224/73265 , H01L2224/8314 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A die attach method for a semiconductor chip with a back metal layer located at the back surface of the semiconductor chip comprises the steps of forming a bonding ball array including a plurality of bonding balls with a same height on a die attach area at a top surface of a die paddle; depositing a die attach material in the bonding ball array area with a thickness of the die attach material equal or slightly larger than the height of the bonding ball; attaching the semiconductor chip to the die attach area at the top surface of the die paddle by the die attach material, wherein the bonding ball array controls the bond line thickness of the die attach material between the back metal layer and the top surface of the die paddle and prevents the semiconductor chip from rotating on the die attach material when it is melted.
摘要翻译：具有位于半导体芯片的背面的背面金属层的半导体芯片的芯片贴附方法包括以下步骤：在上表面的芯片附着区域上形成包括具有相同高度的多个接合球的接合球阵列的模具在焊接球阵列区域中沉积管芯附着材料，其中管芯附着材料的厚度等于或略大于焊接球的高度; 将所述半导体芯片通过所述芯片附着材料附接到所述芯片的顶表面处的所述芯片附着区域，其中，所述接合球阵列控制所述芯片附着材料在所述背面金属层与所述模具的顶表面之间的结合线厚度并且防止半导体芯片在熔融时在芯片附着材料上旋转。

93. 发明申请

US20130302947A1 PACKAGING METHOD 有权
标题翻译：包装方法
公开(公告)号：US20130302947A1
公开(公告)日：2013-11-14
申请号：US13981116
申请日：2012-01-20
申请人： Yujuan Tao , Lei Shi , Guohua Gao , Jiangen Shi , Haiqing Zhu
发明人： Yujuan Tao , Lei Shi , Guohua Gao , Jiangen Shi , Haiqing Zhu
IPC分类号： H01L21/52 , H01L21/56
CPC分类号： H01L21/52 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/96 , H01L2224/04105 , H01L2224/12105 , H01L2224/24195 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/3511 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to a packaging method including the steps: a cementing layer is formed on a carrier board; the functional sides of chips and passive devices are attached to the cementing layer; a sealing material layer is formed on the side of the carrier board to which the chips and the passive devices are attached, and packaging and curing are performed; and the carrier board and the cementing layer are removed. Compared to the prior art, the system-level fan-out wafer packaging method claimed by the present invention first integrates chips and passive devices and then packages the chips and the passive devices together, thereby forming a final packaged product having not single-chip functionality but integrated-system functionality. Compared to current system-level packaging, highly integrated wafer-level packaging reduces such interfering factors as system-internal electric resistance and inductance, and accommodates the growing demand for lighter, thinner, shorter, and smaller semiconductor packaging.
摘要翻译：本发明涉及一种包装方法，包括以下步骤：在承载板上形成固着层; 芯片和无源器件的功能侧连接到固井层; 密封材料层形成在载体板的与芯片和无源器件相连接的一侧上，进行包装和固化; 移除载体板和固井层。与现有技术相比，本发明所要求保护的系统级扇出晶片封装方法首先集成芯片和无源器件，然后将芯片和无源器件封装在一起，从而形成最终的封装产品，而不具有单芯片功能但集成系统功能。与目前的系统级封装相比，高度集成的晶圆级封装减少了系统内部电阻和电感等干扰因素，满足了对更轻，更薄，更短，更短和更小的半导体封装的不断增长的需求。

94. 发明授权

US08564110B2 Power device with bottom source electrode 有权
标题翻译：具有底部源电极的功率器件
公开(公告)号：US08564110B2
公开(公告)日：2013-10-22
申请号：US13480391
申请日：2012-05-24
申请人： Yan Xun Xue , Yueh-Se Ho , Hamza Yilmaz , Jun Lu , Lei Shi , Liang Zhao , Ping Huang
发明人： Yan Xun Xue , Yueh-Se Ho , Hamza Yilmaz , Jun Lu , Lei Shi , Liang Zhao , Ping Huang
IPC分类号： H01L23/495
CPC分类号： H01L24/73 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L23/49548 , H01L23/49562 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/84 , H01L24/92 , H01L24/97 , H01L2224/0401 , H01L2224/05624 , H01L2224/06181 , H01L2224/11334 , H01L2224/1146 , H01L2224/1184 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/16245 , H01L2224/2784 , H01L2224/291 , H01L2224/3015 , H01L2224/32245 , H01L2224/371 , H01L2224/40247 , H01L2224/73104 , H01L2224/73204 , H01L2224/73253 , H01L2224/83101 , H01L2224/83385 , H01L2224/83801 , H01L2224/84385 , H01L2224/84801 , H01L2224/8485 , H01L2224/92125 , H01L2224/97 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/16151 , H01L2924/167 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2224/92 , H01L2224/83 , H01L2224/84 , H01L2224/85 , H01L2924/00012 , H01L2224/48247 , H01L2924/01014 , H01L2924/00014 , H01L2224/73103 , H01L2924/00
摘要： A power semiconductor package has an ultra thin chip with front side molding to reduce substrate resistance; a lead frame unit with grooves located on both side leads provides precise positioning for connecting numerous bridge-shaped metal clips to the front side of the side leads. The bridge-shaped metal clips are provided with bridge structure and half or fully etched through holes for relieving superfluous solder during manufacturing process.
摘要翻译：功率半导体封装具有超薄芯片，具有正面成型以降低基板电阻; 具有位于两侧引线上的凹槽的引线框单元提供精确的定位，用于将多个桥形金属夹连接到侧引线的前侧。桥形金属夹具有桥结构和半或完全蚀刻的通孔，用于在制造过程中缓解多余的焊料。

95. 发明授权

US08521507B2 Bootstrapping text classifiers by language adaptation 有权
标题翻译：通过语言适应来引导文本分类器
公开(公告)号：US08521507B2
公开(公告)日：2013-08-27
申请号：US12864208
申请日：2010-02-22
申请人： Lei Shi , Mingjun Tian
发明人： Lei Shi , Mingjun Tian
IPC分类号： G06F17/27
CPC分类号： G06F17/30705
摘要： Training data in one language is leveraged to develop classifiers for multiple languages under circumstances where all of those classifiers will be performing the same kind of classification task, but relative to linguistically different sets of texts, thereby saving the cost of manually labeling a different set of training data for each language. Classification knowledge is learned for a source language in which training data are available. That knowledge is transferred to another target language's classifier through the integration of language transition knowledge. The transferred model is adjusted to better fit the target language. In one technique, leveraging one language's classification knowledge in order to generate a classifiers for another language involves training a text classifier in a source language, transferring the learned classification knowledge from the source language to another target language using language translation techniques, and further tuning the transferred model to better fit the target language text.
摘要翻译：在所有这些分类器都将执行相同类别的分类任务，但相对于语言上不同的文本集合的情况下，利用一种语言的培训数据来开发多种语言的分类器，从而节省手动标记不同集合的成本培训每种语言的数据。对于有可用的培训数据的源语言，将学习分类知识。该知识通过语言转换知识的整合转移到另一个目标语言的分类器。转移的模型被调整以更好地适合目标语言。在一种技术中，利用一种语言的分类知识来生成用于另一种语言的分类器涉及用源语言来训练文本分类器，使用语言翻译技术将学习的分类知识从源语言转移到另一目标语言，并进一步调整转移模型更好地适应目标语言文本。

96. 发明授权

US08505840B2 Method for modifying nomal clay and a method for producing composite elastomer from the clay 有权
标题翻译：改性正粘土的方法和从粘土生产复合弹性体的方法
公开(公告)号：US08505840B2
公开(公告)日：2013-08-13
申请号：US12451321
申请日：2007-08-20
申请人： Lei Shi
发明人： Lei Shi
IPC分类号： B02C1/00 , B02C19/00 , B02C21/00
CPC分类号： C09C1/42 , C01P2006/80 , C08K3/346 , C09C3/12 , C08L83/04
摘要： A method for modifying soil and a method for producing composite Elastomer of the soil are disclosed. The method for modifying soil includes drying, pulverizing, sieving, and purifying the soil to obtain soil powder, then dynamically heating the powder and adding surfactant, which includes coupling agent, polysiloxane having reactive functional, emulsifier of organosilicon and aliphatic amine, and water, and then drying the above obtained powder to obtain modified soil. The modified soil and acrylic acid copolymer emulsion are mixed with plasticizer, foaming agent, etc. to form a composite body which is used to produce elastomer floor board, elastomer wall brick, composite soil skin material, and so on. No emission of toxic gas and evaporation of organic solvent can be attained during production and use of the invention, and performance of the product is same as or has superiority over rubber in compression deformation rate, rebound elasticity and durability.
摘要翻译：公开了一种改性土壤的方法和一种生产土壤复合弹性体的方法。土壤改性方法包括干燥，粉碎，筛分，净化土壤，获得土壤粉末，动态加热粉末，加入表面活性剂，其中包括偶联剂，具有反应性官能团的聚硅氧烷，有机硅乳液和脂肪胺，以及水，然后干燥上述得到的粉末，得到改性土壤。改性土壤和丙烯酸共聚物乳液与增塑剂，发泡剂等混合，形成复合体，用于生产弹性体地板，弹性体墙砖，复合土壤皮肤材料等。在本发明的生产和使用过程中，不会产生有毒气体的排放和有机溶剂的蒸发，与压缩变形率，回弹弹性和耐久性相比，产品性能与橡胶相同或优于橡胶。

97. 发明授权

US08436429B2 Stacked power semiconductor device using dual lead frame and manufacturing method 有权
标题翻译：采用双引线框架的叠层功率半导体器件及其制造方法
公开(公告)号：US08436429B2
公开(公告)日：2013-05-07
申请号：US13118445
申请日：2011-05-29
申请人： Yan Xun Xue , Yueh-Se Ho , Lei Shi , Jun Lu , Liang Zhao
发明人： Yan Xun Xue , Yueh-Se Ho , Lei Shi , Jun Lu , Liang Zhao
IPC分类号： H01L27/088
CPC分类号： H01L23/49562 , H01L23/49524 , H01L23/49575 , H01L24/48 , H01L2224/48247 , H01L2924/00014 , H01L2924/01322 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked power semiconductor device includes vertical metal oxide semiconductor field-effect transistors and dual lead frames packaged with flip-chip technology. In the method of manufacturing the stacked power semiconductor device, a first semiconductor chip is flip chip mounted on the first lead frame. A mounting clips is connected to the electrode at back side of the first semiconductor chip. A second semiconductor chip is mounted on the second lead frame, which is then flipped and stacked on the mounting clip.
摘要翻译：叠层功率半导体器件包括垂直金属氧化物半导体场效应晶体管和采用倒装芯片技术封装的双引线框架。在制造堆叠式功率半导体器件的方法中，第一半导体芯片是安装在第一引线框上的倒装芯片。安装夹在第一半导体芯片的背面连接到电极。第二半导体芯片安装在第二引线框架上，然后翻转并堆叠在安装夹上。

98. 发明授权

US08431993B2 Semiconductor package for forming a leadframe package 有权
标题翻译：用于形成引线框封装的半导体封装
公开(公告)号：US08431993B2
公开(公告)日：2013-04-30
申请号：US13289918
申请日：2011-11-04
申请人： Yan Xun Xue , Jun Lu , Lei Shi , Liang Zhao
发明人： Yan Xun Xue , Jun Lu , Lei Shi , Liang Zhao
IPC分类号： H01L29/94 , H01L29/76 , H01L31/062 , H01L31/119 , H01L31/113
CPC分类号： H01L24/73 , H01L21/4842 , H01L23/3107 , H01L23/49541 , H01L23/49551 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/0603 , H01L2224/29339 , H01L2224/371 , H01L2224/37599 , H01L2224/48247 , H01L2224/73221 , H01L2224/83101 , H01L2224/83801 , H01L2224/8385 , H01L2224/85 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01082 , H01L2924/014 , H01L2924/13091 , H01L2924/30107 , H01L2924/3011 , H01L2224/83 , H01L2224/84 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method is disclosed for attaching an interconnection plate to semiconductor die within leadframe package. A base leadframe is provided with die pad for attaching semiconductor die. An interconnection plate is provided for attachment to the base leadframe and semiconductor die. Add a base registration feature onto base leadframe and a plate registration feature onto interconnection plate with the registration features designed to match each other such that, upon approach of the interconnection plate to base leadframe, the two registration features would engage and guide each other causing concomitant self-aligned attachment of the interconnection plate to base leadframe. Next, the interconnection plate is brought into close approach to base leadframe to engage and lock plate registration feature to base registration feature hence completing attachment of the interconnection plate to semiconductor die and forming a leadframe package.
摘要翻译：公开了一种将引线框封装内的互连板连接到半导体管芯的方法。基座引线框架设置有用于附接半导体管芯的管芯焊盘。提供互连板，用于附接到基底引线框架和半导体管芯。将基准注册功能添加到基准引线框架和板对准特征到互连板上，其中配准特征被设计成彼此匹配，使得在互连板到基底引线框架的接近时，两个配准特征将相互接合并引导彼此引起伴随互连板与基座引线框架的自对准连接。接下来，使互连板靠近基底引线框架以将板对准特征接合并锁定到基准对准特征，从而完成互连板连接到半导体管芯并形成引线框封装。

99. 发明申请

US20130007151A1 DETERMINATION OF A SPAMMER THROUGH SOCIAL NETWORK CHARACTERIZATION 审中-公开
标题翻译：通过社会网络特征来确定垃圾邮件
公开(公告)号：US20130007151A1
公开(公告)日：2013-01-03
申请号：US13531774
申请日：2012-06-25
申请人： Xiao Yan Chen , Lei Shi , Chen Wang , Yi Bo Zhang
发明人： Xiao Yan Chen , Lei Shi , Chen Wang , Yi Bo Zhang
IPC分类号： G06F15/16
CPC分类号： H04L63/1416
摘要： A system for determining a spammer includes a session division apparatus configured to acquire short message events associated with a user and divide them into a plurality of sessions in terms of time; a social network building and characteristic calculating apparatus configured to build a social network of the user in each of the sessions, and calculate at least one type of social network characteristic in each of the sessions, respectively; and a determination apparatus configured to determine whether the user is a spammer or not according to the social network characteristic.
摘要翻译：用于确定垃圾邮件发送者的系统包括：会话分割装置，被配置为获取与用户相关联的短消息事件，并将其划分成多个会话; 社会网络建设和特征计算装置，被配置为在每个会话中构建用户的社交网络，并且分别在每个会话中计算至少一种类型的社交网络特征; 以及确定装置，被配置为根据社交网络特性来确定用户是否是垃圾邮件发送者。

100. 发明申请

US20130007127A1 DETERMINATION OF A SPAMMER THROUGH SOCIAL NETWORK CHARACTERIZATION 有权
标题翻译：通过社会网络特征来确定垃圾邮件
公开(公告)号：US20130007127A1
公开(公告)日：2013-01-03
申请号：US13527748
申请日：2012-06-20
申请人： Xiao Yan Chen , Lei Shi , Chen Wang , Yi Bo Zhang
发明人： Xiao Yan Chen , Lei Shi , Chen Wang , Yi Bo Zhang
IPC分类号： G06F15/16
CPC分类号： H04L63/1416
摘要： A method of determining a spammer includes acquiring, by a processor, short message events associated with a user and dividing them into a plurality of sessions in terms of time; building a social network of the user in each of the sessions, and calculating at least one type of social network characteristic in each of the sessions, respectively; and determining whether the user is a spammer or not according to the social network characteristic.
摘要翻译：确定垃圾邮件发送者的方法包括：由处理器获取与用户相关联的短消息事件，并将其划分成多个会话; 在每个会话中构建用户的社交网络，并且分别在每个会话中计算至少一种类型的社交网络特征; 以及根据社交网络特征确定用户是否是垃圾邮件发送者。

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