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91. 发明授权

US08703862B2 Reinforced thermoplastic molding compositions based on polyarylene ethers 有权
标题翻译：基于聚亚芳基醚的增强热塑性成型组合物
公开(公告)号：US08703862B2
公开(公告)日：2014-04-22
申请号：US13115513
申请日：2011-05-25
申请人： Martin Weber , Christian Maletzko , Mark Völkel
发明人： Martin Weber , Christian Maletzko , Mark Völkel
IPC分类号： C08J3/02 , C08J3/20 , C08K5/13 , C08G59/00 , C08G65/00
CPC分类号： C08L71/00 , C08L81/06
摘要： The present invention relates to thermoplastic molding compositions composed of the following components: (A) at least one polyarylene ether (A1) having an average of at most 0.1 phenolic end groups per polymer chain, and at least one polyarylene ether (A2) having an average of at least 1.5 phenolic end groups per polymer chain, (B) at least one fibrous or particulate filler, and (C) optionally further additives and/or processing aids. The present invention further relates to a process for producing the thermoplastic molding compositions of the invention, the use of these for producing moldings, fibers, foams, or films, and to the resultant moldings, fibers, foams, and films.
摘要翻译：本发明涉及由以下组分组成的热塑性模塑组合物：（A）每个聚合物链平均具有至多0.1个酚类末端基团的至少一种聚亚芳基醚（A1）和至少一种聚亚芳基醚（A2），其具有每个聚合物链平均至少1.5个酚类端基，（B）至少一种纤维或颗粒填料，和（C）任选的其它添加剂和/或加工助剂。本发明还涉及本发明的热塑性模塑组合物的制备方法，其用于生产模制品，纤维，泡沫或薄膜以及所得模制品，纤维，泡沫和薄膜的用途。

92. 发明申请

US20140017427A1 THERMOPLASTIC MOLDING COMPOSITION 有权
标题翻译：热塑性成型组合物
公开(公告)号：US20140017427A1
公开(公告)日：2014-01-16
申请号：US13548698
申请日：2012-07-13
申请人： Claudia Mettlach , Martin Weber , Christian Maletzko , Bernd Trotte
发明人： Claudia Mettlach , Martin Weber , Christian Maletzko , Bernd Trotte
IPC分类号： C08G75/23 , B32B1/02
CPC分类号： C08G75/23 , C08G75/08 , Y10T428/1352
摘要： The present invention relates to the use of a molding composition for producing a feed container consisting essentially of a copolymer composed of (A) from 5 to 60% by weight of units of the formula (I) and (B) from 40 to 95% by weight of units of the formula (II) where the total of the proportions by weight is 100% by weight, based on the copolymer, and where the demolding force of the molding composition is from 1800 to 2800 N.
摘要翻译：本发明涉及用于生产饲料容器的用途，所述饲料容器主要由以下组成的共聚物组成：（A）5至60重量％的式（I）和（B）的单元为40至95重量％（II）的单位，其中基于共聚物的重量比为100重量％，并且模塑组合物的脱模力为1800至2800N。

93. 发明授权

US08628613B2 Method for producing semiconductor wafers composed of silicon with reduced pinholes 有权
标题翻译：用于制造具有减小的针孔的由硅组成的半导体晶片的方法
公开(公告)号：US08628613B2
公开(公告)日：2014-01-14
申请号：US13089352
申请日：2011-04-19
申请人： Martin Weber , Werner Schachinger , Piotr Filar
发明人： Martin Weber , Werner Schachinger , Piotr Filar
IPC分类号： C30B15/14
CPC分类号： C30B29/06 , C30B15/18 , C30B15/305
摘要： Silicon semiconductor wafers are produced by pulling a single crystal at a seed crystal from a melt heated in a crucible; supplying heat to the center of the crucible bottom with a heating power which, in the course of the growth of a cylindrical section of the single crystal, is increased at least once to not less than 2 kW and is then decreased again; and slicing semiconductor wafers from the pulled single crystal.
摘要翻译：通过从在坩埚中加热的熔体中的晶种拉出单晶来制造硅半导体晶片; 以坩埚底部的中心供热，其加热功率在单晶体的圆柱形部分的生长过程中至少增加一次至不小于2kW，然后再次降低; 并从拉出的单晶切片半导体晶片。

94. 发明授权

US08524853B2 Segmented polyarylene ether block copolymers 失效
标题翻译：分段聚亚芳基醚嵌段共聚物
公开(公告)号：US08524853B2
公开(公告)日：2013-09-03
申请号：US13376901
申请日：2010-05-31
申请人： Cecile Gibon , Martin Weber , Reinoud J. Gaymans , Ranimol Stephen
发明人： Cecile Gibon , Martin Weber , Reinoud J. Gaymans , Ranimol Stephen
IPC分类号： C08G8/02
CPC分类号： C08G69/42 , C08G69/40 , C08L81/06 , C08L2205/05 , C08L77/00
摘要： The present invention relates to polyarylene ether block copolymers according to the general formula A-K—X—K-A, where —X— is a polyarylene ether segment with number-average molar mass of at least 5000 g/mol, and A- is a segment of the general structure R2NH—(R1—NH—CO—Ar—CO—NH)n—R1—NH—, in which R1 is a linear or branched alkylene group having from 2 to 12 carbon atoms and Ar is an arylene group having from 6 to 18 carbon atoms, and R2 is selected from aryloyl, alkyloyl, and H, and in which the number average of n is from 1 to 3, and there is a coupling group K of the structure —CO—Ar3—CO— linking each A to X, in which Ar13 is an aromatic group having from 6 to 18 carbon atoms. The present invention also relates to a process for the production of the polyarylene ether block copolymers of the invention, to polymer compositions comprising the polyarylene ether block copolymers of the invention, and also to the use thereof for the production of moldings, of films, of fibers, or of foams.
摘要翻译：本发明涉及根据通式AKXKA的聚亚芳基醚嵌段共聚物，其中-X-是具有至少5000g / mol的数均摩尔质量的聚亚芳基醚链段，A-是通式结构的一部分R2NH - （R1-NH-CO-Ar-CO-NH）n-R1-NH-，其中R1是具有2至12个碳原子的直链或支链亚烷基，Ar是具有6至18个碳原子的亚芳基原子，R 2选自芳氧基，烷酰基和H，其中n的数均为1〜3，并且存在连接各A至X的结构-CO-Ar 3 -CO的结合基团K ，其中Ar 13是具有6至18个碳原子的芳族基团。本发明还涉及本发明的聚亚芳基醚嵌段共聚物的制备方法，包括本发明的聚亚芳基醚嵌段共聚物的聚合物组合物，以及其用于制备模制品的用途纤维，或泡沫。

95. 发明授权

US08491671B2 Mixture of dispersing agents 有权
标题翻译：分散剂的混合物
公开(公告)号：US08491671B2
公开(公告)日：2013-07-23
申请号：US10582307
申请日：2004-12-01
申请人： Byron Scott Bailey, Sr. , Bruce Owen Griffin , Brenda W. Lyons , Martin Weber , Bruno Saretto , Heinrich Schlingmann , Georges Mahler
发明人： Byron Scott Bailey, Sr. , Bruce Owen Griffin , Brenda W. Lyons , Martin Weber , Bruno Saretto , Heinrich Schlingmann , Georges Mahler
IPC分类号： C09B67/00 , C09B67/10 , D06P1/00
CPC分类号： D06P1/58 , C08G65/2609 , C08L61/00 , C08L61/18 , C08L71/02 , D06M13/12 , D06M13/165 , D06M13/352 , D06M15/412 , D06M15/53 , D06P1/56 , D06P1/6131 , D06P1/6426 , D06P1/65112 , D06P1/65131 , D06P3/54 , C08L2666/16
摘要： The present invention relates to a mixture of at least two different dispersing agents, an aqueous dispersion containing a UV absorber selected from benzotriazoles, benzotriazines and benzophenones and a mixture of at least two different dispersing agents and a method for reducing the differential pressure in the static dyeing process.
摘要翻译：本发明涉及至少两种不同分散剂的混合物，含有选自苯并三唑，苯并三嗪和二苯甲酮的紫外线吸收剂的水性分散体和至少两种不同分散剂的混合物，以及降低静态压差的方法染色工艺。

96. 发明授权

US08440761B2 Lighting elements composed of polyesters 有权
标题翻译：由聚酯组成的照明元件
公开(公告)号：US08440761B2
公开(公告)日：2013-05-14
申请号：US11994937
申请日：2006-07-13
申请人： Andreas Eipper , Martin Weber , Carsten Weiss
发明人： Andreas Eipper , Martin Weber , Carsten Weiss
IPC分类号： C08L67/00 , C08F12/08
CPC分类号： C08L67/02 , C08L25/14 , C08L2666/06
摘要： Lighting elements composed of thermoplastic molding compositions comprising A) from 10 to 99.9% by weight of at least one thermoplastic polyester, B) from 0.1 to 50% by weight of at least one terpolymer, obtainable from b1) at least one vinylaromatic monomer, b2) at least one C1-C4-alkyl (meth)acrylate or (meth)acrylonitrile, and b3) from 0.1 to 10% by weight, based on the total weight of the components b1) to b3), of at least one monomer which comprises an α,β-unsaturated anhydride, and C) from 0 to 60% by weight of other additives, where the total of the percentages by weight of components A) to C) is 100%.
摘要翻译：由热塑性模塑组合物组成的照明元件，其包含A）10至99.9重量％的至少一种热塑性聚酯，B）0.1至50重量％的至少一种三元共聚物，可由b1）至少一种乙烯基芳族单体，b2 ）至少一种（甲基）丙烯酸C 1 -C 4烷基酯或（甲基）丙烯腈，和b3）基于组分b1）至b3）的总重量为0.1至10重量％的至少一种单体，包括α，β-不饱和酸酐和C）0至60重量％的其它添加剂，其中组分A）至C）的重量百分比的总和为100％。

97. 发明授权

US08398766B2 Semiconductor wafer composed of monocrystalline silicon and method for producing it 有权
标题翻译：由单晶硅组成的半导体晶片及其制造方法
公开(公告)号：US08398766B2
公开(公告)日：2013-03-19
申请号：US12548862
申请日：2009-08-27
申请人： Timo Mueller , Gudrun Kissinger , Walter Heuwieser , Martin Weber
发明人： Timo Mueller , Gudrun Kissinger , Walter Heuwieser , Martin Weber
IPC分类号： C30B15/02
CPC分类号： C30B29/06 , C30B15/04 , C30B15/203 , C30B15/305 , C30B30/04 , C30B33/02
摘要： Semiconductor wafers composed of monocrystalline silicon and doped with nitrogen contain an OSF region and a Pv region, wherein the OSF region extends from the center radially toward the edge of the wafer as far as the Pv region; the wafer has an OSF density of less than 10 cm−2, a BMD density in the bulk of at least 3.5×108 cm−3, and a radial distribution of the BMD density with a fluctuation range BMDmax/BMDmin of not more than 3. The wafers are produced by controlling initial nitrogen content and maintaining oxygen within a narrow window, followed by a heat treatment.
摘要翻译：由单晶硅构成并掺杂有氮的半导体晶片包含OSF区域和Pv区域，其中OSF区域从中心径向延伸至晶片边缘至Pv区域; 晶片具有小于10cm -2的OSF密度，至少3.5×10 8 cm -3的本体的BMD密度以及具有不大于3的波动范围BMDmax / BMDmin的BMD密度的径向分布通过控制初始氮含量并将氧保持在窄窗口内，然后进行热处理来生产晶片。

98. 发明申请

US20130035457A1 PROCESS FOR PREPARING A BLOCK COPOLYMER 有权
标题翻译：制备嵌段共聚物的方法
公开(公告)号：US20130035457A1
公开(公告)日：2013-02-07
申请号：US13566096
申请日：2012-08-03
申请人： Martin Weber , Thomas Weiß , Christian Maletzko , Bastiaan Bram Pieter Staal , Claudia Spang
发明人： Martin Weber , Thomas Weiß , Christian Maletzko , Bastiaan Bram Pieter Staal , Claudia Spang
IPC分类号： C08G65/48
CPC分类号： C08G65/48 , C08G65/2612 , C08G2261/126 , C08L71/02 , C08L2205/05 , C08L81/06
摘要： The present invention relates to a process for preparing a block copolymer comprising poly-arylene ether and polyalkylene oxide blocks, comprising the reaction of an HO-terminated poly-arylene ether with a monomeric alkylene oxide.The present invention also relates to a block copolymer obtainable from this process.The invention additionally relates to a triblock polymer with polyalkylene oxide-polyaryl ether-polyalkylene oxide blocks.
摘要翻译：本发明涉及一种制备包含聚亚芳基醚和聚环氧烷嵌段的嵌段共聚物的方法，其包括HO封端的聚亚芳基醚与单体烯化氧的反应。本发明还涉及可从该方法得到的嵌段共聚物。本发明还涉及具有聚环氧烷 - 聚芳基醚 - 聚环氧烷嵌段的三嵌段聚合物。

99. 发明申请

US20130023619A1 PROCESS FOR PRODUCING THERMOPLASTIC MOLDING COMPOSITIONS BASED ON STYRENE COPOLYMERS AND POLYAMIDE WITH IMPROVED TOUGHNESS 失效
标题翻译：基于苯乙烯共聚物和具有改善的韧性的聚酰胺制造热塑性成型组合物的方法
公开(公告)号：US20130023619A1
公开(公告)日：2013-01-24
申请号：US13547830
申请日：2012-07-12
申请人： Martin Weber , Marko Blinzler , Norbert Güntherberg
发明人： Martin Weber , Marko Blinzler , Norbert Güntherberg
IPC分类号： C08L77/00 , C08L21/00 , C08L33/20
CPC分类号： C08L77/00 , C08K5/1539 , C08K7/00 , C08L25/12 , C08L33/20 , C08L51/04
摘要： Processes for producing thermoplastic molding compositions, which comprise a) from 3 to 79% by weight of one or more (methyl)styrene-acrylonitrile copolymers, which have no maleic-anhydride-derived units, b) from 15 to 91% by weight of one or more polyamides, c) from 5 to 50% by weight of one or more rubbers, d) from 1 to 25% by weight of one or more compatibilizers, e) from 0 to 2% by weight of one or more low-molecular-weight compounds which comprise a dicarboxylic anhydride group, f) from 0 to 50% by weight of one or more fibrous or particulate fillers, and g) from 0 to 40% by weight of further additives, by producing a melt comprising components A, B, and C in a first step and subsequently incorporating D, Also, thermoplastic molding compositions obtainable by these processes, the use of these thermoplastic molding compositions, and moldings, fibers, and foils comprising these thermoplastic molding compositions.
摘要翻译：制备热塑性模塑组合物的方法，其包含a）3至79重量％的一种或多种（甲基）苯乙烯 - 丙烯腈共聚物，其不具有马来酸酐衍生的单元，b）15至91重量％一种或多种聚酰胺，c）5至50重量％的一种或多种橡胶，d）1至25重量％的一种或多种相容剂，e）0至2重量％的一种或多种低聚物，包含二羧酸酐基团的分子量化合物，f）0至50重量％的一种或多种纤维或颗粒填料，和g）0至40重量％的其它添加剂，通过制备包含组分A ，B和C，并且随后掺入D。此外，可通过这些方法获得的热塑性模塑组合物，这些热塑性模塑组合物的使用以及包含这些热塑性模塑组合物的模制品，纤维和箔。

100. 发明申请

US20120153233A1 THERMOPLASTIC MOLDING COMPOSITION 有权
标题翻译：热塑性成型组合物
公开(公告)号：US20120153233A1
公开(公告)日：2012-06-21
申请号：US13332424
申请日：2011-12-21
申请人： Cecile Gibon , Xin Yang , Christof Kujat , Martin Weber , Laszlo Szarvas , Daniel Klein , Petra Poetschke , Beate Krause
发明人： Cecile Gibon , Xin Yang , Christof Kujat , Martin Weber , Laszlo Szarvas , Daniel Klein , Petra Poetschke , Beate Krause
IPC分类号： H01B1/24 , B82Y30/00
CPC分类号： H01B1/24 , B82Y30/00
摘要： The thermoplastic molding composition comprises, based on the thermoplastic molding composition, a) at least one polyamide, copolyamide or a polyamide-comprising polymer blend as component A, b) from 0.1 to 10% by weight of carbon nanotubes, graphenes or mixtures thereof as component B, c) from 0.1 to 3% by weight of ionic liquids as component C, wherein the thermoplastic molding composition does not comprise any polyamide-12 units.
摘要翻译：热塑性模塑组合物基于热塑性模塑组合物包含a）至少一种聚酰胺，共聚酰胺或含聚酰胺的聚合物共混物作为组分A，b）0.1至10重量％的碳纳米管，石墨烯或其混合物作为组分B，c）0.1至3重量％的作为组分C的离子液体，其中热塑性模塑组合物不包含任何聚酰胺-12单元。

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