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91. 发明授权

US4810528A Process for producing multilayer circuit board 失效
标题翻译：多层电路板生产工艺
公开(公告)号：US4810528A
公开(公告)日：1989-03-07
申请号：US901335
申请日：1986-08-28
申请人： Kazuo Kondo , Hisaharu Shiromizu , Asao Morikawa , Tsuneyuki Sukegawa
发明人： Kazuo Kondo , Hisaharu Shiromizu , Asao Morikawa , Tsuneyuki Sukegawa
IPC分类号： C03C17/36 , H05K1/03 , H05K1/09 , H05K3/12 , H05K3/46 , B05D5/12
CPC分类号： H05K3/4667 , H05K1/092 , H05K1/0306
摘要： A process for producing a multilayer circuit board composed of crystallized glass and copper-metallized circuit patterns, which comprises:(1) providing a green sheet of a crystallizable glass powder;(2) providing a copper paste comprising copper component (copper and/or copper oxide) and a glass powder in a proportion by weight of the copper component to the glass powder 95:5 to 75:25, copper oxide being calculated on copper;(3) printing a circuit pattern of the copper paste of step (2) on the green sheet of step (1);(4) coating on the green sheet of step (3) an insulating paste to form an insulating layer except for regions assigned for through holes;(5) printing on the insulating layer of step (4) a circuit pattern of the copper paste of step (2) and filling said holes with the copper paste make a conductive connection through said holes;(6) decomposing the binders by heating the product of step (5) under an oxidizing atmosphere at 400.degree.-850.degree. C.; and(7) heating the product of step (6) at 850.degree.-1050.degree. C. under a reducing atmosphere for a period of time sufficient to reduce copper oxide, sinter the product of step (6) and crystallize said glasses.After step (5), pairs of steps (4) and (5) are repeated to make multilayer circuit boards.
摘要翻译：一种由结晶玻璃和铜金属化电路图形成的多层电路板的制造方法，其特征在于，包括：（1）提供可结晶玻璃粉末的生片; （2）将铜成分（铜和/或氧化铜）和铜成分重量比的玻璃粉末提供给玻璃粉末95:5〜75:25，铜计算的铜膏; （3）在步骤（1）的生片上印刷步骤（2）的铜浆的电路图案; （4）在步骤（3）的生片上涂覆绝缘膏，以形成除了通孔的区域之外的绝缘层; （5）在步骤（4）的绝缘层上印刷步骤（2）的铜浆的电路图案并用铜浆填充所述孔，通过所述孔形成导电连接; （6）通过在400-850℃的氧化气氛下加热步骤（5）的产物来分解粘合剂; 和（7）在还原气氛下，在850〜-1050℃下加热步骤（6）的产物一段足以减少氧化铜的时间，烧结步骤（6）的产物并使所述玻璃结晶。在步骤（5）之后，重复步骤（4）和（5），以制造多层电路板。

92. 发明授权

US4746578A Glaze compositions for ceramic substrates 失效
标题翻译：陶瓷基材的釉料组合物
公开(公告)号：US4746578A
公开(公告)日：1988-05-24
申请号：US847480
申请日：1986-04-03
申请人： Kazuo Kondo , Tatsunori Kurachi , Masahiko Okuyama
发明人： Kazuo Kondo , Tatsunori Kurachi , Masahiko Okuyama
IPC分类号： C03C8/02 , C03C8/04 , C03C8/00
CPC分类号： C03C8/02 , C03C8/04
摘要： Glaze compositions for ceramic substrates such as an alumina substrate are described. In a first embodiment, the glaze composition consists of 55 to 75 mol % SiO.sub.2, 1 to 15 mol % Al.sub.2 O.sub.3, 3 to 20 mol % CaO, 1 to 13 mol % BaO and 0.1 to 5 mol % Y.sub.2 O.sub.3. In a second embodiment, the glaze composition consists essentially of 55 to 75 mol % SiO.sub.2, 1 to 15 mol % Al.sub.2 O.sub.3, 3 to 20 mol % CaO, 1 to 13 mol % BaO, 1 to 5 mol % Y.sub.2 O.sub.3, 25 mol % or less SrO, 7 mol % or less B.sub.2 O.sub.3, 2 mol % or less ZnO and 2 mol % or less MgO. In a third embodiment, the glaze composition consists essentially of 58 to 75 mol % SiO.sub.2, 2 to 15 mol % Al.sub.2 O.sub.3, 0.5 to 5 mol % La.sub.2 O.sub.3, 2 to 20 mol % CaO and 1 to 13 mol % BaO. In a fourth embodiment, the glaze composition consists essentially of 58 to 75 mol % SiO.sub.2, 2 to 15 mol % Al.sub.2 O.sub.3, 0.5 to 5 mol % La.sub.2 O.sub.3, 2 to 20 mol % CaO, 1 to 13 mol % BaO, 25 mol % or less SrO, 2 mol % or less MgO, 7 mol % or less B.sub.2 O.sub.3, and 5 mol % or less Y.sub.2 O.sub.3. These glaze compositions are suitable for use in surface glazing of ceramic substrates for thermal heads, printer heads, etc.
摘要翻译：描述了诸如氧化铝衬底的陶瓷衬底的釉料组合物。在第一实施方案中，釉料组合物由55至75mol％的SiO 2，1至15mol％的Al 2 O 3，3至20mol％的CaO，1至13mol％的BaO和0.1至5mol％的Y 2 O 3组成。在第二实施方案中，釉料组合物基本上由55至75mol％的SiO 2，1至15mol％的Al 2 O 3，3至20mol％的CaO，1至13mol％的BaO，1至5mol％的Y 2 O 3，25mol％或较少的SrO，7摩尔％以下的B2O3，2摩尔％以下的ZnO和2摩尔％以下的MgO。在第三实施方案中，釉料组合物基本上由58至75mol％的SiO 2，2至15mol％的Al 2 O 3，0.5至5mol％的La 2 O 3，2至20mol％的CaO和1至13mol％的BaO组成。在第四实施方案中，釉料组合物基本上由58至75mol％的SiO 2，2至15mol％的Al 2 O 3，0.5至5mol％的La 2 O 3，2至20mol％的CaO，1至13mol％的BaO，25mol％或较少的SrO，2摩尔％以下的MgO，7摩尔％以下的B2O3和5摩尔％以下的Y2O3。这些釉料组合物适用于用于热敏头，打印头等陶瓷基材的表面玻璃。

93. 发明授权

US4731214A Process for preparing a thermally shrinkable multilayer film 失效
标题翻译：制备热收缩多层膜的方法
公开(公告)号：US4731214A
公开(公告)日：1988-03-15
申请号：US921161
申请日：1986-10-21
申请人： Kazuo Kondo , Nobuya Ishiguro
发明人： Kazuo Kondo , Nobuya Ishiguro
IPC分类号： B29C47/04 , B29C55/02 , B29C55/26 , B29C61/06 , B29K29/00 , B29L9/00 , B32B27/28 , B29C55/10
CPC分类号： B29C61/0616 , B29C55/26 , B29K2077/00 , B29K2995/0049
摘要： The process for preparing a thermally shrinkable multilayer film composed of a polyamide resin layer as one surface layer and a sealant material layer as the other surface layer includes the step of causing the polyamide resin layer of the oriented laminate film to absorb water in the amount of 7.0% by weight or more before or during the thermal treatment. The laminate film is then dried so as to cause the polyamide resin layer to make the water content in the range form 2.5% by weight to 6.5% by weight while maintaining the oriented laminate film at temperatures of 90.degree. C. or lower after or during the thermal treatment. The thermally shrinkable multilayer film thus prepared is suitable for thermally shrinking packing foods such as roast meat or fresh cut meat.
摘要翻译：制备作为一个表面层的聚酰胺树脂层和作为另一个表面层的密封剂材料层构成的热收缩多层膜的方法包括以下步骤：使取向层压膜的聚酰胺树脂层以在热处理之前或期间为7.0重量％以上。然后干燥该层压膜，使得聚酰胺树脂层的水含量在2.5重量％至6.5重量％的范围内，同时在定向层压膜在90℃或更低的温度下或之后保持热处理。如此制备的热收缩多层膜适用于热收缩包装食品如烤肉或鲜切肉。

94. 发明授权

US4695491A Heat-shrinkable composite packaging film 失效
标题翻译：热收缩复合包装膜
公开(公告)号：US4695491A
公开(公告)日：1987-09-22
申请号：US739655
申请日：1985-05-31
申请人： Kazuo Kondo , Nobuya Ishiguro , Teruo Tada
发明人： Kazuo Kondo , Nobuya Ishiguro , Teruo Tada
IPC分类号： B32B7/02 , B29C61/06 , B32B27/28 , B32B27/32 , B65D65/40 , B65D85/00 , B32B27/00
CPC分类号： B32B27/32 , B29C61/0616 , Y10S428/91 , Y10T428/1328 , Y10T428/24967 , Y10T428/24975 , Y10T428/2826 , Y10T428/31746 , Y10T428/31913 , Y10T428/3192 , Y10T428/31928
摘要： A heat-shrinkable, composite packaging film comprising (a) a core layer of saponified ethylene-vinyl acetate copolymer; (b) a first polymeric outer wall bonded to one side of the core layer; and (c) a second, heat-sealable polymeric outer wall bonded to the other side of the core layer; said first and second outer walls each having a permeability to hot water having a temperature of 90.degree. C. of less than 600 g/m.sup.2 /hour. The film is suitable for packaging meat and other food products subjected to sterilization and heat-shrinking process in a hot water bath.
摘要翻译：一种热收缩复合包装膜，其包含（a）皂化乙烯 - 乙酸乙烯酯共聚物的芯层; （b）结合到芯层的一侧的第一聚合物外壁; 和（c）结合到芯层的另一侧的第二可热封的聚合物外壁; 所述第一和第二外壁各自具有低于600g / m 2 /小时的温度为90℃的热水的渗透性。该膜适用于在热水浴中包装经过灭菌和热收缩处理的肉类和其他食品。

95. 发明授权

US4689579A Analog integrated circuit 失效
标题翻译：模拟集成电路
公开(公告)号：US4689579A
公开(公告)日：1987-08-25
申请号：US721132
申请日：1985-04-08
申请人： Akira Shibata , Kazuo Kondo , Koichi Hirose
发明人： Akira Shibata , Kazuo Kondo , Koichi Hirose
IPC分类号： H01L27/06 , H01L27/07 , H03F3/45 , H01L27/02
CPC分类号： H01L27/0794 , H01L27/0652
摘要： A high-density analog integrated circuit having built-in resistor elements formed simultaneously with the formation of the base of transistor is disclosed in which a high-resistance element is formed of an ion-implanted resistor, a low-resistance element is formed of a base-diffused resistor, and a pair of high-resistance elements are connected in such a manner that a difference between a signal current flowing through one of the high-resistance elements and another signal current flowing through the other high-resistance element is outputted, and in which an ion-implanted resistor having a high resistance and a thin film capacitor having a small capacitance make up a built-in time constant circuit, which makes it possible to integrate on one semiconductor chip circuits such as a filter circuit for video signal and an input bias circuit.
摘要翻译：公开了一种具有与形成晶体管基极同时形成的内置电阻元件的高密度模拟集成电路，其中高电阻元件由离子注入电阻器形成，低电阻元件由基极扩散电阻器和一对高电阻元件以这样的方式连接，使得流过高电阻元件中的一个的信号电流与流过另一个高电阻元件的另一个信号电流之间的差异被输出，其中具有高电阻的离子注入电阻器和具有小电容的薄膜电容器构成内置的时间常数电路，这使得可以集成在一个半导体芯片电路上，例如用于视频信号的滤波器电路和输入偏置电路。

96. 发明授权

US4687615A Method of producing biaxially oriented tubular polyetheretherketone films 失效
标题翻译：双轴取向管状聚醚醚酮薄膜的制备方法
公开(公告)号：US4687615A
公开(公告)日：1987-08-18
申请号：US776545
申请日：1985-09-16
申请人： Kazuo Kondo , Satoshi Maruyama
发明人： Kazuo Kondo , Satoshi Maruyama
IPC分类号： B29C47/00 , B29C47/88
CPC分类号： B29C47/00 , B29C47/0021 , B29C47/0026 , B29C47/0057 , B29K2071/00
摘要： A method of producing biaxially oriented tubular polyetheretherketone films having good optical and mechanical properties and heat resistance, by rapidly quenching at a rate of at least 24.degree. C. per second an unoriented tubular polyetheretherketone film as melt-extruded through a circular die thereby imparting a crystallinity of not greater than 10% to the film, and continuously introducing the thus produced film into the space between a feed nip roll pair and a pull nip roll pair while reheating the film externally to a temperature of 60.degree.-140.degree. C. and allowing the film to expand under the influence of the internal pressure to an areal draw ratio of 4-36, to thereby attain biaxial orientation.
摘要翻译：一种制备双轴取向的管状聚醚醚酮膜的方法，其通过以每秒至少24℃的速度快速淬火，通过圆形模头熔融挤出的无取向的管状聚醚醚酮膜，从而赋予双轴取向的管状聚醚醚酮膜，结晶度不大于10％，并且将如此制得的膜连续地引入到进给辊辊对和拉压辊辊对之间的空间中，同时将膜外部再加热到60-140℃的温度，使膜在内部压力的影响下膨胀至面积拉伸比为4-36，从而获得双轴取向。

97. 发明授权

US4649070A Substrate for an integrated circuit 失效
标题翻译：集成电路基板
公开(公告)号：US4649070A
公开(公告)日：1987-03-10
申请号：US808565
申请日：1985-12-13
申请人： Kazuo Kondo , Tsuneyuki Sukegawa
发明人： Kazuo Kondo , Tsuneyuki Sukegawa
IPC分类号： C03C10/00 , H01L21/48 , H01L23/15 , B32B3/00 , B32B15/04
CPC分类号： C03C10/0045 , C03C10/0054 , H01L21/4807 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： A substrate for supporting an integrated circuit made of a ceramic member with a thin film of conductive metal applied to the ceramic member. The ceramic member consists essentially of a sintered ceramic material capable of forming a surface finish upon sintering, having a roughness that is less than 10 times the thickness dimension of the conductive film applied thereto. The ceramic material is either crystalline glass or a glass-coated ceramic.
摘要翻译：一种用于支撑由陶瓷构件制成的集成电路的基板，其具有施加到陶瓷构件的导电金属薄膜。陶瓷构件基本上由烧结陶瓷材料组成，其能够在烧结时形成表面光洁度，其粗糙度小于施加到其上的导电膜的厚度尺寸的10倍。陶瓷材料是结晶玻璃或玻璃涂层陶瓷。

98. 发明授权

US4540671A Glass-ceramic product 失效
标题翻译：玻璃陶瓷制品
公开(公告)号：US4540671A
公开(公告)日：1985-09-10
申请号：US552190
申请日：1983-11-15
申请人： Kazuo Kondo , Masahiko Okuyama
发明人： Kazuo Kondo , Masahiko Okuyama
IPC分类号： C03C10/14 , C03B32/02 , C03C10/00 , C03C10/08 , H01B3/08 , C03C3/22 , C03B32/00 , C04B33/34
CPC分类号： C03C10/0054 , C03C10/0045 , Y10S428/901
摘要： A glass-ceramic product is disclosed. The glass product is produced by combining 0.1 to 6 wt % of a compound selected from the group consisting of B.sub.2 O.sub.3 and P.sub.2 O.sub.5 with a mixture. The mixture includes 54 to 63 wt % SiO.sub.2, 20 to 28 wt % Al.sub.2 O.sub.3, 10 to 18 wt % MgO and 2 to 6 wt % ZnO. From the combined compound and mixture are formed a glassy material and then glassy material is ground in order to form a frit. The frit is then molded and the molded frit is fired into a crystalline form. The resulting glass-ceramic product has a low permittivity as compared with alumina and low power factor tan .delta.. Further, the product has a coefficient of thermal expansion which is comparable with the value for silicon semiconductor chips. The product also has other desirable characteristics such as its firing and crystallizing temperature, moisture absorption and mechanical strength.
摘要翻译：公开了一种玻璃陶瓷产品。通过混合0.1〜6重量％的选自B 2 O 3和P 2 O 5的化合物来制造玻璃制品。该混合物包括54至63重量％的SiO 2，20至28重量％的Al 2 O 3，10至18重量％的MgO和2至6重量％的ZnO。从组合的化合物和混合物形成玻璃状材料，然后研磨玻璃状材料以形成玻璃料。然后将玻璃料模制，并将模制的玻璃料烧成结晶形式。所得到的玻璃陶瓷产品与氧化铝和低功率因数tanδ相比具有低介电常数。此外，该产品具有与硅半导体芯片的值相当的热膨胀系数。该产品还具有其它理想的特性，例如其焙烧和结晶温度，吸湿性和机械强度。

99. 发明授权

US4523711A Method for bonding silver-based contact 失效
标题翻译：银基触点接合方法
公开(公告)号：US4523711A
公开(公告)日：1985-06-18
申请号：US301864
申请日：1981-09-14
申请人： Kazuo Kondo , Seiji Imamura , Shigemasa Saito , Mamoru Akimoto , Mitsuo Sunaga
发明人： Kazuo Kondo , Seiji Imamura , Shigemasa Saito , Mamoru Akimoto , Mitsuo Sunaga
IPC分类号： B23K1/19 , B23K20/16 , B23K1/04
CPC分类号： B23K1/19 , B23K20/16
摘要： The method of bonding silver-based contact is disclosed. A silver-based contact is brought into contact with a support, at least the surface of which is made of a cupreous material, with a pressure of less than 1 kgf/cm.sup.2 exerted therebetween. The contact and support are heated in a non-oxidizing atmosphere at a temperature of more than 700.degree. C.
摘要翻译：揭示了接合银基触点的方法。使银基触点与至少其表面由铜材料制成的支撑体接触，其间施加小于1kgf / cm 2的压力。接触和载体在高于700℃的非氧化性气氛中加热。

100. 发明授权

US4374942A Powder having a negative coefficient of linear thermal expansion and a composition containing the same 失效
标题翻译：具有负的线性热膨胀系数的粉末和含有它们的组合物
公开(公告)号：US4374942A
公开(公告)日：1983-02-22
申请号：US386811
申请日：1982-06-09
申请人： Akio Takami , Kazuo Kondo
发明人： Akio Takami , Kazuo Kondo
IPC分类号： C03C8/24 , B32B15/16 , B32B17/06 , B32B27/20
CPC分类号： C03C8/24 , Y10T428/2996
摘要： A powder having a negative coefficient of linear thermal expansion and sealing compositions containing the same are disclosed wherein the powder is a .beta.-eucryptite particle having on the surface thereof a layer of tin oxide, titanium oxide, and/or zirconium oxide.
摘要翻译：公开了具有负的线性热膨胀系数的粉末和包含该粉末的密封组合物的粉末，其中粉末是在其表面上具有氧化锡，氧化钛和/或氧化锆层的β-锂辉石颗粒。

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