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91. 发明申请

US20100056023A1 Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing 有权
标题翻译：通过在处理过程中使用基板的光谱监测来调整抛光速率
公开(公告)号：US20100056023A1
公开(公告)日：2010-03-04
申请号：US12553870
申请日：2009-09-03
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek
IPC分类号： B24B49/06 , B24B49/12
CPC分类号： B24B37/005 , B24B37/013 , B24B49/12 , H01L21/302
摘要： A computer-implemented method includes receiving a sequence of current spectra of reflected light from a substrate; comparing each current spectrum from the sequence of current spectra to a plurality of reference spectra from a reference spectra library to generate a sequence of best-match reference spectra; determining a goodness of fit for the sequence of best-match reference spectra; and determining at least one of whether to adjust a polishing rate or an adjustment for the polishing rate, based on the goodness of fit.
摘要翻译：计算机实现的方法包括从基板接收反射光的当前光谱序列; 将来自当前光谱序列的每个当前光谱与来自参考光谱库的多个参考光谱进行比较，以生成最佳匹配参考光谱的序列; 确定最佳匹配参考光谱序列的拟合优度; 以及基于拟合优度确定是否调整抛光速率或抛光速率的调整中的至少一个。

92. 发明授权

US07657342B2 Substrate thickness measuring during polishing 有权
公开(公告)号：US07657342B2
公开(公告)日：2010-02-02
申请号：US12185719
申请日：2008-08-04
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： G06F19/00 , H01L21/00 , B24B49/00
摘要： A computer program product that determines a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matches the spectra with indexes in a library and uses the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.

93. 发明授权

US07614933B2 Polishing pad assembly with glass or crystalline window 有权
标题翻译：带玻璃或结晶窗的抛光垫组件
公开(公告)号：US07614933B2
公开(公告)日：2009-11-10
申请号：US11945987
申请日：2007-11-27
申请人： Dominic J. Benvegnu , Jeffrey Drue David , Bogdan Swedek
发明人： Dominic J. Benvegnu , Jeffrey Drue David , Bogdan Swedek
IPC分类号： B24B49/12
CPC分类号： H01L22/26 , B24B37/013 , B24B37/205 , B24B49/08 , B24B49/12 , B24D7/14 , H01L21/30625 , H01L21/31053 , H01L21/31055 , H01L21/3212 , H01L21/67075 , H01L21/67092 , H01L21/67253
摘要： Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. The top surface is a polishing surface. The pad includes a window that includes a first portion made of soft plastic and a crystalline or glass like second portion. The window is transparent to white light. The window is situated in the aperture so that the first portion plugs the aperture and the second portion is on a bottom side of the first portion, wherein the first portion acts a slurry-tight barrier.
摘要翻译：用于提供化学机械抛光垫的方法和设备。衬垫包括具有顶表面和底表面的抛光层。垫包括在顶表面中具有第一开口和底表面中的第二开口的孔。顶面是抛光面。该垫包括一个窗，其包括由软塑料制成的第一部分和类似第二部分的晶体或玻璃。窗户对白光透明。窗口位于孔中，使得第一部分插入孔，并且第二部分在第一部分的底侧上，其中第一部分起浆料密封的屏障。

94. 发明申请

US20080305729A1 THIN POLISHING PAD WITH WINDOW AND MOLDING PROCESS 有权
标题翻译：具有窗口和成型工艺的薄型抛光垫
公开(公告)号：US20080305729A1
公开(公告)日：2008-12-11
申请号：US12130670
申请日：2008-05-30
申请人： Dominic J. Benvegnu , Jimin Zhang , Thomas H. Osterheld , Boguslaw A. Swedek
发明人： Dominic J. Benvegnu , Jimin Zhang , Thomas H. Osterheld , Boguslaw A. Swedek
IPC分类号： B24D11/00 , B29C45/14
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.
摘要翻译：描述了具有抛光层的抛光垫，抛光层具有抛光表面，在抛光层的与抛光层相对的一侧上的粘合剂层以及延伸穿过模制到抛光层的固体透光窗。窗口具有与抛光表面共面的顶表面和与粘合剂层的下表面共面的底表面。制造抛光垫的方法包括通过抛光层和粘合剂层形成孔，将背衬片固定在与抛光层的抛光表面相对的一侧上的粘合剂层上，将液体聚合物分配到孔中，并固化液体聚合物形成窗口。

95. 发明授权

US07406394B2 Spectra based endpointing for chemical mechanical polishing 有权
标题翻译：基于光谱的化学机械抛光终点
公开(公告)号：US07406394B2
公开(公告)日：2008-07-29
申请号：US11261742
申请日：2005-10-28
申请人： Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
发明人： Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
IPC分类号： G01B5/02 , G01B7/02 , G01B11/02 , G01B13/02
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , B24B49/08 , B24D7/14 , G05B15/02 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectra is selected for particular spectra-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectra-based endpoint logic. The method includes obtaining two or more current spectra. Each current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved.
摘要翻译：用于基于频谱的终点的方法和装置。一种终点方法包括选择两个或更多个参考光谱。每个参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。为特定的基于光谱的端点确定逻辑选择参考光谱，以便通过应用特定的基于光谱的端点逻辑来调用端点时实现目标厚度。该方法包括获得两个或更多个当前光谱。每个电流光谱是当感兴趣的膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二衬底上从感兴趣的膜反射的白光的光谱。该方法包括为第二基底确定何时已经实现了抛光步骤的终点。

96. 发明授权

US07226339B2 Spectrum based endpointing for chemical mechanical polishing 有权
公开(公告)号：US07226339B2
公开(公告)日：2007-06-05
申请号：US11213674
申请日：2005-08-26
申请人： Dominic J. Benvegnu , Jeffrey Drue David , Bogdan Swedek
发明人： Dominic J. Benvegnu , Jeffrey Drue David , Bogdan Swedek
IPC分类号： B24B49/00
CPC分类号： H01L22/26 , B24B37/013 , B24B37/205 , B24B49/08 , B24B49/12 , B24D7/14 , H01L21/30625 , H01L21/31053 , H01L21/31055 , H01L21/3212 , H01L21/67075 , H01L21/67092 , H01L21/67253
摘要： Methods and apparatus for providing a flushing system for flushing a top surface of an optical head. The flushing system includes a source of gas configured to provide a flow of gas, a delivery nozzle, a delivery line that connects the source of gas to the delivery nozzle, a vacuum source configured to provide a vacuum, a vacuum nozzle, and a vacuum line that connects the vacuum source to the vacuum nozzle. The source of gas and the delivery nozzle are configured to direct a flow of gas across the top surface of the optical head. The vacuum nozzle and vacuum sources are configured so that the flow if gas is laminar.

97. 发明授权

US07195535B1 Metrology for chemical mechanical polishing 有权
标题翻译：化学机械抛光测量
公开(公告)号：US07195535B1
公开(公告)日：2007-03-27
申请号：US11187612
申请日：2005-07-22
申请人： Boguslaw A. Swedek , Dominic J. Benvegnu
发明人： Boguslaw A. Swedek , Dominic J. Benvegnu
IPC分类号： B24B49/12 , B24B7/22
CPC分类号： B24B49/12 , B24B37/345
摘要： Methods and apparatus for providing metrology for chemical mechanical polishing. A chemical mechanical polishing system includes a first polishing station, a second polishing station, a transport device, and a first measuring station. The transport device is configured to hold a workpiece during polishing at the first and second polishing stations and to move the workpiece from the first polishing station to the second polishing station. The first measuring station is situated to measure a characteristic of the workpiece when the transport device is holding the workpiece and when the workpiece is not in contact with a polishing pad of any of the first polishing station and the second polishing station.
摘要翻译：提供化学机械抛光测量的方法和设备。化学机械抛光系统包括第一抛光站，第二抛光站，输送装置和第一测量站。输送装置构造成在抛光期间在第一和第二抛光站处保持工件并将工件从第一抛光站移动到第二抛光站。第一测量站用于当传送装置保持工件时以及当工件不与第一抛光站和第二抛光站中的任何一个的抛光垫接触时，测量工件的特性。

98. 发明授权

US07112119B1 Sealed polishing pad methods 失效
标题翻译：密封抛光垫方法
公开(公告)号：US07112119B1
公开(公告)日：2006-09-26
申请号：US11400416
申请日：2006-04-06
申请人： Bogdan Swedek , David J. Lischka , Jeffrey Drue David , Dominic J. Benvegnu
发明人： Bogdan Swedek , David J. Lischka , Jeffrey Drue David , Dominic J. Benvegnu
IPC分类号： B24B7/00
CPC分类号： B24B37/205 , B24D18/00
摘要： A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a sealant that penetrates a second portion of the backing layer adjacent to and surrounding the aperture such that the second portion is substantially impermeable to liquid. The aperture is positioned below a substantially fluid-impermeable element.
摘要翻译：抛光垫，抛光系统，制造抛光垫的方法和抛光垫的使用方法。抛光垫包括具有抛光表面的抛光层，具有孔的背衬层和可渗透液体的第一部分，以及密封剂，该密封剂穿透邻近并包围孔的背衬层的第二部分，使得第二部分对液体基本上是不可渗透的。孔被定位在基本上不透液体的元件之下。

99. 发明授权

US09233450B2 Optical detection of metal layer clearance 有权
标题翻译：光学检测金属层间隙
公开(公告)号：US09233450B2
公开(公告)日：2016-01-12
申请号：US13584565
申请日：2012-08-13
申请人： Jeffrey Drue David , Dominic J. Benvegnu
发明人： Jeffrey Drue David , Dominic J. Benvegnu
IPC分类号： B24B37/013 , B24B37/04 , B24B49/12
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12
摘要： A method of controlling polishing includes polishing a metal layer of a substrate. The metal layer overlies an underlying layer structure. During polishing of the metal layer, a light beam is directed onto the first substrate. The metal layer is sufficiently thin that a portion of the light beam reflects from an exposed surface of the metal layer and a portion of the light beam passes through the metal layer and reflects from the underlying layer structure to generate a reflected light beam. The reflected light beam is monitored during polishing and a sequence of measured spectra is generated from the reflected light beam. At least one of a polishing endpoint or an adjustment for a polishing rate is determined from the sequence of measured spectra.
摘要翻译：控制抛光的方法包括抛光衬底的金属层。金属层覆盖下层结构。在抛光金属层期间，将光束引导到第一基板上。金属层足够薄，使得一部分光束从金属层的暴露表面反射，并且光束的一部分穿过金属层并从下面的层结构反射以产生反射光束。在抛光期间监测反射光束，并从反射光束产生测量光谱序列。从测量光谱的顺序确定抛光终点或抛光速率的调整中的至少一个。

100. 发明授权

US08989890B2 GST film thickness monitoring 有权
标题翻译： GST膜厚度监测
公开(公告)号：US08989890B2
公开(公告)日：2015-03-24
申请号：US12697177
申请日：2010-01-29
申请人： Kun Xu , Feng Liu , Dominic J. Benvegnu , Boguslaw A. Swedek , Yuchun Wang , Wen-Chiang Tu , Laksh Karuppiah
发明人： Kun Xu , Feng Liu , Dominic J. Benvegnu , Boguslaw A. Swedek , Yuchun Wang , Wen-Chiang Tu , Laksh Karuppiah
IPC分类号： G06F19/00 , F04D27/02 , F04B19/16 , F04D23/00 , F01D21/00 , F01D21/20 , C01G9/00 , B24B37/005 , B24B37/013 , B24B49/12 , G01B11/06 , H01L45/00
CPC分类号： H01L22/26 , B24B37/005 , B24B37/013 , B24B49/12 , C01G9/00 , G01B11/0625 , G01B11/0683 , H01L21/30625 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1683
摘要： In polishing a substrate having a layer of GST disposed over an underlying layer, during polishing, a non-polarized light beam is directed onto the layer of GST. The non-polarized light beam reflects from the first substrate to generate a reflected light beam having an infra-red component. A sequence of measurements of intensity of the infra-red component of the reflected light beam are generated, and, in a processor, a time at which the sequence of measurements exhibits a predefined feature is determined.
摘要翻译：在抛光具有设置在下面的层上的GST层的衬底时，在抛光期间，非偏振光束被引导到GST层上。非偏振光束从第一衬底反射以产生具有红外分量的反射光束。产生反射光束的红外分量的强度测量序列，并且在处理器中确定测量序列呈现预定特征的时间。

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