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    • 93. 发明授权
    • Semiconductor device
    • 半导体器件
    • US06492672B1
    • 2002-12-10
    • US09629861
    • 2000-08-01
    • Mizuki SegawaToshiki YabuTakashi UeharaTakashi NakabayashiKyoji YamashitaTakaaki UkedaMasatoshi AraiTakayuki Yamada
    • Mizuki SegawaToshiki YabuTakashi UeharaTakashi NakabayashiKyoji YamashitaTakaaki UkedaMasatoshi AraiTakayuki Yamada
    • H01L27108
    • H01L27/11526H01L21/82345H01L27/0629H01L27/105H01L27/11543H01L28/40Y10S438/957
    • A MOS transistor includes a gate oxide film, and a gate electrode which is formed by a lamination of first and second conductor films. A capacitive element includes a lower capacitive electrode formed of the first conductor film, a capacitive film made of an insulating film which is different from the gate oxide film, an upper capacitive electrode formed of the second conductor film on the capacitive film, and a leading electrode of the lower capacitive electrode formed of the second conductor film. At the same number of steps as in the case where the gate oxide film is used as the capacitive film, a semiconductor device can be manufactured with the capacitive film provided, the capacitive film being made of a nitride film or the like that is different from the gate oxide film. Consequently, a capacitive film having a great capacitance value per unit area is used so that the occupied area can be reduced and an increase in manufacturing cost can be controlled. In the semiconductor device in which a transistor, a capacitive element, a resistive film and the like are provided, the occupied area can be reduced and the manufacturing cost can be cut down.
    • MOS晶体管包括栅极氧化膜和通过第一和第二导体膜的叠层形成的栅电极。 电容元件包括由第一导体膜形成的下部电容电极,由与栅极氧化膜不同的绝缘膜制成的电容膜,由电容膜上的第二导体膜形成的上部电容电极,以及引线 电极由第二导电膜形成。 以与使用栅极氧化膜作为电容膜的情况相同的步骤,可以制造具有设置的电容膜的半导体器件,电容膜由与氮化物膜不同的氮化物膜等构成 栅氧化膜。 因此,使用具有每单位面积的大的电容值的电容膜,从而可以减小占用面积并且可以控制制造成本的增加。 在其中提供晶体管,电容元件,电阻膜等的半导体器件中,可以减小占用面积并且可以减少制造成本。
    • 95. 发明授权
    • Semiconductor device and method for fabricating the same
    • 半导体装置及其制造方法
    • US06445047B1
    • 2002-09-03
    • US09695381
    • 2000-10-25
    • Takayuki YamadaMasaru Moriwaki
    • Takayuki YamadaMasaru Moriwaki
    • H01L2976
    • H01L21/82345H01L29/495H01L29/4966
    • A semiconductor device includes: a first-surface-channel-type MOSFET having a first threshold voltage; and a second-surface-channel-type MOSFET with a second threshold voltage having an absolute value greater than an absolute value of said first threshold voltage. The first-surface-channel-type MOSFET includes: a first gate insulating film formed on a semiconductor substrate; and a first gate electrode, which has been formed out of a poly-silicon film over the first gate insulating film. The second-surface-channel-type MOSFET includes: a second gate insulating film formed on the semiconductor substrate; and a second gate electrode, which has been formed out of a refractory metal film over the second gate insulating film. The refractory metal film is made of a refractory metal or a compound thereof.
    • 半导体器件包括:具有第一阈值电压的第一表面沟道型MOSFET; 以及具有绝对值大于所述第一阈值电压的绝对值的第二阈值电压的第二表面沟道型MOSFET。 第一表面沟道型MOSFET包括:形成在半导体衬底上的第一栅极绝缘膜; 以及在第一栅极绝缘膜上形成的由多晶硅膜形成的第一栅电极。 所述第二表面沟道型MOSFET包括:形成在所述半导体衬底上的第二栅极绝缘膜; 以及在所述第二栅极绝缘膜上形成的难熔金属膜之外的第二栅电极。 难熔金属膜由难熔金属或其化合物制成。