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    • 91. 发明授权
    • Spectrum based endpointing for chemical mechanical polishing
    • 基于光谱的化学机械抛光终点
    • US07764377B2
    • 2010-07-27
    • US11213344
    • 2005-08-26
    • Dominic J. BenvegnuJeffrey Drue DavidBogdan Swedek
    • Dominic J. BenvegnuJeffrey Drue DavidBogdan Swedek
    • G01B11/00
    • H01L22/26B24B37/013B24B37/205B24B49/08B24B49/12B24D7/14H01L21/30625H01L21/31053H01L21/31055H01L21/3212H01L21/67075H01L21/67092H01L21/67253
    • Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.
    • 用于基于频谱的终点的方法和装置。 终点方法包括选择参考频谱。 参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱,并且具有大于目标厚度的厚度。 对于特定的基于频谱的端点确定逻辑,经验地选择参考频谱,使得当通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 该方法包括获得当前频谱。 目前的光谱是当感兴趣的薄膜经受抛光步骤并且具有大于目标厚度的电流厚度时,在第二基板上从感兴趣的薄膜反射的白光的光谱。 该方法包括为第二基底确定何时已经实现了抛光步骤的终点。 该确定基于参考和当前光谱。
    • 93. 发明授权
    • Optical detection of metal layer clearance
    • 光学检测金属层间隙
    • US09233450B2
    • 2016-01-12
    • US13584565
    • 2012-08-13
    • Jeffrey Drue DavidDominic J. Benvegnu
    • Jeffrey Drue DavidDominic J. Benvegnu
    • B24B37/013B24B37/04B24B49/12
    • B24B37/013B24B37/042B24B49/12
    • A method of controlling polishing includes polishing a metal layer of a substrate. The metal layer overlies an underlying layer structure. During polishing of the metal layer, a light beam is directed onto the first substrate. The metal layer is sufficiently thin that a portion of the light beam reflects from an exposed surface of the metal layer and a portion of the light beam passes through the metal layer and reflects from the underlying layer structure to generate a reflected light beam. The reflected light beam is monitored during polishing and a sequence of measured spectra is generated from the reflected light beam. At least one of a polishing endpoint or an adjustment for a polishing rate is determined from the sequence of measured spectra.
    • 控制抛光的方法包括抛光衬底的金属层。 金属层覆盖下层结构。 在抛光金属层期间,将光束引导到第一基板上。 金属层足够薄,使得一部分光束从金属层的暴露表面反射,并且光束的一部分穿过金属层并从下面的层结构反射以产生反射光束。 在抛光期间监测反射光束,并从反射光束产生测量光谱序列。 从测量光谱的顺序确定抛光终点或抛光速率的调整中的至少一个。
    • 94. 发明授权
    • Fitting of optical model to measured spectrum
    • 光学模型拟合到测量光谱
    • US08944884B2
    • 2015-02-03
    • US13773063
    • 2013-02-21
    • Jeffrey Drue DavidDominic J. Benvegnu
    • Jeffrey Drue DavidDominic J. Benvegnu
    • B24B1/00B24B37/013B24B49/12
    • B24B37/013B24B49/12
    • A method of controlling a polishing operation includes polishing a first layer of a substrate, during polishing, obtaining a sequence over time of measured spectra with an in-situ optical monitoring system, for each measured spectrum from the sequence of measured spectra, fitting an optical model to the measured spectrum, the fitting including finding parameters that provide a minimum difference between an output spectrum of the optical model and the measured spectrum, the parameters including an endpoint parameter and at least one non-endpoint parameter, the fitting generating a sequence of fitted endpoint parameter values, each endpoint parameter value of the sequence associated with one of the spectra of the sequence of measured spectra, and determining at least one of a polishing endpoint or an adjustment of a pressure to the substrate from the sequence of fitted endpoint parameter values.
    • 控制抛光操作的方法包括在抛光期间抛光衬底的第一层,利用原位光学监测系统根据测量光谱序列为每个测量光谱获得测量光谱的时间序列, 所述拟合包括找到在所述光学模型的输出光谱与所述测量光谱之间提供最小差异的参数,所述参数包括端点参数和至少一个非端点参数,所述拟合生成序列 拟合的端点参数值,与测量光谱序列的光谱之一相关联的序列的每个端点参数值,以及根据拟合的端点参数序列确定抛光终点或对衬底的压力的调整中的至少一个 价值观。
    • 95. 发明申请
    • Optical Detection of Metal Layer Clearance
    • 金属层清除光学检测
    • US20130052916A1
    • 2013-02-28
    • US13584565
    • 2012-08-13
    • Jeffrey Drue DavidDominic J. Benvegnu
    • Jeffrey Drue DavidDominic J. Benvegnu
    • B24B49/12
    • B24B37/013B24B37/042B24B49/12
    • A method of controlling polishing includes polishing a metal layer of a substrate. The metal layer overlies an underlying layer structure. During polishing of the metal layer, a light beam is directed onto the first substrate. The metal layer is sufficiently thin that a portion of the light beam reflects from an exposed surface of the metal layer and a portion of the light beam passes through the metal layer and reflects from the underlying layer structure to generate a reflected light beam. The reflected light beam is monitored during polishing and a sequence of measured spectra is generated from the reflected light beam. At least one of a polishing endpoint or an adjustment for a polishing rate is determined from the sequence of measured spectra.
    • 控制抛光的方法包括抛光衬底的金属层。 金属层覆盖下层结构。 在抛光金属层期间,将光束引导到第一基板上。 金属层足够薄,使得一部分光束从金属层的暴露表面反射,并且光束的一部分穿过金属层并从下面的层结构反射以产生反射光束。 在抛光期间监测反射光束,并从反射光束产生测量光谱序列。 从测量光谱的顺序确定抛光终点或抛光速率的调整中的至少一个。
    • 97. 发明授权
    • Building a library of spectra for optical monitoring
    • 建立光学监测光谱库
    • US08892568B2
    • 2014-11-18
    • US13270137
    • 2011-10-10
    • Jeffrey Drue DavidDominic J. BenvegnuXiaoyuan Hu
    • Jeffrey Drue DavidDominic J. BenvegnuXiaoyuan Hu
    • G06F17/30H01L21/66B24B37/013B24B49/12H01L21/321
    • H01L22/26B24B37/013B24B49/12H01L21/3212H01L22/12
    • A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.
    • 控制抛光的方法包括:存储具有多个参考光谱的库,抛光衬底,在抛光期间测量来自衬底的光的光谱序列,对于光谱序列的每个测量光谱,使用 除了平方差的和以产生最佳匹配参考光谱的序列之外的匹配技术,以及基于最佳匹配参考光谱的序列来确定抛光终点或抛光速率的调整中的至少一个。 找到最佳匹配的参考光谱可以包括执行所测量的光谱与来自文库的多个参考光谱中的两个或更多个的互相关,并且选择与所测量的光谱具有最大相关性的参考光谱作为最佳匹配参考 光谱。
    • 100. 发明申请
    • FITTING OF OPTICAL MODEL TO MEASURED SPECTRUM
    • 将光学模型连接到测量光谱
    • US20130237128A1
    • 2013-09-12
    • US13773063
    • 2013-02-21
    • Jeffrey Drue DavidDominic J. Benvegnu
    • Jeffrey Drue DavidDominic J. Benvegnu
    • B24B37/013B24B49/12
    • B24B37/013B24B49/12
    • A method of controlling a polishing operation includes polishing a first layer of a substrate, during polishing, obtaining a sequence over time of measured spectra with an in-situ optical monitoring system, for each measured spectrum from the sequence of measured spectra, fitting an optical model to the measured spectrum, the fitting including finding parameters that provide a minimum difference between an output spectrum of the optical model and the measured spectrum, the parameters including an endpoint parameter and at least one non-endpoint parameter, the fitting generating a sequence of fitted endpoint parameter values, each endpoint parameter value of the sequence associated with one of the spectra of the sequence of measured spectra, and determining at least one of a polishing endpoint or an adjustment of a pressure to the substrate from the sequence of fitted endpoint parameter values.
    • 控制抛光操作的方法包括在抛光期间抛光衬底的第一层,利用原位光学监测系统根据测量光谱序列为每个测量光谱获得测量光谱的时间序列, 所述拟合包括找到在所述光学模型的输出光谱与所述测量光谱之间提供最小差异的参数,所述参数包括端点参数和至少一个非端点参数,所述拟合生成序列 拟合的端点参数值,与测量光谱序列的光谱之一相关联的序列的每个端点参数值,以及根据拟合的端点参数序列确定抛光终点或对衬底的压力的调整中的至少一个 价值观。