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91. 发明申请

US20130334879A1 VEHICLE POWER-SUPPLY CONTROL DEVICE 有权
标题翻译：车辆电源控制装置
公开(公告)号：US20130334879A1
公开(公告)日：2013-12-19
申请号：US13917089
申请日：2013-06-13
申请人： Yusaku Ido , Takashi Yamada , Tadao Nishiguchi , Hideyuki Yasugi , Masayuki Hanatani
发明人： Yusaku Ido , Takashi Yamada , Tadao Nishiguchi , Hideyuki Yasugi , Masayuki Hanatani
IPC分类号： B60R16/033
CPC分类号： B60R16/033 , B60L1/00 , B60L1/003 , B60L1/14 , B60L11/1805 , B60L11/1816 , B60L11/1824 , B60L11/1868 , B60L2210/10 , B60L2210/30 , Y02T10/7005 , Y02T10/7066 , Y02T10/7072 , Y02T10/7216 , Y02T10/7241 , Y02T10/92 , Y02T90/121 , Y02T90/127 , Y02T90/14
摘要： A vehicle power-supply control device has a battery charger that converts an externally-supplied AC voltage into a DC voltage used to charge a vehicle high-voltage battery, a low-voltage power generator that converts the DC voltage output from the battery charger into a DC voltage used to drive a vehicle auxiliary machine, and a controller that controls the battery charger and the low-voltage power generator. The battery charger includes a power factor correction circuit that corrects a power factor of the AC voltage and a first DC/DC converter that generates a predetermined DC voltage based on an output of the power factor correction circuit. The low-voltage power generator includes a second DC/DC converter that steps down the DC voltage output from the battery charger and a synchronous rectifier that rectifies an output of the second DC/DC converter in synchronization with a switching operation of the second DC/DC converter.
摘要翻译：车辆电源控制装置具有将外部供给的交流电压转换成用于对车辆用高压电池充电的直流电压的电池充电器，将从电池充电器输出的直流电压转换为低压电力的低压发电机用于驱动车辆辅助机器的DC电压，以及控制电池充电器和低压发电机的控制器。电池充电器包括校正AC电压的功率因数的功率因数校正电路和基于功率因数校正电路的输出产生预定DC电压的第一DC / DC转换器。低压发电机包括：第二DC / DC转换器，其降低从电池充电器输出的直流电压;以及同步整流器，其与第二DC / DC转换器的开关操作同步地整流第二DC / DC转换器的输出; DC转换器。

92. 发明授权

US08610291B2 Copper alloy bonding wire for semiconductor device 有权
标题翻译：用于半导体器件的铜合金接合线
公开(公告)号：US08610291B2
公开(公告)日：2013-12-17
申请号：US11848403
申请日：2007-08-31
申请人： Tomohiro Uno , Keiichi Kimura , Takashi Yamada
发明人： Tomohiro Uno , Keiichi Kimura , Takashi Yamada
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/85 , B23K35/302 , B23K2103/12 , C22C9/00 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/05624 , H01L2224/05639 , H01L2224/43 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45647 , H01L2224/45663 , H01L2224/45687 , H01L2224/45693 , H01L2224/48227 , H01L2224/48247 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/0106 , H01L2924/01072 , H01L2924/01073 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01105 , H01L2924/01204 , H01L2924/01205 , H01L2924/01206 , H01L2924/10253 , H01L2924/20752 , H01L2924/20755 , H01L2924/20756 , H01L2924/01008 , H01L2924/01004 , H01L2924/01013 , H01L2924/01025 , H01L2924/01039 , H01L2924/00015 , H01L2924/00 , H01L2924/013 , H01L2924/00014 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/01055 , H01L2924/00013
摘要： The present invention provides a semiconductor-device copper-alloy bonding wire which has an inexpensive material cost, ensures a superior ball joining shape, wire joining characteristic, and the like, and a good loop formation characteristic, and a superior mass productivity. The semiconductor-device copper-alloy bonding wire contains at least one of Mg and P in total of 10 to 700 mass ppm, and oxygen within a range from 6 to 30 mass ppm.
摘要翻译：本发明提供了一种廉价的材料成本的半导体器件铜合金接合线，确保了优异的球接合形状，线接合特性等，并且具有良好的环形成特性，并且具有优异的批量生产率。半导体装置铜合金接合线含有总共10〜700质量ppm的Mg和P中的至少一种，氧在6〜30质量ppm的范围内。

93. 发明授权

US08389860B2 Bonding wire for semiconductor devices 有权
标题翻译：半导体器件用接合线
公开(公告)号：US08389860B2
公开(公告)日：2013-03-05
申请号：US12669612
申请日：2008-12-03
申请人： Tomohiro Uno , Keiichi Kimura , Takashi Yamada
发明人： Tomohiro Uno , Keiichi Kimura , Takashi Yamada
IPC分类号： H01B5/00 , H01B7/18 , H01B9/02
CPC分类号： C22C5/02 , B23K35/0222 , B23K35/302 , C22C5/04 , C22C5/06 , C22C9/00 , C22C9/01 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/45683 , H01L2224/48011 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48486 , H01L2224/4851 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48839 , H01L2224/48844 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85186 , H01L2224/85203 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2924/00011 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01203 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/3025 , H01L2924/01004 , H01L2924/01001 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/00015 , H01L2924/01202 , H01L2224/45655 , H01L2224/45657 , H01L2224/45671 , H01L2224/45666 , H01L2924/20652 , H01L2924/20653 , H01L2924/20654 , H01L2924/20655 , H01L2924/20656 , H01L2924/20658 , H01L2224/48227 , H01L2924/00 , H01L2224/48824 , H01L2924/013 , H01L2924/00014 , H01L2924/0104 , H01L2924/00013 , H01L2924/01049 , H01L2924/01006
摘要： A bonding wire for semiconductor devices includes a core member formed of an electrically-conductive metal, and a skin layer mainly composed of a face-centered cubic metal different from the core member and formed thereon. An orientation ratio of orientations in crystalline orientations in a wire lengthwise direction at a crystal face of a surface of the skin layer is greater than or equal to 50%, and the orientations have an angular difference relative to the wire lengthwise direction. The angular difference is within 15 degrees.
摘要翻译：用于半导体器件的接合线包括由导电金属形成的芯部件和主要由不同于芯部件的面心立方金属形成在其上的表皮层。在皮肤层表面的晶面处的线长度方向上的取向<100 <方向<100>的取向比大于或等于50％，并且<100>取向具有相对的角度差到电线长度方向。角度差在15度以内。

94. 发明申请

US20130013879A1 MEMORY CONTROL DEVICE, MEMORY DEVICE, AND MEMORY CONTROL METHOD 有权
标题翻译：存储器控制装置，存储器装置和存储器控制方法
公开(公告)号：US20130013879A1
公开(公告)日：2013-01-10
申请号：US13615983
申请日：2012-09-14
申请人： Takashi YAMADA , Daisuke IMOTO , Koji ASAI , Nobuyuki ICHIGUCHI , Tetsuji MOCHIDA
发明人： Takashi YAMADA , Daisuke IMOTO , Koji ASAI , Nobuyuki ICHIGUCHI , Tetsuji MOCHIDA
IPC分类号： G06F12/00
CPC分类号： G06F13/1668 , G06T1/60
摘要： The memory control device according to the present invention includes a command generating unit which divides the memory access request issued by the master into access commands each of which is for one of the memory devices, a command issuing units which issue each of the access commands to the memory devices, a data control unit which switches data between a master and memories, and the command generating unit switch between control for outputting an identical physical address to the memory units and control for outputting different physical addresses to the memory devices, depending on when the physical addresses of the memory devices are identical and when the physical addresses of the memory devices are different, each of the memory devices corresponds to one of the divided access commands.
摘要翻译：根据本发明的存储器控制装置包括：命令生成单元，其将由主机发出的存储器访问请求分成对于存储器件中的一个的访问命令;命令发布单元，其将每个访问命令发布到存储器装置，在主机和存储器之间切换数据的数据控制单元和指令生成单元之间的切换，用于输出与存储器单元相同的物理地址的控制，并且根据何时根据时间向存储器装置输出不同的物理地址存储器件的物理地址相同，并且当存储器件的物理地址不同时，每个存储器件对应于分割的存取命令之一。

95. 发明申请

US20120307589A1 FLUID MIXER AND APPARATUS USING FLUID MIXER 有权
标题翻译：流体混合器和使用流体混合器的装置
公开(公告)号：US20120307589A1
公开(公告)日：2012-12-06
申请号：US13577381
申请日：2010-12-21
申请人： Toshihiro Hanada , Takashi Yamada
发明人： Toshihiro Hanada , Takashi Yamada
IPC分类号： B01F5/06
CPC分类号： B01F5/0646 , B01F3/0861 , B01F5/0647 , B01F5/0656 , B01F5/0657 , B01F2003/0896
摘要： A fluid mixer includes a main flow path comprised of a first flow path and a second flow path, spiral flow paths formed around the second flow path in shapes substantially concentric with the second flow path and offset in position from each other in a circumferential direction, the spiral flow paths having first ends communicated with the first flow path, branch flow paths branched from a plurality of locations of the second flow path in a flow direction, the branch flow paths being communicated with the spiral flow paths at a plurality of locations of the spiral flow paths in the flow direction, a fluid inlet at an open end of either of the first flow path and the second flow path, and a fluid outlet at an open end of the other of the first flow path and the second flow path.
摘要翻译：流体混合器包括由第一流动路径和第二流动路径构成的主流路，围绕第二流动路径形成的大致与第二流动路径同心的形状和在圆周方向上彼此偏移的形状的螺旋流动路径，所述螺旋流路具有与所述第一流路连通的第一端，在流动方向上从所述第二流路的多个位置分支的分支流路，所述分支流路与所述螺旋流路连通，所述多个位置在流动方向上的螺旋流动路径，在第一流动路径和第二流动路径中的任一个的开口端处的流体入口以及在第一流动路径和第二流动路径中的另一个的开口端处的流体出口。

96. 发明申请

US20120104613A1 BONDING WIRE FOR SEMICONDUCTOR DEVICE 有权
标题翻译：用于半导体器件的接合线
公开(公告)号：US20120104613A1
公开(公告)日：2012-05-03
申请号：US13349155
申请日：2012-01-12
申请人： Tomohiro Uno , Keiichi Kimura , Shinichi Terashima , Takashi Yamada , Akihito Nishibayashi
发明人： Tomohiro Uno , Keiichi Kimura , Shinichi Terashima , Takashi Yamada , Akihito Nishibayashi
IPC分类号： H01L23/532
CPC分类号： H01L24/85 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43847 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/456 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/45664 , H01L2224/45669 , H01L2224/45671 , H01L2224/45673 , H01L2224/4568 , H01L2224/45684 , H01L2224/48011 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48463 , H01L2224/48472 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48724 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/78251 , H01L2224/78301 , H01L2224/85045 , H01L2224/85048 , H01L2224/85065 , H01L2224/85075 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01105 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/15747 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/3025 , H01L2924/3861 , H01L2924/01001 , H01L2924/01203 , H01L2924/01034 , H01L2924/01081 , H01L2924/20645 , H01L2924/20652 , H01L2924/20653 , H01L2924/00014 , H01L2924/20108 , H01L2224/45657 , H01L2224/45666 , H01L2924/01008 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/2076 , H01L2924/2065 , H01L2924/20651 , H01L2924/20654 , H01L2924/00 , H01L2224/45124 , H01L2924/013 , H01L2924/20751 , H01L2924/2075 , H01L2924/00013 , H01L2924/01049
摘要： It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition. The outer layer is 0.021 to 0.12 μm in thickness.
摘要翻译：本发明的目的是提供一种铜基接合线，其材料成本低，具有优异的球接合性，热循环试验或回流试验的可靠性以及储存寿命，使得能够使用的线材变薄用于细间距连接。接合线包括具有铜作为主要成分的芯材和设置在芯材上并且包含金属M和铜的外层，其中金属M与芯材料在组分和组成中的一种或两种中不同。外层的厚度为0.021〜0.12μm。

97. 发明申请

US20120094121A1 COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR 有权
标题翻译：铜合金接线用于半导体
公开(公告)号：US20120094121A1
公开(公告)日：2012-04-19
申请号：US13380123
申请日：2010-06-23
申请人： Tomohiro Uno , Shinichi Terashima , Takashi Yamada , Daizo Oda
发明人： Tomohiro Uno , Shinichi Terashima , Takashi Yamada , Daizo Oda
IPC分类号： C22C9/08 , B32B15/20
CPC分类号： B23K35/302 , B21C1/003 , B21C37/047 , B23K35/0261 , C22C9/00 , C22F1/08 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/05624 , H01L2224/4321 , H01L2224/435 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48507 , H01L2224/4851 , H01L2224/48599 , H01L2224/48624 , H01L2224/48824 , H01L2224/85181 , H01L2224/85439 , H01L2224/85444 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/15747 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20755 , Y10T428/2958 , H01L2924/00014 , H01L2924/00 , H01L2924/00015 , H01L2924/013 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/00013 , H01L2924/01012
摘要： The present invention is a copper-based bonding wire for use in a semiconductor element. The bonding wire of the present invention can be manufactured with an inexpensive material cost, and has a superior PCT reliability in a high-humidity/temperature environment. Further, the bonding wire of the present invention exhibits: a favorable TCT reliability through a thermal cycle test; a favorable press-bonded ball shape; a favorable wedge bondability; a favorable loop formability, and so on. Specifically, the bonding wire of the present invention is a copper alloy bonding wire for semiconductor manufactured by drawing a copper alloy containing 0.13 to 1.15% by mass of Pd and a remainder comprised of copper and unavoidable impurities.
摘要翻译：本发明是用于半导体元件的铜基接合线。本发明的接合线可以以廉价的材料成本制造，并且在高湿度/温度环境中具有优异的PCT可靠性。此外，本发明的接合线通过热循环试验表现出良好的TCT可靠性; 有利的压合球形; 有利的楔形粘合性; 良好的循环成形性等。具体地，本发明的接合线是通过拉伸含有0.13〜1.15质量％的Pd，余量由铜和不可避免的杂质构成的铜合金制造的半导体用铜合金接合线。

98. 发明授权

US08112190B2 Boat control system and boat 有权
标题翻译：船控系统和船
公开(公告)号：US08112190B2
公开(公告)日：2012-02-07
申请号：US12109369
申请日：2008-04-25
申请人： Takashi Yamada
发明人： Takashi Yamada
IPC分类号： B60L3/00
CPC分类号： B63H21/213 , B63H20/00 , B63H21/22
摘要： A boat control system detects a wire break status in a duplicated communication system. A hull of a boat is provided with a main remote control side ECU and a subremote control side ECU, and the subremote control side ECU communicates with an engine side ECU via the main remote control side ECU. Both of the remote control side ECUs are provided with storage buffers in which communication status confirmation data transmitted between nodes is stored. A broken wire detection section of the engine side ECU starts a determination when a system is started, and broken wire detection sections of both of the remote control side ECUs start a determination when communication status confirmation data is received from another node. Data indicating that communication is in an abnormal status is stored as an initial value in a main remote control data storage buffer.
摘要翻译：船控系统检测重复通信系统中的断线状态。船体具有主遥控侧ECU和副遥控侧ECU，副翼控制侧ECU经由主遥控侧ECU与发动机侧ECU通信。两个遥控侧ECU都设置有存储缓冲器，其中存储有节点之间传输的通信状态确认数据。发动机侧ECU的断线检测部在系统起动时开始判定，并且当从另一节点接收到通信状态确认数据时，两个遥控侧ECU的断线检测部开始判定。指示通信处于异常状态的数据作为初始值存储在主遥控数据存储缓冲器中。

99. 发明申请

US20110310058A1 OBJECT DISPLAY DEVICE 审中-公开
标题翻译：对象显示设备
公开(公告)号：US20110310058A1
公开(公告)日：2011-12-22
申请号：US13203457
申请日：2010-02-25
申请人： Takashi Yamada , Tomotake Aono
发明人： Takashi Yamada , Tomotake Aono
IPC分类号： G06F3/041
CPC分类号： G06F3/04845 , G06F3/0414 , G06F3/0482 , G06F3/0488 , G06F3/04883
摘要： An object display device is disclosed. An object display device includes a display unit, a detection unit and a control unit. The display unit is configured to display an object. The detection unit is configured to detect a location and a load of a pressing to the display unit. The control unit can control a movement of the object based on conditions of first and second pressings.
摘要翻译：公开了一种物体显示装置。目标显示装置包括显示单元，检测单元和控制单元。显示单元被配置为显示对象。检测单元被配置为检测对显示单元的按压的位置和负载。控制单元可以基于第一和第二按压的条件来控制物体的移动。

100. 发明申请

US20110274603A1 EXHAUST GAS PURIFICATION CATALYST, EXHAUST GAS PURIFICATION APPARATUS USING THE SAME AND EXHAUST GAS PURIFICATION METHOD 审中-公开
标题翻译：排气净化催化剂，使用其的排气净化装置和排气净化方法
公开(公告)号：US20110274603A1
公开(公告)日：2011-11-10
申请号：US13142354
申请日：2010-01-26
申请人： Akira Kohara , Yoshiro Hirasawa , Takashi Yamada
发明人： Akira Kohara , Yoshiro Hirasawa , Takashi Yamada
IPC分类号： B01D53/94 , B01J29/04 , B01J21/12 , B01J21/06 , B01J21/08
CPC分类号： B01D53/945 , B01D2255/1023 , B01D2255/1025 , B01D2255/2042 , B01D2255/2092 , B01D2255/407 , B01D2258/014 , B01J23/002 , B01J23/63 , B01J35/0006 , B01J35/002 , B01J2523/00 , F01N2370/02 , F01N2510/06 , Y02A50/2324 , Y02T10/22 , B01J2523/25 , B01J2523/31 , B01J2523/3712 , B01J2523/48 , B01J2523/824 , B01J2523/828
摘要： An exhaust gas purification catalyst, which is suitable as a Three Way Catalyst for efficiently purifying carbon monoxide (CO), hydrocarbons (HC), and nitrogen oxides (NOx) in exhaust gas discharged from a gasoline automobile, an exhaust gas purification apparatus using the same and an exhaust gas purification method.It is provided by an exhaust gas purification catalyst, wherein catalyst components for purifying hydrocarbons (HC), carbon monoxide (CO) and nitrogen oxides (NOx) contained in exhaust gas are coated onto a honeycomb type structure as a catalyst composition layer, characterized in that the catalyst components comprise an activated metal (A), a heat resistant inorganic oxide (B) and a cerium-zirconium composite oxide (c) containing a pyrochlore phase in a crystal structure, in the same catalyst composition layer, and the activated metal (A) is a palladium and a rhodium and does not contain a platinum.
摘要翻译：一种废气净化催化剂，其适合作为用于有效地净化从汽油车辆排出的废气中的一氧化碳（CO），烃（HC）和氮氧化物（NOx））的三元催化剂，使用相同的废气净化方法。由废气净化催化剂提供，其中将用于净化废气中的烃（HC），一氧化碳（CO）和氮氧化物（NOx））的催化剂组分涂覆到作为催化剂组合物层的蜂窝型结构上，其特征在于催化剂组分包含在同一催化剂组合物层中的在晶体结构中含有烧绿石相的活化金属（A），耐热无机氧化物（B）和铈锆复合氧化物（c），活化金属（A）是钯和铑，不含铂。

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