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91. 发明授权

US06456100B1 Apparatus for attaching to a semiconductor 失效
标题翻译：用于连接到半导体的装置
公开(公告)号：US06456100B1
公开(公告)日：2002-09-24
申请号：US09009169
申请日：1998-01-20
申请人： David R. Hembree , Salman Akram , Derek Gochnour
发明人： David R. Hembree , Salman Akram , Derek Gochnour
IPC分类号： G01R3102
CPC分类号： G01R1/0466 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/53209 , Y10T29/5323
摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element.
摘要翻译：提供了用于测试半导体的临时封装中的弹簧元件。弹簧元件被压缩以将半导体以裸半导体管芯的形式或作为封装的一部分压在互连结构上。弹簧元件构造成使得其提供足够的压力以保持半导体上的触点与互连结构电接触。向弹簧元件添加和/或移除材料，使其具有所需的弹性模量。弹簧元件的形状也可以改变以改变弹性元件的弹性模量，弹簧常数和力传递能力。

92. 发明授权

US06432840B1 Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package 有权
标题翻译：去除错放密封剂的方法，用于将散热片连接在板上封装中
公开(公告)号：US06432840B1
公开(公告)日：2002-08-13
申请号：US09606969
申请日：2000-06-28
申请人： David R. Hembree
发明人： David R. Hembree
IPC分类号： H01L2148
CPC分类号： H01L23/3121 , H01L21/4871 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2224/85002 , H01L2224/8592 , H01L2224/92247 , H01L2924/00014 , H01L2924/01079 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/00 , H01L2224/05599
摘要： A process for forming a thermally enhanced Chip On Board semiconductor device (10) with a heat sink (30) is described. In one aspect, a thermally conducting filled gel elastomer material (50) or a silicon elastomeric material or elastomeric material, if the material is to be removed, is applied to the die surface (18) to which the heat sink is to be bonded. During the subsequent glob top application and curing steps, difficult-to-remove glob top material (38) which otherwise may be misapplied to the die surface adheres to the upper surface of the elastomer material. The elastomer material is removed by peeling prior to adhesion bonding of the heat sink to the die. In another aspect, the thermally conducting filled gel elastomer material (70) is applied between a die surface and the inside attachment surface (46) of a cap-style heat sink to eliminate overpressure on the die/substrate interface.
摘要翻译：描述了一种用于形成具有散热器（30）的热增强型片上半导体器件（10）的工艺。在一个方面，如果要去除材料，则导热填充的凝胶弹性体材料（50）或硅弹性体材料或弹性体材料被施加到要与散热器接合的模具表面（18）上。在后续的全球顶部施用和固化步骤中，难以去除的球形材料（38）否则可能被错误地应用于模具表面附着在弹性体材料的上表面上。在将散热器粘附到模具之前，通过剥离除去弹性体材料。另一方面，将导热填充的凝胶弹性体材料（70）施加在模具表面和盖式散热器的内部附接表面（46）之间以消除模具/衬底界面上的过压。

93. 发明授权

US06419550B2 Apparatus and methods for substantial planarization of solder bumps 有权
标题翻译：用于焊锡凸块的实质平面化的装置和方法
公开(公告)号：US06419550B2
公开(公告)日：2002-07-16
申请号：US09910320
申请日：2001-07-19
申请人： David R. Hembree
发明人： David R. Hembree
IPC分类号： B24B100
CPC分类号： H05K3/3457 , B24B7/22 , B24B37/04 , B24B37/042 , H01L21/4853 , H01L22/12 , H01L24/11 , H01L2224/0401 , H01L2224/0603 , H01L2224/1184 , H01L2224/13099 , H01L2224/1403 , H01L2224/14051 , H01L2924/00013 , H01L2924/01005 , H01L2924/01015 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H05K2201/10674 , H05K2203/0195 , H05K2203/025 , H05K2203/0278 , H05K2203/0346 , H05K2203/163 , Y10S29/044 , Y10T29/49121 , Y10T29/49144 , Y10T29/49149 , H01L2224/29099 , H01L2924/00
摘要： Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized. In alternate embodiments, the planarization member includes a cutting tool and the planarization action comprises a milling action; or the planarization member includes a heated platen and the planarization action comprises a thermo-mechanical deformation action; or the planarization member includes an abrasive surface and the planarization action comprises a grinding action; or the planarization member includes a chemical solution and the planarization action comprises a chemical reaction; or the planarization member includes a solder deposition device and the planarization action comprises a solder. In a further embodiment, an apparatus includes a load device to urge the at least some outer surfaces of the bumped device into engagement with the planarization member.
摘要翻译：用于焊锡凸块的实质平面化的装置和方法。在一个实施例中，一种装置包括可与多个外表面中的至少一些接合的平坦化构件，以在一个或多个外表面上施加平坦化作用，以使多个外表面基本上平坦化，以及固定元件以牢固地位置与平坦化构件接合时的凸起装置。通过应用“添加剂”和/或“消减”方法，焊球基本上是平面化的。在替代实施例中，平坦化构件包括切割工具，并且平坦化作用包括铣削动作; 或者平坦化构件包括加热的压板，并且平坦化作用包括热机械变形作用; 或者平坦化构件包括研磨表面，并且平坦化作用包括研磨作用; 或者平坦化构件包括化学溶液，并且平坦化作用包括化学反应; 或者平坦化构件包括焊料沉积装置，并且平坦化作用包括焊料。在另一个实施例中，装置包括负载装置，以将凸起装置的至少一些外表面推压成与平坦化构件接合。

94. 发明授权

US06419143B2 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 有权
公开(公告)号：US06419143B2
公开(公告)日：2002-07-16
申请号：US09921621
申请日：2001-08-03
申请人： David R. Hembree , Michael E. Hess , John O. Jacobson , Warren M. Farnworth , Alan G. Wood
发明人： David R. Hembree , Michael E. Hess , John O. Jacobson , Warren M. Farnworth , Alan G. Wood
IPC分类号： B23K2010
CPC分类号： B23K20/10 , B23K2101/38
摘要： A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

95. 发明授权

US06417685B1 Test system having alignment member for aligning semiconductor components 有权
标题翻译：具有用于对准半导体部件的对准部件的测试系统
公开(公告)号：US06417685B1
公开(公告)日：2002-07-09
申请号：US10045420
申请日：2002-01-15
申请人： Salman Akram , Warren M. Farnworth , Michael E. Hess , David R. Hembree
发明人： Salman Akram , Warren M. Farnworth , Michael E. Hess , David R. Hembree
IPC分类号： G01R3126
CPC分类号： G01R1/0483 , G01R31/2886 , H01L2224/05554 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/8592 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/10157 , H01L2924/10253 , H01L2924/15312 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A test system for testing semiconductor components includes an interconnect having contacts for making temporary electrical connections with terminal contacts on the components. The interconnect contacts can be configured to electrically engage planar terminal contacts (e.g., bond pads, test pads) or bumped terminal contacts (e.g., solder bumps, solder balls) on the components. The test system also includes an alignment member for aligning the components to the interconnect. Different embodiments of the alignment member include: a curable polymer material molded in place on the interconnect; an alignment opening formed as an etched pocket in a substrate of the interconnect; and a separate fence attached to the interconnect using an alignment fixture.
摘要翻译：用于测试半导体部件的测试系统包括具有用于与组件上的端子触点进行临时电连接的触点的互连。互连触点可以被配置为电连接部件上的平面端子触头（例如，接合焊盘，测试焊盘）或凸起的端子触头（例如，焊料凸块，焊球）。测试系统还包括用于将部件对准互连的对准部件。对准构件的不同实施例包括：在互连上模制就位的可固化聚合物材料; 在所述互连的基板中形成作为蚀刻袋的对准开口; 以及使用对准夹具附接到互连件的单独的栅栏。

96. 发明授权

US06397460B1 Electrical connector 失效
公开(公告)号：US06397460B1
公开(公告)日：2002-06-04
申请号：US09652922
申请日：2000-08-31
申请人： David R. Hembree
发明人： David R. Hembree
IPC分类号： H05K330
CPC分类号： H01R13/2421 , G01R1/0466 , G01R1/0483 , H01L2924/0002 , H01R12/714 , H01R2201/20 , H05K7/1061 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914 , Y10T29/49144 , Y10T29/49149 , Y10T29/49151 , Y10T29/49153 , Y10T29/49155 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , Y10T29/49224 , Y10T29/53174 , H01L2924/00
摘要： In a socket used to house semiconductor die during testing, a recessed socket contact is provided that avoids pinching the die's contacts. Also provided are socket contacts that allow for smaller socket holes and, therefore, denser arrays of socket contacts. In one embodiment, the body of the socket contact comprises a head, a spring coupled to the head, and a shaft coupled to the spring; no outer shell is needed for the spring, as the non-conductive sides of the socket hole serve that function. In another embodiment, the body of the socket contact comprises a metal shaft having an aperture. Compression causes the shaft to close around the slit, thereby decreasing the amount of lateral buckling. In yet another embodiment, semiconductor fabrication techniques are used to construct a dense array of contacts.

97. 发明授权

US06388458B1 Spring element for use in an apparatus for attaching to a semiconductor and a method of making 失效
标题翻译：用于连接到半导体的装置中的弹簧元件和制造方法
公开(公告)号：US06388458B1
公开(公告)日：2002-05-14
申请号：US09678562
申请日：2000-10-03
申请人： David R. Hembree , Salman Akram , Derek Gochnour
发明人： David R. Hembree , Salman Akram , Derek Gochnour
IPC分类号： G01R3102
CPC分类号： G01R1/0466 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/53209 , Y10T29/5323
摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element.
摘要翻译：提供了用于测试半导体的临时封装中的弹簧元件。弹簧元件被压缩以将半导体以裸半导体管芯的形式或作为封装的一部分压在互连结构上。弹簧元件构造成使得其提供足够的压力以保持半导体上的触点与互连结构电接触。向弹簧元件添加和/或移除材料，使其具有所需的弹性模量。弹簧元件的形状也可以改变以改变弹性元件的弹性模量，弹簧常数和力传递能力。

98. 发明授权

US06386436B2 Method of forming a solder ball 失效
标题翻译：形成焊球的方法
公开(公告)号：US06386436B2
公开(公告)日：2002-05-14
申请号：US09785731
申请日：2001-02-16
申请人： David R. Hembree
发明人： David R. Hembree
IPC分类号： B23K3512
CPC分类号： B23K3/0623 , B23K1/0008 , B23K35/0244 , B23K2101/42 , H01L21/4853 , H05K3/3457 , H05K2203/0113
摘要： The present invention is drawn to a method of making solder bump interconnections or BGAs ranging from chip-level connections to either single chip or multichip modules, flip-chip packages and printed circuit board connections. According to the method of the present invention, a die wafer or a substrate with a conductive contact location is positioned in close proximity and aligned with a mold wafer having a pocket corresponding to the contact location of the die wafer. A source of a molten solder is also provided which interconnects with the mold wafer. The molten solder from the source is introduced into the pocket of the mold wafer such that the molten solder wets the contact location aligned with the pocket. Before the molten solder inside the pocket is allowed to solidify, the die wafer and the mold wafer are separated from each other. Some of the molten solder is attracted to the contact location of the die wafer as it separates from the remaining molten solder in the pocket so as to assume the shape of a partial sphere. The method of the present invention is especially useful for batch processing in the formation of a large number of solder balls.
摘要翻译：本发明涉及一种制造从芯片级连接到单芯片或多芯片模块，倒装芯片封装和印刷电路板连接的焊料凸块互连或BGA的方法。根据本发明的方法，晶片晶片或具有导电接触位置的基板位于紧密接近并且与具有对应于晶片晶片的接触位置的凹穴的模具晶片对准。还提供了与模具晶片互连的熔融焊料的源。来自源的熔融焊料被引入模具晶片的凹槽中，使得熔融焊料润湿与凹穴对准的接触位置。在允许袋内的熔融焊料固化之前，将晶片和模具晶片彼此分离。一些熔融焊料被吸引到芯片晶片的接触位置，因为其与袋中剩余的熔融焊料分离，以呈现部分球形的形状。本发明的方法对于形成大量焊球的批处理特别有用。

99. 发明授权

US06373273B1 Test insert containing vias for interfacing a device containing contact bumps with a test substrate 有权
公开(公告)号：US06373273B1
公开(公告)日：2002-04-16
申请号：US09916771
申请日：2001-07-27
申请人： Salman Akram , David R. Hembree
发明人： Salman Akram , David R. Hembree
IPC分类号： G01R3102
摘要： An insert is provided for testing a chip-scale-packaged microelectronic device having an encapsulant-protrusion and a ball-grid-array of outwardly-projecting contacts. The insert comprises a substrate of mono-crystalline silicon. Walls of the substrate define a plurality of pockets that are configured to receive and contact the outwardly-projecting contacts of the microelectronic device. Additional walls of the substrate define a recess disposed amongst the plurality of pockets. The recess has a width greater than the widths of any of the pockets. Additionally, the recess comprises a perimeter greater than that of the encapsulant-protrusion of the chip-scale-packaged microelectronic device, and a depth operative to clear the encapsulant-protrusion when the chip-scale package is seated upon the insert.

100. 发明授权

US06364196B1 Method and apparatus for aligning and attaching balls to a substrate 失效
标题翻译：用于将球对准和附着到基底的方法和装置
公开(公告)号：US06364196B1
公开(公告)日：2002-04-02
申请号：US09519583
申请日：2000-03-06
申请人： Alan G. Wood , Salman Akram , Mike Hess , David R. Hembree
发明人： Alan G. Wood , Salman Akram , Mike Hess , David R. Hembree
IPC分类号： B23K100
CPC分类号： H05K3/3478 , H01L21/4853 , H01L24/742 , H01L2224/11003 , H01L2224/11334 , H01L2224/4824 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01046 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H05K2203/041 , H05K2203/082 , Y10S438/975 , H01L2924/00 , H01L2224/0401
摘要： A method for aligning and bonding balls to substrates, such as semiconductor wafers, dice and packages, is provided. The method employs a ball retaining plate having a pattern of micromachined cavities and vacuum conduits for retaining the balls. In addition, a substrate alignment member attached to the ball retaining plate, aligns the substrate to the balls. Using the substrate alignment member, bonding sites on the substrate can be placed in physical contact with the balls which are held by vacuum on the ball retaining plate. Next, the ball alignment plate and substrate can be place in a furnace for reflowing and bonding the balls to the bonding sites. An apparatus for performing the method includes the ball retaining plate and the substrate alignment member. A system for performing the method includes a ball loader mechanism for loading balls onto the ball retaining plate, and a vacuum fixture for applying a vacuum to the ball retaining cavities.
摘要翻译：提供了用于将球对准和结合到诸如半导体晶片，骰子和封装之类的衬底的方法。该方法采用具有微加工空腔图案的球保持板和用于保持球的真空管道。此外，附接到球保持板的基板对准部件将基板对准球。使用基板对准部件，可以将基板上的接合部位与通过真空保持在球保持板上的球物理接触。接下来，可以将球定位板和基板放置在炉中以将球回弹并结合到结合位置。用于执行该方法的装置包括球保持板和基板对准构件。用于执行该方法的系统包括用于将球装载到球保持板上的球加载机构，以及用于向球保持腔施加真空的真空夹具。

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