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1. 发明授权

US06806493B1 Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching 失效
公开(公告)号：US06806493B1
公开(公告)日：2004-10-19
申请号：US09026080
申请日：1998-02-19
申请人： David R. Hembree , Salman Akram , Derek Gochnour
发明人： David R. Hembree , Salman Akram , Derek Gochnour
IPC分类号： H01L2358
CPC分类号： G01R1/0466 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/53209 , Y10T29/5323
摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element. The spring element also includes conductive material to increase the thermal and electrical conductivity of the spring element.

2. 发明授权

US06208157B1 Method for testing semiconductor components 有权
标题翻译：半导体元件测试方法
公开(公告)号：US06208157B1
公开(公告)日：2001-03-27
申请号：US09298769
申请日：1999-04-23
申请人： Salman Akram , David R. Hembree , Warren M. Farnworth , Derek Gochnour , Alan G. Wood , John O. Jacobson
发明人： Salman Akram , David R. Hembree , Warren M. Farnworth , Derek Gochnour , Alan G. Wood , John O. Jacobson
IPC分类号： G01R3102
CPC分类号： G01R1/0466 , G01R1/0433 , G01R1/0483
摘要： A system and method for testing semiconductor components are provided. The system includes: a test board, sockets mounted to the test board in electrical communication with test circuitry, and carriers mounted to the sockets for housing the components. The carriers include bases, and interconnects mounted thereon, having contact members configured to make temporary electrical connections with contacts on the components. In addition, the contact members on the interconnects can be shaped to perform an alignment function, and to prevent excessive deformation of the contacts on the components. The sockets include camming members and electrical connectors configured to electrically contact the carriers with a zero insertion force. During a test procedure, the bases and interconnects can remain mounted to the sockets on the test board, as the components are aligned and placed in electrical contact with the interconnects. However, different bases and interconnects can be mounted to the sockets for testing different types of components.
摘要翻译：提供了一种用于测试半导体部件的系统和方法。该系统包括：测试板，安装在与测试电路电气通信的测试板上的插座，以及安装在插座上用于容纳组件的载体。载体包括底座和安装在其上的互连件，其具有被配置为与部件上的触点进行临时电连接的接触构件。此外，互连上的接触构件可以成形为执行对准功能，并且防止部件上的触点的过度变形。插座包括凸轮构件和被配置为以零插入力电接触托架的电连接器。在测试过程中，基板和互连件可以保持安装到测试板上的插座上，因为组件对齐并放置成与互连件电接触。然而，可以将不同的基座和互连件安装到插座以测试不同类型的部件。

3. 发明授权

US06939145B2 Spring element for use in an apparatus for attaching to a semiconductor and a method of making 失效
公开(公告)号：US06939145B2
公开(公告)日：2005-09-06
申请号：US10458016
申请日：2003-06-10
申请人： David R. Hembree , Salman Akram , Derek Gochnour
发明人： David R. Hembree , Salman Akram , Derek Gochnour
IPC分类号： G01R1/04 , H01R12/00
CPC分类号： G01R1/0466 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/53209 , Y10T29/5323
摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element.

4. 发明授权

US06544461B1 Test carrier with molded interconnect for testing semiconductor components 失效
标题翻译：带有模拟互连的测试载体，用于测试半导体元件
公开(公告)号：US06544461B1
公开(公告)日：2003-04-08
申请号：US09677555
申请日：2000-10-02
申请人： David R. Hembree , Salman Akram , Warren M. Farnworth , Alan G. Wood , Derek Gochnour , John O. Jacobson , James M. Wark , Syed Sajid Ahmad
发明人： David R. Hembree , Salman Akram , Warren M. Farnworth , Alan G. Wood , Derek Gochnour , John O. Jacobson , James M. Wark , Syed Sajid Ahmad
IPC分类号： B29C4502
CPC分类号： G01R1/0483
摘要： A semiconductor carrier for testing semiconductor components, such as bare dice and chip scale packages, and a method for fabricating the carrier are provided. The carrier includes a molded plastic base, a lead frame, and an interconnect. The interconnect includes contacts for making temporary electrical connections with corresponding contacts (e.g., bond pads, solder balls) on the components. The carrier is fabricated by attaching the interconnect to the lead frame, and then molding the plastic base to the interconnect and lead frame. An alternate embodiment carrier includes a board to which multiple interconnects are molded or laminated. In addition, clip members retain the components on the board in electrical communication with the interconnects. A gasket may be used to protect the interconnect contacts during the molding step.
摘要翻译：提供了用于测试半导体部件的半导体载体，例如裸芯片和芯片级封装，以及制造载体的方法。载体包括模制塑料基底，引线框架和互连件。互连件包括用于与组件上的相应触点（例如，接合焊盘，焊球）进行临时电连接的触点。通过将互连件附接到引线框架，然后将塑料基底模制到互连和引线框架来制造载体。替代实施例的载体包括多个互连件模制或层压的板。另外，夹子构件保持电路板上与组件电连通的组件。可以在模制步骤期间使用垫圈来保护互连触点。

5. 发明授权

US06456100B1 Apparatus for attaching to a semiconductor 失效
标题翻译：用于连接到半导体的装置
公开(公告)号：US06456100B1
公开(公告)日：2002-09-24
申请号：US09009169
申请日：1998-01-20
申请人： David R. Hembree , Salman Akram , Derek Gochnour
发明人： David R. Hembree , Salman Akram , Derek Gochnour
IPC分类号： G01R3102
CPC分类号： G01R1/0466 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/53209 , Y10T29/5323
摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element.
摘要翻译：提供了用于测试半导体的临时封装中的弹簧元件。弹簧元件被压缩以将半导体以裸半导体管芯的形式或作为封装的一部分压在互连结构上。弹簧元件构造成使得其提供足够的压力以保持半导体上的触点与互连结构电接触。向弹簧元件添加和/或移除材料，使其具有所需的弹性模量。弹簧元件的形状也可以改变以改变弹性元件的弹性模量，弹簧常数和力传递能力。

6. 发明授权

US06388458B1 Spring element for use in an apparatus for attaching to a semiconductor and a method of making 失效
标题翻译：用于连接到半导体的装置中的弹簧元件和制造方法
公开(公告)号：US06388458B1
公开(公告)日：2002-05-14
申请号：US09678562
申请日：2000-10-03
申请人： David R. Hembree , Salman Akram , Derek Gochnour
发明人： David R. Hembree , Salman Akram , Derek Gochnour
IPC分类号： G01R3102
CPC分类号： G01R1/0466 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/53209 , Y10T29/5323
摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element.
摘要翻译：提供了用于测试半导体的临时封装中的弹簧元件。弹簧元件被压缩以将半导体以裸半导体管芯的形式或作为封装的一部分压在互连结构上。弹簧元件构造成使得其提供足够的压力以保持半导体上的触点与互连结构电接触。向弹簧元件添加和/或移除材料，使其具有所需的弹性模量。弹簧元件的形状也可以改变以改变弹性元件的弹性模量，弹簧常数和力传递能力。

7. 发明授权

US6040702A Carrier and system for testing bumped semiconductor components 失效
标题翻译：用于测试碰撞半导体元件的载体和系统
公开(公告)号：US6040702A
公开(公告)日：2000-03-21
申请号：US888075
申请日：1997-07-03
申请人： David R. Hembree , Warren M. Farnworth , Alan G. Wood , Derek Gochnour , Salman Akram
发明人： David R. Hembree , Warren M. Farnworth , Alan G. Wood , Derek Gochnour , Salman Akram
IPC分类号： G01R31/26 , G01R1/04 , G01R1/073 , G01R31/02 , H01L21/66 , H01L23/12 , H01L23/32 , H01R13/631 , H01R13/642 , H01R33/76
CPC分类号： G01R1/0483 , H01L2224/0401 , H01L2224/05552 , H01L2224/81385 , H01L2924/01021 , H01L2924/01087 , H01L2924/09701
摘要： A semiconductor carrier and system for testing bumped semiconductor components, such as dice and packages, having contact bumps are provided. The carrier includes a base, an interconnect, and a force applying mechanism. The interconnect includes patterns of contact members adapted to electrically contact the contact bumps. The interconnect can include a substrate having contact members formed as recesses, or as projections, covered with conductive layers. Alternately, the interconnect can be a multi layered tape bonded directly to a base of the carrier. In addition to providing electrical connections, the contact members perform an alignment function by self centering the contact bumps within the contact members. The carrier can also include an alignment member configured to align the components with the interconnect. The system can include the carrier, a socket, and a testing apparatus such as a burn-in board in electrical communication with test circuitry.
摘要翻译：提供了一种半导体载体和系统，用于测试具有接触凸块的凸起的半导体部件，例如芯片和封装。载体包括基底，互连和力施加机构。互连包括适于电接触接触凸块的接触构件的图案。互连可以包括具有形成为凹陷的接触构件的衬底，或者作为突出部的覆盖有导电层的衬底。或者，互连可以是直接结合到载体的基底的多层带。除了提供电连接之外，接触构件通过使接触构件内的接触凸块自对中来执行对准功能。载体还可以包括配置成将部件与互连对准的对准部件。该系统可以包括载体，插座和诸如与测试电路电连接的老化板的测试装置。

8. 发明授权

US06703640B1 Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching 有权
标题翻译：用于连接到半导体的装置中的弹簧元件和附接方法
公开(公告)号：US06703640B1
公开(公告)日：2004-03-09
申请号：US09510828
申请日：2000-02-23
申请人： David R. Hembree , Salman Akram , Derek Gochnour
发明人： David R. Hembree , Salman Akram , Derek Gochnour
IPC分类号： H01L2329
CPC分类号： G01R1/0466
摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element. The spring element also includes conductive material to increase the thermal and electrical conductivity of the spring element.
摘要翻译：提供了用于测试半导体的临时封装中的弹簧元件。弹簧元件被压缩以将半导体以裸半导体管芯的形式或作为封装的一部分压在互连结构上。弹簧元件构造成使得其提供足够的压力以保持半导体上的触点与互连结构电接触。向弹簧元件添加和/或移除材料，使其具有所需的弹性模量。弹簧元件的形状也可以改变以改变弹性元件的弹性模量，弹簧常数和力传递能力。弹簧元件还包括导电材料以增加弹簧元件的导热性和导电性。

9. 发明授权

US06598290B2 Method of making a spring element for use in an apparatus for attaching to a semiconductor 失效
标题翻译：制造用于连接到半导体的装置中的弹簧元件的方法
公开(公告)号：US06598290B2
公开(公告)日：2003-07-29
申请号：US10124848
申请日：2002-04-18
申请人： David R. Hembree , Salman Akram , Derek Gochnour
发明人： David R. Hembree , Salman Akram , Derek Gochnour
IPC分类号： H01R900
CPC分类号： G01R1/0466 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/53209 , Y10T29/5323
摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element.
摘要翻译：提供了用于测试半导体的临时封装中的弹簧元件。弹簧元件被压缩以将半导体以裸半导体管芯的形式或作为封装的一部分压在互连结构上。弹簧元件构造成使得其提供足够的压力以保持半导体上的触点与互连结构电接触。向弹簧元件添加和/或移除材料，使其具有所需的弹性模量。弹簧元件的形状也可以改变以改变弹性元件的弹性模量，弹簧常数和力传递能力。

10. 发明授权

US06313651B1 Carrier and system for testing bumped semiconductor components 失效
标题翻译：用于测试碰撞半导体元件的载体和系统
公开(公告)号：US06313651B1
公开(公告)日：2001-11-06
申请号：US09322724
申请日：1999-05-28
申请人： David R. Hembree , Warren M. Farnworth , Alan G. Wood , Derek Gochnour , Salman Akram
发明人： David R. Hembree , Warren M. Farnworth , Alan G. Wood , Derek Gochnour , Salman Akram
IPC分类号： G01R3102
CPC分类号： G01R1/0483 , H01L2224/0401 , H01L2224/05552 , H01L2224/48091 , H01L2224/81385 , H01L2924/01021 , H01L2924/01087 , H01L2924/09701 , H01L2924/10155 , H01L2924/15311 , H01L2924/00014
摘要： A semiconductor carrier and system for testing bumped semiconductor components, such as dice and packages, having contact bumps are provided. The carrier includes a base, an interconnect, and a force applying mechanism. The interconnect includes patterns of contact members adapted to electrically contact the contact bumps. The interconnect can include a substrate having contact members formed as recesses, or as projections, covered with conductive layers. Alternately, the interconnect can be a multi layered tape bonded directly to a base of the carrier. In addition to providing electrical connections, the contact members perform an alignment function by self centering the contact bumps within the contact members. The carrier can also include an alignment member configured to align the components with the interconnect. The system can include the carrier, a socket, and a testing apparatus such as a burn-in board in electrical communication with test circuitry.
摘要翻译：提供了一种半导体载体和系统，用于测试具有接触凸块的凸起的半导体部件，例如芯片和封装。载体包括基底，互连和力施加机构。互连包括适于电接触接触凸块的接触构件的图案。互连可以包括具有形成为凹陷的接触构件的衬底，或者作为突出部的覆盖有导电层的衬底。或者，互连可以是直接结合到载体的基底的多层带。除了提供电连接之外，接触构件通过使接触构件内的接触凸块自对中来执行对准功能。载体还可以包括配置成将部件与互连对准的对准部件。该系统可以包括载体，插座和诸如与测试电路电连接的老化板的测试装置。

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