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    • 91. 发明授权
    • Method of achieving high reliability of network boot computer system
    • 实现网络引导计算机系统高可靠性的方法
    • US07840835B2
    • 2010-11-23
    • US12433618
    • 2009-04-30
    • Keisuke HatasakiTakao Nakajima
    • Keisuke HatasakiTakao Nakajima
    • G06F11/00
    • G06F11/0793G06F9/4406G06F11/2028G06F11/2046
    • In a network computer system, recovery may be impossible from a fault when the fault occurs in a network switch in a network or a device such as an external disk device. Provided is a computer system that includes a plurality of servers, a plurality of network, a plurality of external disk devices, and a management computer, in which the management computer detects a fault which is occurred, retrieves an application stop server inaccessible to the used disk due to the fault, retrieves the disk for storing the same contents as contents stored in the disk used by the retrieved application stop server and the external disk device including the disk, retrieves an application resuming server capable of accessing the retrieved external disk device, and transmits an instruction to boot by using the retrieved disk to the retrieved application resuming server.
    • 在网络计算机系统中,当网络中的网络交换机或诸如外部磁盘设备的设备发生故障时,故障可能无法恢复。 提供了一种计算机系统,其包括多个服务器,多个网络,多个外部磁盘设备和管理计算机,其中管理计算机检测到发生的故障,检索所使用的不可访问的应用程序停止服务器 磁盘,检索用于存储与检索到的应用程序停止服务器和包括该磁盘的外部磁盘设备使用的磁盘中存储的内容相同的内容的磁盘,检索能够访问检索到的外部磁盘设备的应用程序恢复服务器, 并通过使用检索到的磁盘向所检索的应用程序恢复服务器发送引导指令。
    • 92. 发明授权
    • Method for fabricating recess gate in semiconductor device
    • 在半导体器件中制造凹槽的方法
    • US07838361B2
    • 2010-11-23
    • US12239492
    • 2008-09-26
    • Yong-Tae ChoEun-Mi Kim
    • Yong-Tae ChoEun-Mi Kim
    • H01L21/336
    • H01L21/28114H01L29/4236H01L29/42372H01L29/66621
    • A method for fabricating a recess gate in a semiconductor device includes etching a silicon substrate to form a trench that defines an active region, forming a device isolation layer that gap-fills the trench, forming a hard mask layer over the silicon substrate, the hard mask layer comprising a stack of an oxide layer and an amorphous carbon layer, wherein the hard mask layer exposes a channel target region of the active region, and forming a recess region with a dual profile by first etching and second etching the channel target region using the hard mask layer as an etch barrier, wherein the second etching is performed after removing the amorphous carbon layer.
    • 一种在半导体器件中制造凹陷栅的方法,包括蚀刻硅衬底以形成限定有源区的沟槽,形成间隙填充沟槽的器件隔离层,在硅衬底上形成硬掩模层,硬的 掩模层,其包括氧化物层和非晶碳层的堆叠,其中所述硬掩模层暴露所述有源区的沟道目标区域,并且通过第一蚀刻形成具有双轮廓的凹陷区域,并且使用 所述硬掩模层作为蚀刻阻挡层,其中所述第二蚀刻在去除所述无定形碳层之后进行。
    • 99. 发明授权
    • Low temperature hermetic bonding at water level and method of bonding for micro display application
    • 水位低温密封,微显示应用方法
    • US07833879B2
    • 2010-11-16
    • US12437533
    • 2009-05-07
    • Philip H. Chen
    • Philip H. Chen
    • H01L21/30
    • G02B26/0841
    • A spatial light modulator is fabricated by bonding a capping layer over a wafer bearing active reflecting surfaces utilizing a low temperature bonding agent capable of providing a hermetic seal, such as a glass frit. The low temperature bonding agent may be B-stage cured after application to the capping layer, prior to any exposure to the substrate bearing the reflecting surfaces. In accordance with one embodiment of the present invention, the capping layer may comprise a glass wafer pre-bonded with an interposer spacer layer to provide sufficient stand-off between the capping layer and the underlying reflecting structures. In accordance with an alternative embodiment of the present invention, the capping layer may comprise a glass wafer alone, and the bonding agent may include additional materials such as beads or balls to provide the necessary stand-off between the capping layer and the underlying reflective structures.
    • 通过使用能够提供气密密封的低温粘合剂(例如玻璃料)将覆盖层粘合在承载有源反射表面的晶片上来制造空间光调制器。 在施加到覆盖层之后,在暴露于承载反射表面的基板之前,低温粘合剂可以B阶段固化。 根据本发明的一个实施例,封盖层可以包括预先与中介层间隔层结合的玻璃晶片,以在封盖层和下面的反射结构之间提供足够的间隔。 根据本发明的替代实施例,封盖层可以包括单独的玻璃晶片,并且粘合剂可以包括附加材料,例如珠或球,以在封盖层和下面的反射结构之间提供必要的间隔 。