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1. 发明公开

US20230230967A1 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20230230967A1
公开(公告)日：2023-07-20
申请号：US17889916
申请日：2022-08-17
申请人： Samsung Display Co., LTD.
发明人： In Woo KIM , Chang Woo KWON , Dae Cheol KIM , Jong Hwan PARK , Yong Tae CHO , Kook Hyun CHOI
IPC分类号： H01L25/16 , H01L27/12 , H01L23/00
CPC分类号： H01L25/167 , H01L27/124 , H01L27/1288 , H01L24/24 , H01L24/25 , H01L24/82 , H01L24/95 , H01L2224/24051 , H01L2224/24145 , H01L2224/25175 , H01L2224/24991 , H01L2224/95133 , H01L2224/82106 , H01L2224/82007
摘要： A display device includes a conductive pattern on a substrate, a via layer on the conductive pattern with a via hole exposing the conductive pattern, a first electrode and a second electrode on the via layer and spaced apart from each other, a first insulating layer on the first electrode and the second electrode, a bank layer on the first insulating layer defining an emission area and a subarea, a light-emitting element on the first insulating layer, and a first connection electrode and a second connection electrode on the first insulating layer and the light-emitting element. The first connection electrode electrically contacts an end of the light-emitting element, and the second connection electrode electrically contacts another end of the light-emitting element. The bank layer includes a bank extension portion extended to the subarea and the bank extension portion overlaps at least a portion of the via hole.

2. 发明授权

US09837340B2 Apparatus, system, and method for wireless connection in integrated circuit packages 有权
公开(公告)号：US09837340B2
公开(公告)日：2017-12-05
申请号：US15195310
申请日：2016-06-28
申请人： Intel Corporation
发明人： Jiamiao Tang , Henry Xu , Shinichi Sakamoto
IPC分类号： H01L23/498 , H01L23/00 , H01L25/065 , H01L23/522 , H01L23/50 , H01L25/18 , H01L21/50 , H01L21/56 , H01L21/60
CPC分类号： H01L23/49811 , H01L21/50 , H01L21/56 , H01L23/49838 , H01L23/50 , H01L23/5226 , H01L24/09 , H01L24/24 , H01L24/25 , H01L24/43 , H01L24/82 , H01L24/85 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2021/60007 , H01L2224/24011 , H01L2224/24051 , H01L2224/24145 , H01L2224/24226 , H01L2224/24998 , H01L2224/32145 , H01L2224/32225 , H01L2224/435 , H01L2224/43985 , H01L2224/45144 , H01L2224/45147 , H01L2224/73267 , H01L2224/82007 , H01L2224/82039 , H01L2224/82047 , H01L2224/85138 , H01L2224/85815 , H01L2224/92244 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06568 , H01L2225/06582 , H01L2924/00011 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/30105 , H01L2924/30107 , H01L2224/82 , H01L2924/00 , H01L2224/48
摘要： Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.

3. 发明申请

US20140300008A1 Wafer scale technique for interconnecting vertically stacked dies 有权
标题翻译：用于互连垂直堆叠模具的晶圆刻度技术
公开(公告)号：US20140300008A1
公开(公告)日：2014-10-09
申请号：US14354647
申请日：2012-11-01
申请人： Technische Universiteit Eindhoven
发明人： Pinxiang Duan , Elbertus Smalbrugge , Oded Raz , Harmen Joseph Sebastiaan Dorren
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L24/24 , H01L24/27 , H01L24/48 , H01L24/49 , H01L24/66 , H01L24/82 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2223/6627 , H01L2224/05552 , H01L2224/05599 , H01L2224/24011 , H01L2224/24051 , H01L2224/24146 , H01L2224/24226 , H01L2224/24998 , H01L2224/27416 , H01L2224/27418 , H01L2224/27618 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/45015 , H01L2224/451 , H01L2224/48091 , H01L2224/49174 , H01L2224/49175 , H01L2224/49431 , H01L2224/82007 , H01L2224/82101 , H01L2224/83192 , H01L2224/83855 , H01L2224/85007 , H01L2224/85399 , H01L2224/94 , H01L2225/06524 , H01L2225/06568 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/10335 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2224/82 , H01L2924/014 , H01L2924/20104 , H01L2924/20105 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2224/45099 , H01L2924/207
摘要： A method and device for interconnecting stacked die surfaces with electrically conductive traces is provided that includes bonding, using a first layer of a photoresist compound, a second die (2) on top of a first die (1), heating the first layer above a pyrolyzation point of the photoresist compound, where the photoresist compound transitions to a stable layer, depositing a second layer of the photoresist compound (PR), using lithography, from a top surface of the first die (1) to a top surface of the second die (2), heating the second photoresist compound layer to a liquid state, where the liquid photoresist compound forms a smooth convex bridge between the first die (1) top surface and the second die (2) top surface, and depositing an electrically conductive layer on the smooth convex bridge, where an electrically conductive trace is formed between the first die (1) top surface and the second die (2) top surface.
摘要翻译：提供了一种用于将堆叠的裸片表面与导电迹线互连的方法和装置，其包括使用第一层光致抗蚀剂化合物，在第一裸片（1）的顶部上接合第二裸片（2），将第一层光致抗蚀剂化合物的热解点，其中光致抗蚀剂化合物转变到稳定的层，使用光刻从第一模具（1）的顶表面沉积到第二层的顶表面上的光致抗蚀剂化合物（PR）的第二层（2），将第二光致抗蚀剂化合物层加热到液态，其中液体光致抗蚀剂化合物在第一管芯（1）顶表面和第二管芯（2）顶表面之间形成平滑的凸起桥，并且沉积导电其中在第一模具（1）顶表面和第二模具（2）顶表面之间形成导电迹线。

4. 发明授权

US08846456B2 Method and apparatus for manufacturing an electronic module, and electronic module 有权
标题翻译：用于制造电子模块的方法和装置以及电子模块
公开(公告)号：US08846456B2
公开(公告)日：2014-09-30
申请号：US12310539
申请日：2007-08-29
申请人： Karl Weidner
发明人： Karl Weidner
IPC分类号： H01L21/00 , H01L23/31 , H01L23/00 , H01L21/56 , H05K3/28
CPC分类号： H01L23/3121 , H01L21/56 , H01L23/3164 , H01L24/24 , H01L24/76 , H01L24/82 , H01L2224/2402 , H01L2224/24051 , H01L2224/24998 , H01L2224/82007 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19041 , H05K3/284 , H05K2201/10674 , H05K2203/0537 , H05K2203/063 , H05K2203/074 , H05K2203/1311
摘要： A substrate which has at least one component, such as a semiconductor chip, arranged on it is manufactured from a film made of plastic material laminated onto a surface of the substrate and of the at least one component, where the surface has at least one contact area. First, the film to be laminated onto the surface of the substrate and the at least one component, or a film composite including the film, is arranged in a chamber such that the chamber is split by the film or film composite into a first chamber section and a second chamber section, which is isolated from the first chamber section so as to be gastight. A higher atmospheric pressure is provided or produced in the first chamber section than in the second chamber section; and contact is made between the surface of the substrate arranged in the second chamber section and the at least one component and the film or the film composite, which contact brings about the lamination of the film onto the surface.
摘要翻译：具有布置在其上的至少一个组件（例如半导体芯片）的衬底由层压到衬底的表面上的塑料材料制成的薄膜和至少一个组件制成，其中表面具有至少一个触点区。首先，将要层压在基材表面上的薄膜和至少一种组分或包含该薄膜的薄膜复合材料布置在室中，使得该腔室被薄膜或薄膜复合材料分裂成第一腔室部分以及第二室部分，其与第一室部分隔离以便气密。在第一室部分中比在第二室部分中提供或产生更高的大气压力; 并且在布置在第二室部分中的基板的表面与至少一个部件以及膜或膜复合物之间形成接触，该接触引起膜在表面上的层压。

5. 发明授权

US08814406B2 Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip 有权
标题翻译：光电头灯，生产光电头灯的方法和发光二极管芯片
公开(公告)号：US08814406B2
公开(公告)日：2014-08-26
申请号：US13584571
申请日：2012-08-13
申请人： Johannes Baur , Joachim Reill , Jörg Erich Sorg
发明人： Johannes Baur , Joachim Reill , Jörg Erich Sorg
IPC分类号： H01L33/00 , H01L23/00 , H01L33/20 , F21S8/10 , H01L27/15 , H01L33/62 , F21Y101/02 , H01L25/075
CPC分类号： H01L27/15 , F21S41/00 , F21S41/143 , F21S41/663 , F21Y2115/10 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L33/20 , H01L33/62 , H01L2224/24011 , H01L2224/24051 , H01L2224/24137 , H01L2224/24226 , H01L2224/24998 , H01L2224/82007 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01058 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/014 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/00
摘要： An optoelectronic headlight which emits electromagnetic radiation is specified, which has a luminescence diode chip with at least two spatial emission regions or which has at least two luminescence diode chips each having at least one spatial emission region. The headlight is suitable in particular for a front headlight for motor vehicles. The emission regions, in a plan view of a main extension plane associated with them, are shaped differently, are of different sizes and/or are not shaped rectangularly and are differently oriented. Particularly preferably, the emission regions can be driven independently of one another. Methods for production of an optoelectronic headlight and a luminescence diode chip are furthermore specified.
摘要翻译：规定发射电磁辐射的光电头灯，其具有至少两个空间发射区域的发光二极管芯片，或者具有至少两个具有至少一个空间发射区域的发光二极管芯片。前大灯特别适用于汽车的前大灯。在与它们相关联的主延伸平面的平面图中的发射区域的形状不同，具有不同的尺寸和/或不成形为矩形并且具有不同的取向。特别优选地，发射区域可以彼此独立地驱动。进一步说明制造光电前灯和发光二极管芯片的方法。

6. 发明申请

US20130334707A1 APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES 有权
公开(公告)号：US20130334707A1
公开(公告)日：2013-12-19
申请号：US13970053
申请日：2013-08-19
申请人： Jiamiao Tang , Henry Xu , Shinichi Sakamoto
发明人： Jiamiao Tang , Henry Xu , Shinichi Sakamoto
IPC分类号： H01L25/065
CPC分类号： H01L23/49811 , H01L21/50 , H01L21/56 , H01L23/49838 , H01L23/50 , H01L23/5226 , H01L24/09 , H01L24/24 , H01L24/25 , H01L24/43 , H01L24/82 , H01L24/85 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2021/60007 , H01L2224/24011 , H01L2224/24051 , H01L2224/24145 , H01L2224/24226 , H01L2224/24998 , H01L2224/32145 , H01L2224/32225 , H01L2224/435 , H01L2224/43985 , H01L2224/45144 , H01L2224/45147 , H01L2224/73267 , H01L2224/82007 , H01L2224/82039 , H01L2224/82047 , H01L2224/85138 , H01L2224/85815 , H01L2224/92244 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06568 , H01L2225/06582 , H01L2924/00011 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/30105 , H01L2924/30107 , H01L2224/82 , H01L2924/00 , H01L2224/48
摘要： Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.

7. 发明授权

US08034412B2 Treatment of items 失效
标题翻译：物品处理
公开(公告)号：US08034412B2
公开(公告)日：2011-10-11
申请号：US11886835
申请日：2006-03-21
申请人： David Stephen Thomas , Philip Gareth Bentley
发明人： David Stephen Thomas , Philip Gareth Bentley
IPC分类号： B05D5/00 , H05K13/00 , H01L21/00
CPC分类号： B82Y30/00 , B82Y40/00 , H01L24/24 , H01L24/82 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/76155 , H01L2224/82007 , H01L2224/82102 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/10253 , H05K3/284 , H05K2201/10636 , H05K2201/10674 , H05K2203/0759 , Y02P70/611 , Y10T29/49146 , Y10T29/49171 , Y10T428/24479 , H01L2924/00
摘要： A method of forming a ramp of material on a stepped portion of an item, comprises applying material in liquid form to the item in the vicinity of the stepped portion, the liquid having properties such that the liquid moves by capillary attraction to the stepped portion, and causing or allowing the material to solidify to form a ramp on the stepped portion. By using capillary flow, it is not necessary for the material to be placed in position very accurately. Variations in position of placement can be accommodated by the flow to the stepped region. The greater tolerance in accuracy of positioning means that processing can be performed more quickly.
摘要翻译：在物品的阶梯部分上形成材料斜面的方法包括将液体形式的材料施加到阶梯部分附近的物品，所述液体具有使得液体通过毛细吸引而移动到阶梯部分的特性，并且使所述材料固化以在所述台阶部分上形成斜面。通过使用毛细管流动，不需要将材料非常准确地放置在适当位置。放置位置的变化可以通过到台阶区域的流动来适应。定位准确度的更大公差意味着可以更快地执行处理。

8. 发明授权

US07955901B2 Method for producing a power semiconductor module comprising surface-mountable flat external contacts 有权
标题翻译：一种用于制造功率半导体模块的方法，所述功率半导体模块包括可表面安装的平坦外部触点
公开(公告)号：US07955901B2
公开(公告)日：2011-06-07
申请号：US11867329
申请日：2007-10-04
申请人： Henrik Ewe , Stefan Landau , Klaus Schiess , Robert Bergmann , Alvin Wee Beng Tatt , Soon Lock Goh , Joachim Mahler , Boris Plikat , Reimund Engl
发明人： Henrik Ewe , Stefan Landau , Klaus Schiess , Robert Bergmann , Alvin Wee Beng Tatt , Soon Lock Goh , Joachim Mahler , Boris Plikat , Reimund Engl
IPC分类号： H01L23/48
CPC分类号： H01L23/3107 , H01L23/49524 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L24/24 , H01L24/80 , H01L24/82 , H01L2224/24051 , H01L2224/24226 , H01L2224/24246 , H01L2224/24998 , H01L2224/32245 , H01L2224/76155 , H01L2224/82007 , H01L2224/82039 , H01L2224/82102 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/30107 , H01L2924/351 , H01L2924/00
摘要： A method for producing a power semiconductor module having surface mountable flat external contact areas is disclosed. At least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the side edges of the semiconductor chip as far as the inner housing plane was a leaving free the source and gate contact areas on the top side of the semiconductor chip and also was partly leaving free the top sides of the corresponding external contacts.
摘要翻译：公开了一种具有表面安装平坦的外部接触区域的功率半导体模块的制造方法。至少一个功率半导体芯片由其后侧固定在漏极外部触点上。绝缘层覆盖半导体芯片的侧边缘上方的顶侧，只要内壳平面离开半导体芯片的顶侧上的源极和栅极接触区域，并且还部分地释放出半导体芯片的顶侧相应的外部联系人。

9. 发明授权

US07859005B2 Method for the production of a semiconductor component comprising a planar contact, and semiconductor component 有权
标题翻译：用于生产包括平面接触的半导体部件和半导体部件的方法
公开(公告)号：US07859005B2
公开(公告)日：2010-12-28
申请号：US11991197
申请日：2006-08-30
申请人： Karl Weidner
发明人： Karl Weidner
IPC分类号： H01L33/00
CPC分类号： H01L23/482 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L33/44 , H01L33/62 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/82007 , H01L2224/82039 , H01L2224/82047 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/01078 , H01L2924/12044 , H01L2924/351 , H01L2924/00
摘要： In a method for producing a semiconductor component, in particular a semiconductor structure having a surface structure or topography which is produced by means of electronic components (2) on a substrate (1), at least one electronic component (2) is applied to a substrate (1), and an isolation layer (3) is applied to the topography which is produced by means of the at least one component (2) on the substrate (1). Contact-making openings (5) are then produced in the isolation layer (3) at contact points (8, 9) for the at least one electronic component, the isolation layer (3) and the contact points (8, 9) in the contact-making openings (5) are planar-metallized, and the metallization is structured in order to produce electrical connections (4), with the isolation layer (3) having a glass coating.
摘要翻译：在用于制造半导体部件的方法中，特别是具有通过基板（1）上的电子部件（2）制造的表面结构或形貌的半导体结构，至少一个电子部件（2）被施加到衬底（1）和隔离层（3）施加到通过衬底（1）上的至少一个部件（2）产生的形貌。然后在用于至少一个电子部件的接触点（8,9）的隔离层（3）中产生接触制作开口（5），隔离层（3）和接触点（8,9）接触开口（5）是平面金属化的，并且金属化被构造为产生电连接（4），隔离层（3）具有玻璃涂层。

10. 发明授权

US07776663B2 Semiconductor display devices 有权
标题翻译：半导体显示设备
公开(公告)号：US07776663B2
公开(公告)日：2010-08-17
申请号：US12057994
申请日：2008-03-28
申请人： Shunpei Yamazaki , Setsuo Nakajima , Yasuyuki Arai
发明人： Shunpei Yamazaki , Setsuo Nakajima , Yasuyuki Arai
IPC分类号： H01L21/02
CPC分类号： H01L27/1266 , G02F1/133305 , G02F1/13452 , G02F2001/13613 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L27/1214 , H01L27/1218 , H01L2221/68368 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/82007 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/00
摘要： In a liquid crystal display device, a first substrate includes electrical wirings and a semiconductor integrated circuit which has TFTs and is connected electrically to the electrical wirings, and a second substrate includes a transparent conductive film on a surface thereof. A surface of the first substrate that the electrical wirings are formed is opposite to the transparent conductive film on the second substrate. the semiconductor integrated circuit has substantially the same length as one side of a display screen (i.e., a matrix circuit) of the display device and is obtained by peeling it from another substrate and then forming it on the first substrate. Also, in a liquid crystal display device, a first substrate includes a matrix circuit and a peripheral driver circuit, and a second substrate is opposite to the first substrate, includes a matrix circuit and a peripheral driver circuit and has at least a size corresponding to the matrix circuit and the peripheral driver circuit. Spacers is provided between the first and second substrates. A seal material is formed outside the matrix circuits and the peripheral driver circuits in the first and second substrates. A liquid crystal material is filled inside a region enclosed by the seal material. A protective film is formed on the peripheral driver circuit has substantially a thickness equivalent to an interval between the substrates which is formed by the spacers.
摘要翻译：在液晶显示装置中，第一基板包括电布线和半导体集成电路，该半导体集成电路具有TFT并且与电布线电连接，第二基板在其表面上包括透明导电膜。形成电气配线的第一基板的表面与第二基板上的透明导电膜相反。半导体集成电路具有与显示装置的显示屏（即，矩阵电路）的一侧基本相同的长度，并且通过从另一基板剥离然后在第一基板上形成。另外，在液晶显示装置中，第一基板包括矩阵电路和外围驱动电路，第二基板与第一基板相对，包括矩阵电路和外围驱动电路，并且至少具有与矩阵电路和外围驱动电路。隔板设置在第一和第二基板之间。在第一和第二基板中的矩阵电路和外围驱动电路之外形成密封材料。将液晶材料填充在由密封材料包围的区域内。在外围驱动电路上形成保护膜，其厚度基本上等于由间隔物形成的基板之间的间隔。

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