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    • 1. 发明授权
    • Controlled inductance device and method
    • 控制电感器件及方法
    • US07109837B2
    • 2006-09-19
    • US10666580
    • 2003-09-17
    • Charles WattsLucian E. Scripca
    • Charles WattsLucian E. Scripca
    • H01F17/06
    • G05F7/00H01F38/023
    • Improved inductive apparatus having controlled core saturation which provides a desired inductance characteristic with low cost of manufacturing. In one embodiment, a pot core having a variable geometry gap is provided. The variable geometry gap allows for a “stepped” inductance profile with high inductance at low dc currents, and a lower inductance at higher dc currents, corresponding for example to the on-hook and off-hook states of a Caller ID function in a typical telecommunications line. In other embodiments, single- and multi-spool drum core devices are disclosed which use a controlled saturation element to allow for selectively controlled saturation of the core. Exemplary signal conditioning circuits (e.g., dynamically controlled low-capacitance DSL filters) using the aforementioned inductive devices are disclosed, as well as cost-efficient methods of manufacturing the inductive devices. An improved gapped toroid and an associated method of manufacturing is also disclosed.
    • 具有受控的磁芯饱和度的改进的感应装置,其以低制造成本提供期望的电感特性。 在一个实施例中,提供具有可变几何间隙的罐芯。 可变几何间隙允许在低直流电流下具有高电感的“阶梯式”电感分布,以及在较高直流电流下的较低电感,例如对应于典型的来电显示功能的挂机和摘机状态 电讯线。 在其他实施例中,公开了使用受控饱和元件以允许芯的选择性受控饱和的单卷轴和多卷轴鼓芯装置。 公开了使用上述感应装置的示例性信号调理电路(例如,动态控制的低电容DSL滤波器)以及制造感应装置的成本有效的方法。 还公开了改进的间隙环形和相关的制造方法。
    • 2. 发明授权
    • Method of manufacturing an improved microelectronic package
    • 制造改进的微电子封装的方法
    • US06877211B2
    • 2005-04-12
    • US09794263
    • 2001-02-27
    • Russell Lee Machado
    • Russell Lee Machado
    • H01F27/02H01F27/29H05K5/00H01F7/06
    • H01F27/027H01F27/292H05K5/0095Y10T29/49002Y10T29/4902Y10T29/49073Y10T29/49128Y10T29/49144Y10T29/49165Y10T29/49169
    • A method of making a microelectronic package. The advanced microelectronic component package incorporates a specially shaped base element which holds and electrically separates the individual conductors associated with the microelectronic component(s) so that the individual conductors may be bonded to external package leads and other conductors within the package. In a first embodiment, jacketed, insulated wire is used as one winding of a toroidal transformer, while unjacketed insulated wire is used as another winding. The jacketing is stripped from the first winding and the exposed conductors are routed into channels along the sides of the base element. The unjacketed conductors are also routed into the same channels, where both conductors are bonded to the external package leads. Raised elements along the sides of the base provide the required electrical separation between the conductors during both manufacture and operation. A method of manufacturing the improved microelectronic package is also disclosed.
    • 制造微电子封装的方法。 先进的微电子部件封装包含特殊形状的基座元件,其保持并电分离与微电子部件相关联的各个导体,使得各个导体可以结合到封装内的外部封装引线和其它导体。 在第一实施例中,夹套的绝缘电线用作环形变压器的一个绕组,而未封装的绝缘电线用作另一绕组。 护套从第一绕组剥离,并且暴露的导体沿着基底元件的侧面被引导到通道中。 未封装的导体也被路由到相同的通道中,其中两个导体结合到外部封装引线。 沿着基座侧面的凸起元件在制造和操作期间都提供导体之间所需的电气分离。 还公开了一种制造改进的微电子封装的方法。
    • 4. 发明授权
    • Monolithic inductor
    • 单片电感
    • US6087920A
    • 2000-07-11
    • US798636
    • 1997-02-11
    • Igor Abramov
    • Igor Abramov
    • H01F17/04H01F17/00H01F27/29H05K1/02H05K3/34H01F27/30
    • H01F27/292H01F17/0033H05K3/3442H05K1/0233H05K2201/0792H05K2201/09381H05K2201/09663H05K2201/10583H05K2201/10636Y02P70/611Y02P70/613Y10T29/4902
    • A monolithic inductor (10) comprises an elongated substrate having opposite distal ends (14) and (16), each end having an end cap extending from the opposite ends to support the substrate (12) in spaced relation from a PC board, the end caps being formed with non-mounting areas and a deflection area for preventing the substrate resting on the non-mounting area, a substantially steep side wall (16) on the substrate side of the end cap (14) at the non-mounting area, and an inclined ramp extending up to a top of the end cap on the substrate side substantially opposite the non-mounting area, an electrically conductive soldering band (30) extending partially around each end cap, each soldering band having a gap (34) at the non-mounting area for thereby reducing parasitic conduction in the band (30), and an electrically conductive layer formed on the substrate in a helical path extending between the opposite ends and in electrical contact with the conductive soldering bands (30) at the ramps (120).
    • 单片电感器(10)包括具有相对的远端(14)和(16)的细长衬底,每个端部具有从相对端延伸的端盖,以与PC板隔开的关系支撑衬底(12),端部 盖子形成有非安装区域和用于防止基板搁置在非安装区域上的偏转区域,在非安装区域处在端盖(14)的基板侧上的基本上陡峭的侧壁(16) 以及一个倾斜的斜坡,其基本上与所述非安装区域相对地延伸到所述端盖的顶部的顶部;导电焊接带(30),其部分地围绕每个端盖延伸,每个焊带具有间隙(34) 所述非安装区域由此减小所述带(30)中的寄生传导,以及形成在所述基板上的螺旋形路径中的导电层,所述导电层在所述相对端之间延伸并在所述斜面处与所述导电焊带(30)电接触 (120)。
    • 5. 发明授权
    • High density connector modules having integral filtering components
within repairable, replaceable submodules
    • 高密度连接器模块,具有可修复,可更换的子模块中的集成过滤元件
    • US6062908A
    • 2000-05-16
    • US10203
    • 1998-01-21
    • Terrill H. Jones
    • Terrill H. Jones
    • H01R13/514H01R13/66H01R13/717H01R13/719
    • H01R13/514H01R13/665H01R13/717H01R13/7172H01R13/7175H01R13/719H01R12/725H01R2201/04H01R24/64
    • A connector module for mounting on a circuit board includes a housing and at least one plug-receiving opening for receiving an RJ-45 or other similar jack. Each plug-receiving opening includes contact portions that make electrical contact with individual conductors, e.g., twisted pair conductors, connected to the RJ-45 jack. A plurality of connection pins protrude from a bottom surface of the housing and facilitate mounting of the modular connector onto the circuit board. Protection/filtering circuitry, located within vertical space inside of the housing so as to reside adjacent the connection pins, electrically couples and minimizes the electrical distance between the contact portions associated with each plug-receiving opening and the plurality of connection pins. The protection/filtering circuitry includes at least one ring-shaped ferrite core. Light emitting diodes may also be included as an integral part of the module, but are mounted for viewing so as to be outside of the shielded portions of the module.
    • 用于安装在电路板上的连接器模块包括壳体和用于接收RJ-45或其它类似插孔的至少一个插头接收开口。 每个插头接收开口包括与RJ-45插孔连接的各个导体例如双绞线导体电接触的接触部分。 多个连接销从壳体的底表面突出,并且便于将模块化连接器安装到电路板上。 保护/过滤电路位于壳体内部的垂直空间内,以便邻近连接销位置电耦合并使与每个插头接收开口和多个连接销相关联的接触部分之间的电距离最小化。 保护/滤波电路包括至少一个环形铁氧体磁芯。 也可以包括发光二极管作为模块的组成部分,但是安装用于观察以便在模块的屏蔽部分的外部。
    • 7. 发明授权
    • Compliant cantilever surface mount lead
    • 符合悬臂表面安装导线
    • US5253145A
    • 1993-10-12
    • US824985
    • 1992-01-24
    • James D. Lint
    • James D. Lint
    • H05K3/34H05K13/04H05K7/14
    • H05K13/046H05K3/3426H05K2201/1003H05K2201/10325H05K2201/10818Y02P70/613
    • A compliant lead structure for mounting a circuit element to a PC board comprises a support body for supporting a circuit element, a plurality of elongated compliant cylindrical conductive lead members secured at an inner end to the support body and extending outward from the support body substantially perpendicular to a mounting plane of a PC board to which the support body is to be mounted and to a position for surface bonding to a PC board, the lead members having an elongated unrestricted section between the inner end and the outer end for enabling relative movement between the support body and a PC board to which the lead member is bonded, and a lead wire extends from a circuit element on the support body and connected to the lead member.
    • 用于将电路元件安装到PC板的兼容引线结构包括用于支撑电路元件的支撑体,多个细长顺应性圆柱形导电引线构件,其在内端固定到支撑体并从支撑体向外基本垂直 连接到要安装支撑体的PC板的安装平面和用于表面粘合到PC板的位置,所述引线构件在内端和外端之间具有细长的无限制部分,以使得能够相对于第 所述支撑体和所述引线部件接合的PC板,并且引线从所述支撑体上的电路元件延伸并连接到所述引线部件。
    • 10. 再颁专利
    • Impedance blocking filter circuit
    • 阻抗滤波电路
    • USRE40020E1
    • 2008-01-22
    • US10748729
    • 2003-12-29
    • Frederick J. Kiko
    • Frederick J. Kiko
    • H04M1/24H04M1/00H04M9/00H04M11/00
    • H03G7/00H03G11/00H03H1/0007H03H7/0115H03H7/06H03H2001/005H04M11/062
    • An impedance blocking filter circuit is provided for use in telecommunication systems for interconnecting between incoming telephone lines and customer's terminal equipment so as to unconditionally block impedances above 20 KHz due to the customer's terminal equipment from an ADSL network unit and/or home networking interface unit. The filter circuit includes first, second, and third inductors connected in series between a first input terminal and a first common point. A first resistor has its one end connected also to the first common point and its other end connected to a first output terminal. Fourth, fifth and sixth inductors are connected in series between a second input terminal and a second common point. A second resistor has its one end also connected to the second common point and its other end connected to a second output terminal. A capacitor has its ends connected across the first and second common points. In other aspects, the filter circuit also includes switching means for eliminating shunt additive capacitance, correction circuit means reducing significantly return loss, and switch suppression circuit means for eliminating transients.
    • 提供阻抗阻塞滤波器电路,用于电话系统中用于互连电话线路和客户终端设备之间的互连,以便由于客户的终端设备来自ADSL网络单元和/或家庭网络接口单元,无阻塞地阻塞20KHz以上的阻抗。 滤波电路包括串联连接在第一输入端和第一公共点之间的第一,第二和第三电感器。 第一电阻器的一端也连接到第一公共点,而另一端连接到第一输出端子。 第四,第五和第六电感器串联连接在第二输入端和第二公共点之间。 第二电阻器的一端也连接到第二公共点,而另一端连接到第二输出端子。 电容器的端部连接在第一和第二公共点上。 在其他方面,滤波电路还包括用于消除并联添加电容的切换装置,校正电路意味着显着降低损耗,以及用于消除瞬变的开关抑制电路装置。