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1. 发明授权

US08510635B2 Method for evaluating failure rate 有权
标题翻译：评估失败率的方法
公开(公告)号：US08510635B2
公开(公告)日：2013-08-13
申请号：US12979914
申请日：2010-12-28
申请人： Yun-Chi Yang , Yen-Song Liu , Chin-Hsien Chen , Sheng-Yu Wu , Kuan-Cheng Su
发明人： Yun-Chi Yang , Yen-Song Liu , Chin-Hsien Chen , Sheng-Yu Wu , Kuan-Cheng Su
IPC分类号： G11C29/00
CPC分类号： G11C29/52 , G01R31/287 , G11C29/42 , G11C29/44 , G11C29/56008 , G11C2029/0409 , G11C2029/0411
摘要： A method for evaluating failure rate, which is applied to a plurality of semiconductor chips with error checking and correcting function includes the following steps. A first read-write test operation is applied to the semiconductor chips, thereby obtaining a plurality of first failure bit counting values. The error checking and correcting function of each of the semiconductor chips is off. An aging test is applied to the semiconductor chips. A second read-write test operation as the first read-write test operation is applied to the semiconductor chips, thereby obtaining a plurality of second failure bit counting values. The number of the semiconductor chips, the first failure bit counting values, the second failure bit counting values and an error checking and correcting coefficient are calculated to obtain a failure rate of the semiconductor chips.
摘要翻译：一种用于评估故障率的方法，其应用于具有错误检查和校正功能的多个半导体芯片包括以下步骤。对半导体芯片应用第一读写测试操作，从而获得多个第一故障比特计数值。每个半导体芯片的错误检查和校正功能关闭。对半导体芯片进行老化试验。作为第一读写测试操作的第二读写测试操作被应用于半导体芯片，从而获得多个第二故障位计数值。计算半导体芯片的数量，第一故障比特计数值，第二故障比特计数值和错误校验系数，以获得半导体芯片的故障率。

2. 发明申请

US20120166130A1 METHOD FOR EVALUATING FAILURE RATE 有权
标题翻译：评估失败率的方法
公开(公告)号：US20120166130A1
公开(公告)日：2012-06-28
申请号：US12979914
申请日：2010-12-28
申请人： Yun-Chi YANG , Yen-Song Liu , Chin-Hsien Chen , Sheng-Yu Wu , Kuan-Cheng Su
发明人： Yun-Chi YANG , Yen-Song Liu , Chin-Hsien Chen , Sheng-Yu Wu , Kuan-Cheng Su
IPC分类号： G06F19/00
CPC分类号： G11C29/52 , G01R31/287 , G11C29/42 , G11C29/44 , G11C29/56008 , G11C2029/0409 , G11C2029/0411
摘要： A method for evaluating failure rate, which is applied to a plurality of semiconductor chips with error checking and correcting function includes the following steps. A first read-write test operation is applied to the semiconductor chips, thereby obtaining a plurality of first failure bit counting values. The error checking and correcting function of each of the semiconductor chips is off. An aging test is applied to the semiconductor chips. A second read-write test operation as the first read-write test operation is applied to the semiconductor chips, thereby obtaining a plurality of second failure bit counting values. The number of the semiconductor chips, the first failure bit counting values, the second failure bit counting values and an error checking and correcting coefficient are calculated to obtain a failure rate of the semiconductor chips.
摘要翻译：一种用于评估故障率的方法，其应用于具有错误检查和校正功能的多个半导体芯片包括以下步骤。对半导体芯片应用第一读写测试操作，从而获得多个第一故障比特计数值。每个半导体芯片的错误检查和校正功能关闭。对半导体芯片进行老化试验。作为第一读写测试操作的第二读写测试操作被应用于半导体芯片，从而获得多个第二故障位计数值。计算半导体芯片的数量，第一故障比特计数值，第二故障比特计数值和错误校验系数，以获得半导体芯片的故障率。

3. 发明申请

US20090212353A1 NON-VOLATILE MEMORY 有权
标题翻译：非易失性存储器
公开(公告)号：US20090212353A1
公开(公告)日：2009-08-27
申请号：US12434828
申请日：2009-05-04
申请人： Chin-Hsien Chen , Ying-Tso Chen , Chien-Hung Liu , Shou-Wei Huang
发明人： Chin-Hsien Chen , Ying-Tso Chen , Chien-Hung Liu , Shou-Wei Huang
IPC分类号： H01L29/792
CPC分类号： H01L27/115 , H01L27/11521 , H01L27/11568 , H01L29/7881 , H01L29/792
摘要： A non-volatile memory includes a substrate having two openings, a stacked gate structure disposed on the substrate between the two openings, a liner disposed on a bottom of each of the two openings and parts of a sidewall of each of the two openings, a second conductive layer disposed on the liner at the bottom of each of the two openings, and a third conductive layer on the second conductive layer and the liner. The stacked gate structure includes a first dielectric layer, a charge storage layer, a second dielectric layer, and a first conductive layer. The liner has a top surface lower than that of the substrate. The second conductive layer has a top surface co-planar with that of the liner. The third conductive layer has a top surface at least co-planar with that of the substrate and lower than that of the first dielectric layer.
摘要翻译：非易失性存储器包括具有两个开口的衬底，设置在两个开口之间的衬底上的堆叠栅极结构，设置在两个开口中的每一个的底部和两个开口中的每一个的侧壁的一部分的衬垫，设置在两个开口中的每一个的底部的衬垫上的第二导电层，以及在第二导电层和衬垫上的第三导电层。层叠栅极结构包括第一介电层，电荷存储层，第二介电层和第一导电层。衬垫具有比衬底更低的顶表面。第二导电层具有与衬垫的顶表面共面的顶表面。第三导电层具有至少与基底的共面的顶表面，并且低于第一介电层的顶表面。

4. 发明授权

US07572691B2 Non-volatile memory and method of fabricating the same 有权
标题翻译：非易失性存储器及其制造方法
公开(公告)号：US07572691B2
公开(公告)日：2009-08-11
申请号：US11435458
申请日：2006-05-16
申请人： Chin-Hsien Chen , Ying-Tso Chen , Chien-Hung Liu , Shou-Wei Huang
发明人： Chin-Hsien Chen , Ying-Tso Chen , Chien-Hung Liu , Shou-Wei Huang
IPC分类号： H01L21/336 , H01L21/8234
CPC分类号： H01L27/115 , H01L27/11521 , H01L27/11568 , H01L29/7881 , H01L29/792
摘要： A method of fabricating a non-volatile memory is provided. First, two openings are formed on a substrate. A stacked gate structure comprising a first dielectric layer, a charge storage layer, a second dielectric layer and a first conductive layer is formed on the substrate between the two openings. A liner is formed on a bottom and a portion of a sidewall of the tow openings, wherein a top surface of the liner is lower than that of the substrate. A second conductive layer is formed on the liner at the bottom of the two openings, wherein a top surface of the second conductive layer is co-planar with that of the liner. A third conductive layer is formed on the second conductive layer and the liner, wherein a top surface of the third conductive layer is co-planar with that of the substrate and lower than that of the first dielectric layer.
摘要翻译：提供了一种制造非易失性存储器的方法。首先，在基板上形成两个开口。在两个开口之间的基板上形成包括第一电介质层，电荷存储层，第二电介质层和第一导电层的堆叠栅极结构。衬套形成在丝束开口的侧壁的底部和一部分上，其中衬垫的顶表面低于衬底的顶表面。第二导电层形成在两个开口的底部的衬垫上，其中第二导电层的顶表面与衬垫的顶表面共面。第三导电层形成在第二导电层和衬垫上，其中第三导电层的顶表面与衬底的顶表面平行，并且低于第一介电层的顶表面。

5. 发明申请

US20110280003A1 BACKLIGHT MODULE AND DISPLAY DEVICE WITH TWO-SIDED LIGHT EMITTING STRUCTURE 有权
标题翻译：具有两面发光结构的背光模组和显示装置
公开(公告)号：US20110280003A1
公开(公告)日：2011-11-17
申请号：US13088435
申请日：2011-04-18
申请人： Chih-Hua Hsu , Jung-Shiung Liau , Chin-Hsien Chen , Gustavo Salazar
发明人： Chih-Hua Hsu , Jung-Shiung Liau , Chin-Hsien Chen , Gustavo Salazar
IPC分类号： G09F13/04 , F21V29/00
CPC分类号： G09F13/04 , G02F1/133603 , G02F2001/133342 , G02F2001/133628 , G09F2013/222 , H05K1/0203 , H05K1/189 , H05K3/0061 , H05K2201/10106
摘要： A backlight module includes a flexible circuit board. The flexible circuit board includes a conductive layer and an insulating layer covering the conductive layer. The backlight module further includes a plurality of light emitting diodes respectively disposed on two sides of the flexible circuit board and electrically connected to the conductive layer of the flexible circuit board for emitting light towards the two sides of the flexible circuit board.
摘要翻译：背光模块包括柔性电路板。柔性电路板包括导电层和覆盖导电层的绝缘层。背光模块还包括多个发光二极管，分别设置在柔性电路板的两侧，并电连接到柔性电路板的导电层，用于向柔性电路板的两侧发射光。

6. 发明申请

US20100270915A1 Beta-Diketone Ancillary Ligands and Their Metal Complexes Used in Organic Optoelectronic Devices 有权
标题翻译： β-二酮辅助配体及其用于有机光电器件的金属络合物
公开(公告)号：US20100270915A1
公开(公告)日：2010-10-28
申请号：US12766011
申请日：2010-04-23
申请人： Chien-Hong Cheng , Fang-ly Wu , Chin-Hsien Chen
发明人： Chien-Hong Cheng , Fang-ly Wu , Chin-Hsien Chen
IPC分类号： H01J1/63 , C07F15/00
CPC分类号： C07F15/0033 , C07F15/0086 , C09K11/06 , C09K2211/1007 , C09K2211/1014 , C09K2211/1029 , C09K2211/185 , H01L51/0085 , H01L51/0087 , H01L51/5016 , H01L51/5036
摘要： The present invention discloses a phosphor material for organic optoelectronic devices. The phosphor is a complex comprising a metal (Ir or Pt) and an aryl-modified beta-diketone ligand. The complexes of this invention are useful to function as an emitter in the emissive layer of an organic light emitting diode, even as the complex is the main component of this layer.
摘要翻译：本发明公开了一种有机光电器件的荧光体材料。荧光体是包含金属（Ir或Pt）和芳基改性的β-二酮配体的络合物。本发明的配合物可用作有机发光二极管的发射层中的发射极，即使复合物是该层的主要成分。

7. 发明授权

US09163638B2 Electronic device with fan 有权
标题翻译：带风扇的电子设备
公开(公告)号：US09163638B2
公开(公告)日：2015-10-20
申请号：US13445933
申请日：2012-04-13
申请人： Chin-Hsien Chen
发明人： Chin-Hsien Chen
IPC分类号： F04D29/42 , F04D25/06 , F04D29/52
CPC分类号： F04D25/0613 , F04D29/4226 , F04D29/522
摘要： An electronic device includes a casing and a fan received in the casing. The fan includes a cover plate, a bottom plate and a side wall. An air outlet is defined in the side wall. The bottom plate defines an air inlet. The casing includes a bottom cover and a top cover. The bottom cover includes a base plate, and a side plate extending upwardly from a periphery of the base plate. The bottom plate includes a horizontal first area and a second area inclining relative to the first area. A height of the base plate relative to a horizontal plane gradually increases from one side of the casing to another side of the casing. A height of the second area relative to the horizontal plane also gradually increases from the one side of the casing to another side of the casing.
摘要翻译：电子设备包括壳体和容纳在壳体中的风扇。该风扇包括盖板，底板和侧壁。在侧壁中限定出气口。底板限定了空气入口。壳体包括底盖和顶盖。底盖包括基板和从基板的周边向上延伸的侧板。底板包括水平的第一区域和相对于第一区域倾斜的第二区域。基板相对于水平面的高度从壳体的一侧逐渐增加到壳体的另一侧。第二区域相对于水平面的高度也从壳体的一侧逐渐增加到壳体的另一侧。

8. 发明授权

US07701719B2 Fastening device for thermal module 失效
标题翻译：热模块紧固装置
公开(公告)号：US07701719B2
公开(公告)日：2010-04-20
申请号：US12256437
申请日：2008-10-22
申请人： Chin-Hsien Chen , Rung-An Chen
发明人： Chin-Hsien Chen , Rung-An Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/0275 , H01L23/4006 , H01L23/467 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , Y10T24/42 , Y10T24/45597 , H01L2924/00
摘要： A thermal module includes a heat sink (20), a heat pipe (10) and a fastening device (100). The heat pipe has a condenser section (14) connected with the heat sink. The fastening device includes a base member (50) for fixing an evaporator section of the heat pipe, a positioning pole (58) disposed on and connected to the base member, and an elastic member (30). The positioning pole includes a neck (580) and a head (582). The elastic member includes an abutting portion (32) defining therein a positioning hole (320), and two locking portions (34) extending from the abutting portion. The neck of the positioning pole is freely and loosely received in the positioning hole of the abutting portion. A maximal outer diameter of the head of the positioning pole exceeds a diameter of the fixing hole.
摘要翻译：热模块包括散热器（20），热管（10）和紧固装置（100）。热管具有与散热器连接的冷凝器部分（14）。紧固装置包括用于固定热管的蒸发器部分的基座构件（50），设置在基座构件上并连接到基座构件的定位杆（58）和弹性构件（30）。定位杆包括颈部（580）和头部（582）。弹性构件包括限定有定位孔（320）的邻接部分（32）和从邻接部分延伸的两个锁定部分（34）。定位杆的颈部自由地松动地容纳在邻接部分的定位孔中。定位杆的头部的最大外径超过固定孔的直径。

9. 发明授权

US09087463B2 Backlight module and display device with two-sided light emitting structure 有权
标题翻译：背光模块和具有双面发光结构的显示设备
公开(公告)号：US09087463B2
公开(公告)日：2015-07-21
申请号：US13088435
申请日：2011-04-18
申请人： Chih-Hua Hsu , Jung-Shiung Liau , Chin-Hsien Chen , Gustavo Salazar
发明人： Chih-Hua Hsu , Jung-Shiung Liau , Chin-Hsien Chen , Gustavo Salazar
IPC分类号： G09F13/04 , G02F1/1335 , H05K1/18 , G02F1/1333 , G09F13/22 , H05K1/02 , H05K3/00
CPC分类号： G09F13/04 , G02F1/133603 , G02F2001/133342 , G02F2001/133628 , G09F2013/222 , H05K1/0203 , H05K1/189 , H05K3/0061 , H05K2201/10106
摘要： A backlight module includes a flexible circuit board. The flexible circuit board includes a conductive layer and an insulating layer covering the conductive layer. The backlight module further includes a plurality of light emitting diodes respectively disposed on two sides of the flexible circuit board and electrically connected to the conductive layer of the flexible circuit board for emitting light towards the two sides of the flexible circuit board.
摘要翻译：背光模块包括柔性电路板。柔性电路板包括导电层和覆盖导电层的绝缘层。背光模块还包括多个发光二极管，分别设置在柔性电路板的两侧，并电连接到柔性电路板的导电层，用于向柔性电路板的两侧发射光。

10. 发明授权

US09076769B2 Fixing device and thermal module incorporating the same 有权
标题翻译：固定装置和包含其的热模块
公开(公告)号：US09076769B2
公开(公告)日：2015-07-07
申请号：US13467059
申请日：2012-05-09
申请人： Chin-Hsien Chen
发明人： Chin-Hsien Chen
IPC分类号： H05K7/20 , F28F7/00 , H05K7/00 , H01L23/467 , H01L23/40 , H01L23/427 , F28D15/02 , G06F1/20 , H01L23/367
CPC分类号： H01L23/467 , F28D15/0275 , G06F1/20 , H01L23/367 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An exemplary fixing device is for mounting a heat conduction plate to two electronic components. The fixing device includes a first mounting clip and a second mounting clip connected to the first mounting clip through arms. The first mounting clip includes a pressing plate pressing a first contacting portion of the heat conduction plate against one electronic component. The second mounting clip includes two pressing tabs pressing a second contacting portion of the heat conduction plate against the other electronic component. The pressing plate and the two pressing tabs are made of a single monolithic piece of material.
摘要翻译：示例性的固定装置用于将导热板安装到两个电子部件上。固定装置包括第一安装夹和通过臂连接到第一安装夹的第二安装夹。第一安装夹包括将导热板的第一接触部分压靠在一个电子部件上的按压板。第二安装夹具包括将导热板的第二接触部分压靠在另一电子部件上的两个按压片。按压板和两个按压片由单块整体材料制成。

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