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1. 发明授权

US07510460B2 Substrate polishing apparatus 有权
公开(公告)号：US07510460B2
公开(公告)日：2009-03-31
申请号：US11806445
申请日：2007-05-31
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

2. 发明申请

US20090191790A1 SUBSTRATE POLISHING APPARATUS 有权
标题翻译：基板抛光装置
公开(公告)号：US20090191790A1
公开(公告)日：2009-07-30
申请号：US12372076
申请日：2009-02-17
申请人： Yoichi KOBAYASHI , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi KOBAYASHI , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于抛光基板的抛光表面的基板抛光装置具有用于在抛光期间监测基板的研磨表面上的薄膜的膜厚状态的膜厚监视装置。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

3. 发明申请

US20050239372A1 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US20050239372A1
公开(公告)日：2005-10-27
申请号：US11169797
申请日：2005-06-30
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： G01B11/06 , B24B37/013 , B24B37/20 , B24B49/12 , B24D7/12 , H01L21/304 , B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于抛光基板的抛光表面的基板抛光装置具有用于在抛光期间监测基板的研磨表面上的薄膜的膜厚状态的膜厚监视装置。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

4. 发明授权

US06758723B2 Substrate polishing apparatus 有权
公开(公告)号：US06758723B2
公开(公告)日：2004-07-06
申请号：US10329424
申请日：2002-12-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B100
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device, wherein the table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

5. 发明授权

US07585204B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US07585204B2
公开(公告)日：2009-09-08
申请号：US12372076
申请日：2009-02-17
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于抛光基板的抛光表面的基板抛光装置具有用于在抛光期间监测基板的研磨表面上的薄膜的膜厚状态的膜厚监视装置。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

6. 发明申请

US20070254565A1 Substrate polishing apparatus 有权
公开(公告)号：US20070254565A1
公开(公告)日：2007-11-01
申请号：US11806445
申请日：2007-05-31
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B7/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

7. 发明授权

US07241202B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US07241202B2
公开(公告)日：2007-07-10
申请号：US11169797
申请日：2005-06-30
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于抛光基板的抛光表面的基板抛光装置具有用于在抛光期间监测基板的研磨表面上的薄膜的膜厚状态的膜厚监视装置。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

8. 发明授权

US06942543B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US06942543B2
公开(公告)日：2005-09-13
申请号：US10854250
申请日：2004-05-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： G01B11/06 , B24B37/013 , B24B37/20 , B24B49/12 , B24D7/12 , H01L21/304 , B24B1/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于研磨基板的研磨面的基板研磨装置包括膜研磨装置，该装置用于监测研磨时的基板的研磨面上的薄膜的膜厚的状态。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

9. 发明授权

US07438627B2 Polishing state monitoring method 有权
标题翻译：抛光状态监测方法
公开(公告)号：US07438627B2
公开(公告)日：2008-10-21
申请号：US11819453
申请日：2007-06-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
IPC分类号： B24B1/00 , B24B49/00 , B24B51/00
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
摘要翻译：抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值光谱数据生成器生成的光谱数据。

10. 发明申请

US20070254557A1 Polishing state monitoring apparatus and polishing apparatus and method 有权
公开(公告)号：US20070254557A1
公开(公告)日：2007-11-01
申请号：US11819453
申请日：2007-06-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
IPC分类号： B24B49/12
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.

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