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1. 发明授权

US07443279B2 Coil package and bias tee package 失效
标题翻译：线圈封装和偏置三通封装
公开(公告)号：US07443279B2
公开(公告)日：2008-10-28
申请号：US11366625
申请日：2006-03-03
申请人： Takatoshi Yagisawa , Tadashi Ikeuchi , Yasuhide Kuroda , Tszshing Cheung
发明人： Takatoshi Yagisawa , Tadashi Ikeuchi , Yasuhide Kuroda , Tszshing Cheung
IPC分类号： H01F27/28 , H03H7/00
CPC分类号： H01F5/00 , H01F27/027 , H01F2005/006 , H01Q1/36 , H01Q19/09 , H05K1/0243
摘要： A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.
摘要翻译：一种线圈封装，使其易于处理高频锥/棱锥形线圈并增强频率特性，而不会降低线圈的特性。锥形/棱锥形线圈具有锥形或棱锥形状，其通过将导体线布置在芯的外周表面上而形成，使得线圈的卷绕直径从线圈的一端逐渐减小到另一端。线圈和电介质基板通过形成用于将线圈的尖端部分插入电介质基板的孔而彼此一体化，使得孔的底部和电介质基板的后表面通过通孔电连续，通过将锥形/锥体形的线圈的小直径侧引导到孔中，将孔的底部电连接到彼此的线圈和从线圈延伸的尖端侧引线，并将电极线圈的大直径侧到电介质基板上的电极。

2. 发明授权

US07696628B2 Relay substrate and substrate assembly 有权
标题翻译：继电器基板和基板组件
公开(公告)号：US07696628B2
公开(公告)日：2010-04-13
申请号：US12010878
申请日：2008-01-30
申请人： Tadashi Ikeuchi , Takatoshi Yagisawa , Tszshing Cheung
发明人： Tadashi Ikeuchi , Takatoshi Yagisawa , Tszshing Cheung
IPC分类号： H01L23/48
CPC分类号： H01P1/047 , H01L24/73 , H01L2224/48091 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H05K1/0219 , H05K1/117 , H05K1/141 , H05K1/147 , H05K2201/09618 , H05K2201/09727 , H05K2201/10121 , H05K2201/10446 , H01L2924/00014 , H01L2924/00
摘要： According to an aspect of an embodiment, a substrate for connecting circuit boards comprises: a substrate member having a first surface and a second surface facing each other and a first end and a second end facing each other; a first signal line formed on the first surface of the first end; a second signal line formed on the second surface of the second end; a third signal line connecting the first signal line with the second signal line; a first ground plane arranged on the first surface and surrounding the first signal line; and a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line.
摘要翻译：根据实施例的一个方面，一种用于连接电路板的基板包括：具有彼此面对的第一表面和第二表面以及彼此相对的第一端和第二端的基板构件; 形成在第一端的第一表面上的第一信号线; 形成在第二端的第二表面上的第二信号线; 连接所述第一信号线与所述第二信号线的第三信号线; 布置在第一表面上并围绕第一信号线的第一接地平面; 以及形成在第一接地上的第二信号线的一部分，该部分包括比第二信号线的另一部分窄的部分。

3. 发明申请

US20090029570A1 Relay substrate and substrate assembly 有权
标题翻译：继电器基板和基板组件
公开(公告)号：US20090029570A1
公开(公告)日：2009-01-29
申请号：US12010878
申请日：2008-01-30
申请人： Tadashi Ikeuchi , Takatoshi Yagisawa , Tszshing Cheung
发明人： Tadashi Ikeuchi , Takatoshi Yagisawa , Tszshing Cheung
IPC分类号： H01R12/12
CPC分类号： H01P1/047 , H01L24/73 , H01L2224/48091 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H05K1/0219 , H05K1/117 , H05K1/141 , H05K1/147 , H05K2201/09618 , H05K2201/09727 , H05K2201/10121 , H05K2201/10446 , H01L2924/00014 , H01L2924/00
摘要： According to an aspect of an embodiment, a substrate for connecting circuit boards comprises: a substrate member having a first surface and a second surface facing each other and a first end and a second end facing each other; a first signal line formed on the first surface of the first end; a second signal line formed on the second surface of the second end; a third signal line connecting the first signal line with the second signal line; a first ground plane arranged on the first surface and surrounding the first signal line; and a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line.
摘要翻译：根据实施例的一个方面，用于连接电路板的基板包括：具有彼此面对的第一表面和第二表面的基板构件和彼此面对的第一端和第二端; 形成在第一端的第一表面上的第一信号线; 形成在第二端的第二表面上的第二信号线; 连接所述第一信号线与所述第二信号线的第三信号线; 布置在第一表面上并围绕第一信号线的第一接地平面; 以及形成在第一接地上的第二信号线的一部分，该部分包括比第二信号线的另一部分窄的部分。

4. 发明授权

US07436056B2 Electronic component package 有权
标题翻译：电子元件包装
公开(公告)号：US07436056B2
公开(公告)日：2008-10-14
申请号：US11456870
申请日：2006-07-12
申请人： Tszshing Cheung , Tadashi Ikeuchi , Takatoshi Yagisawa
发明人： Tszshing Cheung , Tadashi Ikeuchi , Takatoshi Yagisawa
IPC分类号： H01L23/04 , H01L23/12
CPC分类号： H01L23/50 , H01L23/10 , H01L23/13 , H01L23/49822 , H01L23/49838 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6616 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/1617 , H01L2924/19051 , H01L2924/3011 , H01L2924/30111 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric substrate. A second signal line connected to an outside connection electrode and a second ground conductor are formed on a second surface of the dielectric substrate. The first ground conductor and the second ground conductor are connected by a plurality of ground conductor via-holes. A substrate-buried signal line connected to the first signal line and the second signal line is provided inside of the dielectric substrate so as to be put between the first ground conductor and the second ground conductor above and below and between the ground conductor via-holes on the right and left.
摘要翻译：电子部件封装包括电介质基板，其具有电子部件被密封的第一表面。连接到电子部件的第一信号线和第一接地导体形成在电介质基板的第一表面上。连接到外部连接电极和第二接地导体的第二信号线形成在电介质基板的第二表面上。第一接地导体和第二接地导体通过多个接地导体通孔连接。连接到第一信号线和第二信号线的衬底埋入信号线设置在电介质衬底的内部，以便放置在第一接地导体和第二接地导体之间和之下并且在接地导体通孔之间在右边和左边。

5. 发明申请

US20070241447A1 ELECTRONIC COMPONENT PACKAGE 有权
标题翻译：电子元件包装
公开(公告)号：US20070241447A1
公开(公告)日：2007-10-18
申请号：US11456870
申请日：2006-07-12
申请人： Tszshing Cheung , Tadashi Ikeuchi , Takatoshi Yagisawa
发明人： Tszshing Cheung , Tadashi Ikeuchi , Takatoshi Yagisawa
IPC分类号： H01L23/12
CPC分类号： H01L23/50 , H01L23/10 , H01L23/13 , H01L23/49822 , H01L23/49838 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6616 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/1617 , H01L2924/19051 , H01L2924/3011 , H01L2924/30111 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric substrate. A second signal line connected to an outside connection electrode and a second ground conductor are formed on a second surface of the dielectric substrate. The first ground conductor and the second ground conductor are connected by a plurality of ground conductor via-holes. A substrate-buried signal line connected to the first signal line and the second signal line is provided inside of the dielectric substrate so as to be put between the first ground conductor and the second ground conductor above and below and between the ground conductor via-holes on the right and left.
摘要翻译：电子部件封装包括电介质基板，其具有电子部件被密封的第一表面。连接到电子部件的第一信号线和第一接地导体形成在电介质基板的第一表面上。连接到外部连接电极和第二接地导体的第二信号线形成在电介质基板的第二表面上。第一接地导体和第二接地导体通过多个接地导体通孔连接。连接到第一信号线和第二信号线的衬底埋入信号线设置在电介质衬底的内部，以便放置在第一接地导体和第二接地导体之间和之下并且在接地导体通孔之间在右边和左边。

6. 发明申请

US20070164843A1 Coil package and bias tee package 失效
标题翻译：线圈封装和偏置三通封装
公开(公告)号：US20070164843A1
公开(公告)日：2007-07-19
申请号：US11366625
申请日：2006-03-03
申请人： Takatoshi Yagisawa , Tadashi Ikeuchi , Yasuhide Kuroda , Tszshing Cheung
发明人： Takatoshi Yagisawa , Tadashi Ikeuchi , Yasuhide Kuroda , Tszshing Cheung
IPC分类号： H01F27/02
CPC分类号： H01F5/00 , H01F27/027 , H01F2005/006 , H01Q1/36 , H01Q19/09 , H05K1/0243
摘要： A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.
摘要翻译：一种线圈封装，使其易于处理高频锥/棱锥形线圈并增强频率特性，而不会降低线圈的特性。锥形/棱锥形线圈具有锥形或棱锥形状，其通过将导体线布置在芯的外周表面上而形成，使得线圈的卷绕直径从线圈的一端逐渐减小到另一端。线圈和电介质基板通过形成用于将线圈的尖端部分插入电介质基板的孔而彼此一体化，使得孔的底部和电介质基板的后表面通过通孔电连续，通过将锥形/锥体形的线圈的小直径侧引导到孔中，将孔的底部电连接到彼此的线圈和从线圈延伸的尖端侧引线，并将电极线圈的大直径侧到电介质基板上的电极。

7. 发明申请

US20120286904A1 CONNECTION TERMINAL AND TRANSMISSION LINE 有权
标题翻译：连接端子和传输线
公开(公告)号：US20120286904A1
公开(公告)日：2012-11-15
申请号：US13561138
申请日：2012-07-30
申请人： Tadashi Ikeuchi , Takatoshi Yagisawa
发明人： Tadashi Ikeuchi , Takatoshi Yagisawa
IPC分类号： H01P5/08 , H01R12/79 , H01R12/71
CPC分类号： H01R12/62 , H01R12/57
摘要： A lead terminal includes signal lead pins and GND lead pins. The signal lead pin connects one signal pattern on a flexible substrate and another signal pattern on a rigid substrate. The GND lead pin connects one GND pattern on the flexible substrate and another GND pattern in the rigid substrate. A holding member has an insulating property and holds pairs of the signal lead pins and the GND lead pins at a distance. One main part of the signal lead pin and another main part of the GND lead pin form a microstrip line structure.
摘要翻译：引线端子包括信号引脚引脚和GND引脚引脚。信号引线引脚将柔性基板上的一个信号图案和刚性基板上的另一个信号图案连接起来。 GND引脚将柔性基板上的一个GND图案和刚性基板中的另一个GND图案连接起来。保持构件具有绝缘性能并且保持一定距离的信号引线引脚和GND引脚引脚。信号引脚的一个主要部分和GND引脚的另一个主要部分形成微带线结构。

8. 发明授权

US08178788B2 Electronic component package 有权
标题翻译：电子元件包装
公开(公告)号：US08178788B2
公开(公告)日：2012-05-15
申请号：US12222115
申请日：2008-08-01
申请人： Takatoshi Yagisawa , Tadashi Ikeuchi
发明人： Takatoshi Yagisawa , Tadashi Ikeuchi
IPC分类号： H05K1/02 , H05K1/11
CPC分类号： H01L23/4985 , G02B6/4201 , H01L23/057 , H01L23/66 , H01L2223/6627 , H01L2224/16 , H01L2224/32188 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/1903 , H01L2924/3011 , H05K1/0243 , H05K1/189 , H01L2224/0401
摘要： An electronic component package includes a film board where an electronic component is mounted, and a lid part mounted on the film board so as to cover a surface of the film board. The electronic component is provided in a cavity formed by the film board and the lid part, and the electronic component is connected to a signal wiring conductor formed at the film board.
摘要翻译：电子部件封装包括安装电子部件的薄膜基板和安装在薄膜基板上以覆盖薄膜基板的表面的盖部。电子部件设置在由薄膜基板和盖部形成的空腔中，电子部件与形成在薄膜基板上的信号布线导体连接。

9. 发明申请

US20070286612A1 Deskew device and deskew method 失效
标题翻译：歪斜矫正装置和歪斜矫正方法
公开(公告)号：US20070286612A1
公开(公告)日：2007-12-13
申请号：US11590749
申请日：2006-11-01
申请人： Naoki Kuwata , Tadashi Ikeuchi , Takatoshi Yagisawa
发明人： Naoki Kuwata , Tadashi Ikeuchi , Takatoshi Yagisawa
IPC分类号： H04B10/06
CPC分类号： H04J14/02 , H04B10/6971
摘要： In a receiver, a skew detector detects a skew between two synchronization symbols having different wavelengths among synchronization symbols included in received signals. A skew rough adjustment calculator calculates a delay compensation amount for each received signal based on the skew and a signal delay characteristic in a transmission path. A variable delay processor deskews the received signals based on the delay compensation amount.
摘要翻译：在接收机中，偏斜检测器检测包括在接收信号中的同步符号之间具有不同波长的两个同步符号之间的偏差。偏斜粗略调整计算器基于偏斜和传输路径中的信号延迟特性来计算每个接收信号的延迟补偿量。可变延迟处理器根据延迟补偿量对接收的信号进行偏移。

10. 发明授权

US08891975B2 Optical receiver and optical transmitter 有权
标题翻译：光接收机和光发射机
公开(公告)号：US08891975B2
公开(公告)日：2014-11-18
申请号：US13305870
申请日：2011-11-29
申请人： Takatoshi Yagisawa , Tadashi Ikeuchi
发明人： Takatoshi Yagisawa , Tadashi Ikeuchi
IPC分类号： H04B10/04 , H04B10/12 , H04B10/06 , H04B10/80 , H04B10/69
CPC分类号： H04B10/801 , H01L2224/48137 , H01L2924/3011 , H04B10/6911 , H01L2924/00
摘要： There is provided an optical receiver. The optical receiver includes a board to be coupled with an optical transmission line array, an optical diode array disposed on the board, and the optical diode array including a plurality of photo diodes each of which receives light from a corresponding optical transmission line in the optical transmission array. Further bias suppliers, conversion circuits, and capacitors are provided on the board or a real side of the board. Each of the photo diodes includes a first electrode and second electrodes, the first electrode receives a bias voltage supplied by a bias supplier, a current signal flowing through the second electrode is converted by a conversion circuit into a voltage signal, and one end of a capacitor is coupled to the first electrode and the other is grounded.
摘要翻译：提供了光接收器。该光接收器包括一个与光传输线阵列耦合的板，设在该板上的一个光二极管阵列，该光二极管阵列包括多个光电二极管，每个光电二极管阵列都接收来自光学传输线中对应的光传输线的光传输阵列。电路板或电路板背面还设有偏置电源，转换电路和电容器。每个光电二极管包括第一电极和第二电极，第一电极接收偏压供应器提供的偏置电压，流过第二电极的电流信号由转换电路转换成电压信号，一端电容器耦合到第一电极，另一个接地。

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