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    • 3. 发明授权
    • Method of manufacturing self-aligned silicide
    • 制造自对准硅化物的方法
    • US6150264A
    • 2000-11-21
    • US075420
    • 1998-05-08
    • Shu-Jen ChenRuoh-Haw ChangChih-Ching Hsu
    • Shu-Jen ChenRuoh-Haw ChangChih-Ching Hsu
    • H01L21/285H01L21/44
    • H01L21/28518
    • The invention relates to a method for manufacturing of a titanium self-aligned silicide (Salicide). This process includes of forming a metal layer over the surfaces of the semiconductor substrate and the gate electrode. Then, a rapid thermal process is performed with three stages to form the salicide, for example, titanium silicide, at the interface between the titanium and silicon, namely on the surfaces of the gate electrode and source/drain region. The rapid thermal process with three stages includes using the first stage with the first temperature to form the early titanium silicide having the C49 phase. The temperature is raised to a second temperature and the RTA process is performed with nitrogen gases to transform the high resistance phase C49 of the titanium nitride into a low resistance phase C54 in the second stage. Then, the temperature is rapidly raised to a third temperature to transform the C49 phase into the C54 phase completely and to prevent the agglomeration phenomenon.
    • 本发明涉及钛自对准硅化物(硅化物)的制造方法。 该方法包括在半导体衬底和栅电极的表面上形成金属层。 然后,以三个阶段进行快速热处理,以在钛和硅之间的界面,即在栅电极和源极/漏极区的表面上形成硅化物,例如硅化钛。 具有三个阶段的快速热处理包括使用具有第一温度的第一阶段形成具有C49相的早期硅化钛。 将温度升至第二温度,并用氮气进行RTA处理,以将氮化钛的高电阻相C49转化为第二阶段的低电阻相C54。 然后,将温度迅速升至第三温度,以使C49相完全转化为C54相,并防止凝聚现象。