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    • 6. 发明申请
    • Process For Restoring Dielectric Properties
    • 恢复介电性能的工艺
    • US20100041234A1
    • 2010-02-18
    • US12540395
    • 2009-08-13
    • Scott Jeffrey WeigelMark Leonard O'NeillMary Kathryn HaasLaura M. MatzGlenn Michael MitchellAiping WuRaymond Nicholas VrtisJohn Giles Langan
    • Scott Jeffrey WeigelMark Leonard O'NeillMary Kathryn HaasLaura M. MatzGlenn Michael MitchellAiping WuRaymond Nicholas VrtisJohn Giles Langan
    • H01L21/311
    • H01L21/3105
    • A method for preparing an interlayer dielectric to minimize damage to the interlayer's dielectric properties, the method comprising the steps of: depositing a layer of a silicon-containing dielectric material onto a substrate, wherein the layer has a first dielectric constant and wherein the layer has at least one surface; providing an etched pattern in the layer by a method that includes at least one etch process and exposure to a wet chemical composition to provide an etched layer, wherein the etched layer has a second dielectric constant, and wherein the wet chemical composition contributes from 0 to 40% of the second dielectric constant; contacting the at least one surface of the layer with a silicon-containing fluid; optionally removing a first portion of the silicon-containing fluid such that a second portion of the silicon-containing fluid remains in contact with the at least one surface of the layer; and exposing the at least one surface of the layer to UV radiation and thermal energy, wherein the layer has a third dielectric constant that is restored to a value that is at least 90% restored relative to the second dielectric constant.
    • 一种用于制备层间电介质以最小化对中间层介电特性的损害的方法,所述方法包括以下步骤:在衬底上沉积含硅介电材料的层,其中所述层具有第一介电常数,并且其中所述层具有 至少一个表面; 通过包括至少一个蚀刻工艺和暴露于湿化学组合物以提供蚀刻层的方法在该层中提供蚀刻图案,其中所述蚀刻层具有第二介电常数,并且其中所述湿化学成分贡献于0至 40%的第二介电常数; 使层的至少一个表面与含硅流体接触; 任选地除去含硅流体的第一部分,使得含硅流体的第二部分保持与层的至少一个表面接触; 以及将所述层的所述至少一个表面暴露于UV辐射和热能,其中所述层具有恢复到相对于所述第二介电常数恢复至少90%的值的第三介电常数。
    • 7. 发明授权
    • Sub-atmospheric gas delivery method and apparatus
    • 次气体输送方法及装置
    • US07013916B1
    • 2006-03-21
    • US09641933
    • 2000-08-18
    • Ronald Martin PearlsteinJohn Giles LanganDao-Hong ZhengJohn IrvenBenjamin Lee Hertzler
    • Ronald Martin PearlsteinJohn Giles LanganDao-Hong ZhengJohn IrvenBenjamin Lee Hertzler
    • F16K11/20F16K31/12G05D7/00
    • F16K1/305F16K37/0091F17C13/04F17C2205/0338F17C2205/035F17C2205/0391F17C2227/044F17C2227/048F17C2270/0518G05D16/10Y10T137/0379Y10T137/0396Y10T137/4245Y10T137/5762Y10T137/7069Y10T137/7794Y10T137/7796Y10T137/86083Y10T137/87917
    • An apparatus for containing and delivering hazardous gases at sub-atmospheric pressure from a pressurized container is provided which includes a valve body in sealed communication with an outlet orifice of the pressurized container. The outlet orifice of the pressurized container is open to an interior chamber of the pressurized container. A fluid discharge path is located in the valve body, between the outlet orifice of the pressurized container and an outlet orifice of the valve body. A pressure regulator having a pressure sensing means capable of responding to sub-atomospheric pressure, is integral to the valve body, in-line in the fluid discharge path with the pressure regulator pre-set to a pressure below atmospheric pressure to allow the gas to be delivered through the regulator from the interior chamber only when the pressure regulator senses a downstream pressure at or below the pre-set pressure. Finally, a high pressure shut-off valve integral to the valve body and in-line in the fluid discharge path and upstream from the pressure regulator is included. The gas flows through from the interior chamber of the pressurized container through the fluid discharge path, through the outlet orifice of the pressurized container, and through the outlet orifice of the valve body only when the outlet orifice is connected to a vacuum system. A method of containing and delivering hazardous gases at sub-atmospheric pressure is also provided.
    • 提供了一种用于从加压容器中容纳和传送低于大气压的有害气体的装置,其包括与加压容器的出口孔密封连通的阀体。 加压容器的出口孔通向加压容器的内部室。 流体排放路径位于阀体中,位于加压容器的出口孔与阀体的出口孔之间。 压力调节器具有能够响应亚大气压力的压力感测装置,与压力调节器预先设定为低于大气压的压力一起在流体排放路径中与阀体成一体,以允许气体 只有当压力调节器感测到等于或低于预设压力的下游压力时,才能通过调节器从内部室输送。 最后,包括与阀体成一体并且在流体排放路径中并且在压力调节器上游的一体的高压截止阀。 如果出口孔连接到真空系统,则气体从加压容器的内部腔室通过流体排出通道,通过加压容器的出口孔流过阀体的出口孔。 还提供了一种在低于大气压的压力下容纳和输送有害气体的方法。
    • 8. 发明授权
    • Process for restoring dielectric properties
    • 恢复介电性能的方法
    • US08283260B2
    • 2012-10-09
    • US12540395
    • 2009-08-13
    • Scott Jeffrey WeigelMark Leonard O'NeillMary Kathryn HaasLaura M. MatzGlenn Michael MitchellAiping WuRaymond Nicholas VrtisJohn Giles Langan
    • Scott Jeffrey WeigelMark Leonard O'NeillMary Kathryn HaasLaura M. MatzGlenn Michael MitchellAiping WuRaymond Nicholas VrtisJohn Giles Langan
    • H01L21/302
    • H01L21/3105
    • A method for preparing an interlayer dielectric to minimize damage to the interlayer's dielectric properties, the method comprising the steps of: depositing a layer of a silicon-containing dielectric material onto a substrate, wherein the layer has a first dielectric constant and wherein the layer has at least one surface; providing an etched pattern in the layer by a method that includes at least one etch process and exposure to a wet chemical composition to provide an etched layer, wherein the etched layer has a second dielectric constant, and wherein the wet chemical composition contributes from 0 to 40% of the second dielectric constant; contacting the at least one surface of the layer with a silicon-containing fluid; optionally removing a first portion of the silicon-containing fluid such that a second portion of the silicon-containing fluid remains in contact with the at least one surface of the layer; and exposing the at least one surface of the layer to UV radiation and thermal energy, wherein the layer has a third dielectric constant that is restored to a value that is at least 90% restored relative to the second dielectric constant.
    • 一种用于制备层间电介质以最小化对中间层介电特性的损害的方法,所述方法包括以下步骤:在衬底上沉积含硅介电材料的层,其中所述层具有第一介电常数,并且其中所述层具有 至少一个表面; 通过包括至少一个蚀刻工艺和暴露于湿化学组合物以提供蚀刻层的方法在该层中提供蚀刻图案,其中所述蚀刻层具有第二介电常数,并且其中所述湿化学成分贡献于0至 40%的第二介电常数; 使层的至少一个表面与含硅流体接触; 任选地除去含硅流体的第一部分,使得含硅流体的第二部分保持与层的至少一个表面接触; 以及将所述层的所述至少一个表面暴露于UV辐射和热能,其中所述层具有恢复到相对于所述第二介电常数恢复至少90%的值的第三介电常数。