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1. 发明申请

US20120002420A1 LED module, LED package, and wiring substrate and method of making same 审中-公开
标题翻译： LED模块，LED封装和布线基板及其制造方法
公开(公告)号：US20120002420A1
公开(公告)日：2012-01-05
申请号：US13067725
申请日：2011-06-22
申请人： Noboru Imai , Masahiro Noguchi , Fumiya Isaka , Akiji Shibata , Yuzuru Ashidate , Aki Suzuki
发明人： Noboru Imai , Masahiro Noguchi , Fumiya Isaka , Akiji Shibata , Yuzuru Ashidate , Aki Suzuki
IPC分类号： F21S4/00 , F21V21/00 , H01K3/10 , H05K1/09
CPC分类号： H01L33/486 , H01L33/46 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2224/48227 , H01L2224/48235 , H01L2933/0033 , Y10T29/49165 , H01L2224/48091 , H01L2924/00014
摘要： An LED module includes an electrical insulation material including a first surface having a total reflectivity of not less than 80% with respect to light with a wavelength of 450 nm, a via hole penetrating through the electrical insulation material, a wiring pattern on a second surface of the electrical insulation material, a metal filler formed in the via hole and electrically connected to the wiring pattern, and an LED chip bonded to a surface of the metal filler on the first surface of the electrical insulation material, and sealed with a resin.
摘要翻译： LED模块包括电绝缘材料，其包括相对于波长为450nm的光具有不小于80％的总反射率的第一表面，穿过电绝缘材料的通孔，在第二表面上的布线图案所述电绝缘材料形成在所述通孔中并电连接到所述布线图案的金属填料，以及在所述电绝缘材料的第一表面上接合到所述金属填料的表面的LED芯片，并用树脂密封。

2. 发明申请

US20110120752A1 METHOD FOR FABRICATING A SOLAR BATTERY MODULE AND A WIRING SUBSTRATE FOR A SOLAR BATTERY 审中-公开
标题翻译：用于制造太阳能电池模块的方法和用于太阳能电池的配线基板
公开(公告)号：US20110120752A1
公开(公告)日：2011-05-26
申请号：US12949207
申请日：2010-11-18
申请人： Noboru IMAI , Ken Takahashi , Katsutoshi Taga , Aki Suzuki
发明人： Noboru IMAI , Ken Takahashi , Katsutoshi Taga , Aki Suzuki
IPC分类号： H05K1/00 , H01L31/18
CPC分类号： H01L31/0516 , H01L31/048 , Y02E10/50
摘要： A method for fabricating a solar battery module includes cell preparing step for preparing a solar battery cell having an electrode wiring, wiring substrate preparing step for preparing a base material and a wiring substrate having a wiring pattern provided above the base material, mounting step for electrically connecting the wiring pattern with the electrode wiring and mounting the solar battery cell on the wiring substrate, and exposing step for removing the base material to expose the wiring pattern.
摘要翻译：一种太阳能电池模块的制造方法，其特征在于，包括：准备具有电极布线的太阳能电池单元，配置基材的布线基板准备工序和配置在基材上方的布线基板的布线基板的电池准备工序，将所述布线图案与所述电极布线连接并将所述太阳能电池单元安装在所述布线基板上，以及用于移除所述基材以暴露所述布线图案的曝光步骤。

3. 发明授权

US07675755B2 LED module 失效
标题翻译： LED模块
公开(公告)号：US07675755B2
公开(公告)日：2010-03-09
申请号：US11930485
申请日：2007-10-31
申请人： Noboru Imai , Shuichi Nakazawa , Aki Suzuki
发明人： Noboru Imai , Shuichi Nakazawa , Aki Suzuki
IPC分类号： H05K7/00
CPC分类号： H01L33/64 , H01L25/0753 , H01L33/647 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H05K1/0206 , H05K3/423 , H05K2201/09563 , H05K2201/10106 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An LED module comprises: an LED element having an electrode for flip chip mounting; a wiring board having at least two metal layers and an electrically insulating layer including a polymer resin and being interposed between each two of the metal layers; and a metal film layer of the LED element for conducting heat from the LED element. A first metal layer of the at least two metal layers has a power supply metal pattern and a heat transfer metal pattern that are formed electrically insulated from each other. The power supply metal pattern and the electrode are connected to each other; the heat transfer metal pattern and the metal film layer are connected through an electrically insulating portion interposed therebetween; and the heat transfer metal pattern and the metal layers other than the first metal layer are coupled to each other through a heat transfer portion.
摘要翻译： LED模块包括：具有用于倒装芯片安装的电极的LED元件; 具有至少两个金属层的布线板和包含聚合物树脂的电绝缘层，并插入在每个两个金属层之间; 以及用于从LED元件传导热量的LED元件的金属膜层。所述至少两个金属层的第一金属层具有形成为彼此电绝缘的电源金属图案和传热金属图案。电源金属图案和电极彼此连接; 传热金属图案和金属膜层通过插入其间的电绝缘部分连接; 并且传热金属图案和除第一金属层之外的金属层通过传热部彼此连接。

4. 发明申请

US20080101071A1 LED MODULE 失效
标题翻译： LED模块
公开(公告)号：US20080101071A1
公开(公告)日：2008-05-01
申请号：US11930485
申请日：2007-10-31
申请人： Noboru Imai , Shuichi Nakazawa , Aki Suzuki
发明人： Noboru Imai , Shuichi Nakazawa , Aki Suzuki
IPC分类号： F21V29/00
CPC分类号： H01L33/64 , H01L25/0753 , H01L33/647 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H05K1/0206 , H05K3/423 , H05K2201/09563 , H05K2201/10106 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An LED module comprises: an LED element having an electrode for flip chip mounting; a wiring board having at least two metal layers and an electrically insulating layer including a polymer resin and being interposed between each two of the metal layers; and a metal film layer of the LED element for conducting heat from the LED element. A first metal layer of the at least two metal layers has a power supply metal pattern and a heat transfer metal pattern that are formed electrically insulated from each other. The power supply metal pattern and the electrode are connected to each other; the heat transfer metal pattern and the metal film layer are connected through an electrically insulating portion interposed therebetween; and the heat transfer metal pattern and the metal layers other than the first metal layer are coupled to each other through a heat transfer portion.
摘要翻译： LED模块包括：具有用于倒装芯片安装的电极的LED元件; 具有至少两个金属层的布线板和包含聚合物树脂的电绝缘层，并插入在每个两个金属层之间; 以及用于从LED元件传导热量的LED元件的金属膜层。所述至少两个金属层的第一金属层具有形成为彼此电绝缘的电源金属图案和传热金属图案。电源金属图案和电极彼此连接; 传热金属图案和金属膜层通过插入其间的电绝缘部分连接; 并且传热金属图案和除第一金属层之外的金属层通过传热部彼此连接。

5. 发明授权

US06623907B2 Radiation-sensitive resin composition 有权
标题翻译：辐射敏感树脂组合物
公开(公告)号：US06623907B2
公开(公告)日：2003-09-23
申请号：US09774714
申请日：2001-02-01
申请人： Jun Numata , Aki Suzuki , Hiromichi Hara , Norihiro Natsume , Kiyoshi Murata , Masafumi Yamamoto , Akimasa Soyano , Toru Kajita , Tsutomu Shimokawa
发明人： Jun Numata , Aki Suzuki , Hiromichi Hara , Norihiro Natsume , Kiyoshi Murata , Masafumi Yamamoto , Akimasa Soyano , Toru Kajita , Tsutomu Shimokawa
IPC分类号： G03F7004
CPC分类号： G03F7/0045 , G03F7/038 , G03F7/039 , Y10S430/111 , Y10S430/128
摘要： A positive-tone radiation-sensitive resin composition comprising: (A) a low molecular weight compound having at least one amino group in which the nitrogen atom has at least one hydrogen atom bonded thereto and at least one of the hydrogen atoms is replaced by a t-butoxycarbonyl group, (B) a photoacid generator, and (C-1) a resin insoluble or scarcely soluble in alkali which is protected by an acid-dissociable group and becomes soluble in alkali when the acid-dissociable group dissociates or (C-2) an alkali-soluble resin and an alkali solubility control agent is disclosed. Also disclosed is a negative-tone radiation-sensitive resin composition comprising the low molecular weight compound (A), the photoacid generator (B), an alkali-soluble resin (D), and a compound capable of crosslinking with the alkali-soluble resin in the presence of an acid(E). The composition are useful as a chemically amplified resist which effectively responds to various radiations, exhibits superior sensitivity and resolution, forms fine patterns at a high precision and in a stable manner even if the patterns are isolated line patterns.
摘要翻译：一种正色辐射敏感性树脂组合物，其包含：（A）具有至少一个氨基的低分子量化合物，其中所述氮原子具有与其键合的至少一个氢原子，并且至少一个氢原子被叔丁氧基羰基，（B）光酸产生剂和（C-1）不溶于或几乎不溶于碱的树脂，其被酸解离基团保护并且当酸解离基解离时变得可溶于碱，或（C -2）碱溶性树脂和碱溶性控制剂。还公开了包含低分子量化合物（A），光酸产生剂（B），碱溶性树脂（D）和能够与碱溶性树脂交联的化合物的负色辐射敏感性树脂组合物在酸（E）的存在下。该组合物可用作化学放大抗蚀剂，其有效地响应各种辐射，表现出优异的灵敏度和分辨率，即使图案是隔离线图案，也以高精度和稳定的方式形成精细图案。

6. 发明授权

US07731764B2 Singulation metal mold and method for producing semiconductor device 失效
标题翻译：单金属模具及半导体装置的制造方法
公开(公告)号：US07731764B2
公开(公告)日：2010-06-08
申请号：US11954528
申请日：2007-12-12
申请人： Takumi Sato , Aki Suzuki
发明人： Takumi Sato , Aki Suzuki
IPC分类号： H01L21/67
CPC分类号： H01L21/4842 , H01L24/97 , H01L2224/50 , Y10T29/41
摘要： A singulation metal mold for singulating a plurality of semiconductor devices arrayed on a TAB tape has a punch as an upper metal mold of the singulation metal mold, a die block as a lower metal mold of the singulation metal mold, a knockout disposed to be slidable vertically inside a vertical hole formed in the die block, the knockout being operable to press up above the die block each of the singulated semiconductor devices left on the die block after the singulating, a press-up plate positioned under the knockout to support the knockout and linked mechanically to the knockout, and being operable to forcibly move the knockout vertically when the press-up plate moves vertically; and a press-up plate descent forcing mechanism that is operable to forcibly pull down the press-up plate.
摘要翻译：用于分离排列在TAB带上的多个半导体器件的单片金属模具具有作为分割金属模具的上金属模具的冲头，作为分割金属模具的下金属模具的模具块，设置成可滑动的敲除垂直于形成在模具块中的竖直孔内，该敲除器可操作以在切割单元之后向上挤压留在模块上的每个单片化半导体器件的模具块，位于敲除下方的加压板以支撑敲除并且机械地连接到脱模器，并且当按压板垂直移动时可操作地垂直地移动敲击; 以及可操作以强制拉下压板的压板下降力机构。

7. 发明授权

US06899989B2 Radiation-sensitive resin composition 有权
标题翻译：辐射敏感树脂组合物
公开(公告)号：US06899989B2
公开(公告)日：2005-05-31
申请号：US09987916
申请日：2001-11-16
申请人： Aki Suzuki , Makoto Murata , Hiromichi Hara , Eiichi Kobayashi
发明人： Aki Suzuki , Makoto Murata , Hiromichi Hara , Eiichi Kobayashi
IPC分类号： C08K5/375 , C08K5/42 , C08L25/18 , C09K3/00 , G03F7/004 , G03F7/039 , H01L21/027
CPC分类号： G03F7/0392 , G03F7/0045 , Y10S430/106 , Y10S430/114 , Y10S430/115 , Y10S430/118 , Y10S430/122
摘要： A radiation-sensitive resin composition comprising (A) a photoacid generator such as 2,4,6-trimethylphenyldiphenylsulfonium 2,4-difluorobenzenesulfonate or 2,4,6-trimethylphenyldiphenylsulfonium 4-trifluoromethylbenzenesulfonate and (B) a resin having an acetal structure typified by a poly(p-hydroxystyrene) resin in which a part of hydrogen atoms of phenolic hydroxyl groups have been replaced by 1-ethoxyethyl groups, 1-ethoxyethyl groups and t-butoxycarbonyl groups, or 1-ethoxyethyl groups and t-butyl groups. The resin composition is sensitive to deep ultraviolet rays and charged particles such as electron beams, exhibits excellent resolution performance and pattern shape-forming capability, and suppresses a nano-edge roughness phenomenon to a minimal extent.
摘要翻译：一种辐射敏感性树脂组合物，其包含（A）光酸产生剂如2,4,6-三甲基苯基二苯基锍2,4-二氟苯磺酸盐或2,4,6-三甲基苯基二苯基锍4-三氟甲基苯磺酸盐和（B）具有缩醛结构的树脂，以一部分酚羟基的氢原子被1-乙氧基乙基，1-乙氧基乙基，叔丁氧基羰基或1-乙氧基乙基和叔丁基代替的聚（对 - 羟基苯乙烯）树脂。树脂组合物对深紫外线和电子束等带电粒子敏感，显示出优异的分辨率性能和图案形状形成能力，并且在最小程度上抑制纳米边缘粗糙度现象。

8. 发明授权

US07060414B2 Radiation-sensitive resin composition 有权
公开(公告)号：US07060414B2
公开(公告)日：2006-06-13
申请号：US11080400
申请日：2005-03-16
申请人： Aki Suzuki , Makoto Murata , Hiromichi Hara , Eiichi Kobayashi
发明人： Aki Suzuki , Makoto Murata , Hiromichi Hara , Eiichi Kobayashi
IPC分类号： G03F7/04
CPC分类号： G03F7/0392 , G03F7/0045 , Y10S430/106 , Y10S430/114 , Y10S430/115 , Y10S430/118 , Y10S430/122
摘要： A radiation-sensitive resin composition comprising (A) a photoacid generator such as 2,4,6-trimethylphenyldiphenylsulfonium 2,4-difluorobenzenesulfonate or 2,4,6-trimethylphenyldiphenylsulfonium 4-trifluoromethylbenzenesulfonate and (B) a resin having an acetal structure typified by a poly(p-hydroxystyrene) resin in which a part of hydrogen atoms of phenolic hydroxyl groups have been replaced by 1-ethoxyethyl groups, 1-ethoxyethyl groups and t-butoxycarbonyl groups, or 1-ethoxyethyl groups and t-butyl groups. The resin composition is sensitive to deep ultraviolet rays and charged particles such as electron beams, exhibits excellent resolution performance and pattern shape-forming capability, and suppresses a nano-edge roughness phenomenon to a minimal extent.

9. 发明申请

US20050158657A1 Radiation-sensitive resin composition 有权
公开(公告)号：US20050158657A1
公开(公告)日：2005-07-21
申请号：US11080400
申请日：2005-03-16
申请人： Aki Suzuki , Makoto Murata , Hiromichi Hara , Eiichi Kobayashi
发明人： Aki Suzuki , Makoto Murata , Hiromichi Hara , Eiichi Kobayashi
IPC分类号： C08K5/375 , C08K5/42 , C08L25/18 , C09K3/00 , G03F7/004 , G03F7/039 , H01L21/027 , G03C1/76
CPC分类号： G03F7/0392 , G03F7/0045 , Y10S430/106 , Y10S430/114 , Y10S430/115 , Y10S430/118 , Y10S430/122
摘要： A radiation-sensitive resin composition comprising (A) a photoacid generator such as 2,4,6-trimethylphenyldiphenylsulfonium 2,4-difluorobenzenesulfonate or 2,4,6-trimethylphenyldiphenylsulfonium 4-trifluoromethylbenzenesulfonate and (B) a resin having an acetal structure typified by a poly(p-hydroxystyrene) resin in which a part of hydrogen atoms of phenolic hydroxyl groups have been replaced by 1-ethoxyethyl groups, 1-ethoxyethyl groups and t-butoxycarbonyl groups, or 1-ethoxyethyl groups and t-butyl groups. The resin composition is sensitive to deep ultraviolet rays and charged particles such as electron beams, exhibits excellent resolution performance and pattern shape-forming capability, and suppresses a nano-edge roughness phenomenon to a minimal extent.

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