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    • 3. 发明授权
    • Semiconductor device having multiple layer resistance layer structure
and manufacturing method therefor
    • 具有多层电阻层结构及其制造方法的半导体器件
    • US5093706A
    • 1992-03-03
    • US377998
    • 1989-07-11
    • Junichi MitsuhashiShinichi SatohHideki GenjyoYoshio Kohno
    • Junichi MitsuhashiShinichi SatohHideki GenjyoYoshio Kohno
    • H01L27/04H01L21/822H01L21/8244H01L27/11
    • H01L27/11H01L27/1112Y10S257/904
    • A high load resistance type static random access memory (SRAM) is provided, as an example of a semiconductor device having a high resistance layer. The SRAM includes a semiconductor substrate (1) of a first conductivity type with an impurity diffusion region (3) of second conductivity type selectively formed thereon. An aluminum interconnection layer (8) is formed over the impurity diffusion region (3). Provided between the aluminum interconnection layer (8) and the impurity diffusion region (3) is a double-layer high resistance structure which comprises a nitride layer (63a) formed adjacent the semiconductor substrate (1) and an oxide layer (63b) adjacent the aluminum interconnection layer (8). The impurity diffusion region (3) forms part of a MOS field effect transistor, which is coupled to the high resistance layer (63) to form a flip-flop memory cell. The double-layer high resistance structure makes it possible to adjust the resistance at a desired particular high value by controlling the thickness of the layer. The structure permits a high degree of integration of the SRAM. The high resistance layer is not affected by diffusion or penetration of the impurity thereto.
    • 作为具有高电阻层的半导体器件的实例,提供了高负载电阻型静态随机存取存储器(SRAM)。 SRAM包括具有选择性地形成第二导电类型的杂质扩散区(3)的第一导电类型的半导体衬底(1)。 在杂质扩散区(3)的上方形成铝互连层(8)。 提供在铝互连层(8)和杂质扩散区(3)之间的是双层高电阻结构,其包括邻近半导体衬底(1)形成的氮化物层(63a)和邻近半导体衬底 铝互连层(8)。 杂质扩散区域(3)形成MOS场效应晶体管的一部分,其耦合到高电阻层(63)以形成触发器存储单元。 双层高电阻结构使得可以通过控制层的厚度来将电阻调节到期望的特定高值。 该结构允许SRAM的高度集成。 高电阻层不受其杂质扩散或渗透的影响。
    • 8. 发明授权
    • Method of making a semiconductor memory device
    • 制造半导体存储器件的方法
    • US5183774A
    • 1993-02-02
    • US807659
    • 1991-12-16
    • Shinichi Satoh
    • Shinichi Satoh
    • H01L21/334H01L27/108
    • H01L29/66181H01L27/10841
    • A semiconductor memory device comprises a semiconductor substrate (10), a trench (12) formed on a main surface (11) of the semiconductor substrate, a gate region (15) formed on a main surface portion in the trench, a passive element region (16) formed on a bottom side portion of the trench and a source/drain region (20) formed on the main surface of the semiconductor substrate. The method for manufacturing the semiconductor memory device comprises the steps of forming a wide first trench (31) on a portion of the main surface of the semiconductor substrate, forming a narrow second trench (32) on the bottom portion of the first trench, forming a passive element region in the second trench, forming a gate region in the first trench, and forming a source/drain region on the main surface portion of the semiconductor substrate.
    • 半导体存储器件包括半导体衬底(10),形成在半导体衬底的主表面(11)上的沟槽(12),形成在沟槽中的主表面部分上的栅极区域(15),无源元件区域 (16),形成在所述沟槽的底侧部分上,以及形成在所述半导体衬底的主表面上的源/漏区(20)。 半导体存储器件的制造方法包括以下步骤:在半导体衬底的主表面的一部分上形成宽的第一沟槽(31),在第一沟槽的底部形成窄的第二沟槽(32),形成 在所述第二沟槽中的无源元件区域,在所述第一沟槽中形成栅极区域,以及在所述半导体衬底的所述主表面部分上形成源极/漏极区域。
    • 10. 发明授权
    • Complementary semiconductor device having improved device isolating
region
    • 具有改进的器件隔离区域的补充半导体器件
    • US5097310A
    • 1992-03-17
    • US409379
    • 1989-09-19
    • Takahisa EimoriWataru WakamiyaHiroji OzakiYoshinori TanakaShinichi Satoh
    • Takahisa EimoriWataru WakamiyaHiroji OzakiYoshinori TanakaShinichi Satoh
    • H01L21/761H01L21/76H01L27/08H01L27/092H01L29/78
    • H01L27/0928
    • A complementary semiconductor device having an improved capability of isolating devices comprises a P well 3 and an N well 2 both formed adjacent to each other on a main surface of a substrate 1, an N type impurity layer formed in the P well 8 on the main surface of the substrate, a P type impurity layer formed in the N well 9 on the main surface of the substrate, an N type region formed at the junction of the N well and the P well 71 on the main surface of the substrate, a first shield electrode 52 formed between the N type impurity layer 8 and the N type region 71 on the main surface of the substrate through an insulating film and a second shield electrode 51 formed between the N type region 71 and the P type impurity layer 9 on the main surface of the substrate through an insulating film. The first shield electrode 52 is connected to a potential V.sub.SS and the second shield electrode 51 and the N type region 71 are connected to a potential V.sub.CC, so that an N channel MOS transistor 101 comprising the first shield electrode 52 does not turn on and a device comprising the second shield electrode does not form a field effect transistor.
    • 具有改进的隔离装置能力的互补半导体器件包括在衬底1的主表面上彼此相邻形成的P阱3和N阱2,形成在主衬底1上的P阱8中的N型杂质层 在基板的主表面上形成在N阱9中的P型杂质层,形成在基板主表面上的N阱和P阱71的接合部的N型区域, 第一屏蔽电极52,其通过绝缘膜形成在基板的主表面上的N型杂质层8和N型区域71之间,形成在N型区域71和P型杂质层9之间的第二屏蔽电极51, 基板的主表面通过绝缘膜。 第一屏蔽电极52连接到电位VSS,第二屏蔽电极51和N型区域71连接到电位VCC,使得包括第一屏蔽电极52的N沟道MOS晶体管101不导通, 包括第二屏蔽电极的装置不形成场效应晶体管。