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1. 发明授权

US06347040B1 Sensor device for sensing biometric characteristics, in particular finger minutiae 有权
标题翻译：用于感测生物特征的传感器装置，特别是手指细节
公开(公告)号：US06347040B1
公开(公告)日：2002-02-12
申请号：US09716902
申请日：2000-11-20
申请人： Manfred Fries , Reinhard Fischbach , Detlef Houdeau
发明人： Manfred Fries , Reinhard Fischbach , Detlef Houdeau
IPC分类号： H05K702
CPC分类号： G06K9/0002 , A61B5/1172
摘要： The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.
摘要翻译：传感器装置用于用生物特征传感器芯片感测生物特征，特别是手指细节。传感器芯片紧固在柔性印刷电路板上，该印刷电路板具有高度柔性的基底层和施加到基底层的导体迹线。导体轨道与传感器芯片电接触并被引导到柔性印刷电路板的端子区域。传感器芯片的感测区域可通过柔性电路板中的开口进入，开口至少部分地被接地框包围。

2. 发明授权

US07012531B2 Product label, method of producing product labels and method for identifying products in a contactless and forgery-proof manner 失效
公开(公告)号：US07012531B2
公开(公告)日：2006-03-14
申请号：US10164552
申请日：2002-06-07
申请人： Manfred Fries , Detlef Houdeau
发明人： Manfred Fries , Detlef Houdeau
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , G06K19/073 , G06K19/0739
摘要： A product label includes a semiconductor chip and an antenna. The semiconductor chip stores information about a product. The antenna transmits the information about the product to a reading device. The antenna has a predetermined breaking point at which the antenna can be destroyed during the reading operation by energy introduced by the reading device so that the product label can be read only for a specific number of read cycles. A method of producing product labels and a method for a contactless, forgery-proof identification of products are also provided.

3. 发明授权

US06848617B1 Smart card module for biometric sensors 有权
标题翻译：用于生物识别传感器的智能卡模块
公开(公告)号：US06848617B1
公开(公告)日：2005-02-01
申请号：US09627181
申请日：2000-07-27
申请人： Manfred Fries , Jürgen Fischer , Detlef Houdeau
发明人： Manfred Fries , Jürgen Fischer , Detlef Houdeau
IPC分类号： A61B5/117 , G06K9/00 , G06K19/077 , G06T1/00 , G07C9/00 , G06K19/06
CPC分类号： G06K19/0718 , G06K9/0002 , G06K19/077 , G07C9/00087 , G07C9/00158
摘要： In a smart card module for biometric sensors for installation in smart cards, a support has at least one through opening or window in the region of a sensor chip. The sensor chip is mounted on the support such that an active surface of the sensor chip is directed toward the support and is situated in the region of the window, so that it can be accessed through the window in the support.
摘要翻译：在用于安装在智能卡中的生物测定传感器的智能卡模块中，支撑件在传感器芯片的区域中具有至少一个通孔或窗口。传感器芯片安装在支撑件上，使得传感器芯片的有效表面指向支撑件并且位于窗口的区域中，使得其可以通过支撑件中的窗口进入。

4. 发明授权

US06375083B2 Smart card 有权
标题翻译：智能卡
公开(公告)号：US06375083B2
公开(公告)日：2002-04-23
申请号：US09354131
申请日：1999-07-15
申请人： Manfred Fries , Frank Püschner , Josef Mundigl , Jürgen Fischer , Detlef Houdeau
发明人： Manfred Fries , Frank Püschner , Josef Mundigl , Jürgen Fischer , Detlef Houdeau
IPC分类号： G06K1906
CPC分类号： G06K19/07747 , G06K19/07749 , G06K19/07779 , G06K19/07783 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01078 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.
摘要翻译：一种具有卡载体的智能卡，其上提供有数据处理电路和数据处理电路与外部数据处理站之间的数据无接触通信的连接组件。在生产现有技术的智能卡的过程中，将集成电路应用于由塑料制成的卡片载体。之后，沿着现有技术的智能卡的外边缘施加连接到集成电路的相应端子的发送/接收线圈。在现有技术的智能卡的情况下，缺陷的现有技术的智能卡必须被销毁的事实是不利的。根据本发明，数据处理电路和连接组件设置在至少一个模块载体的区域中，并且卡载体具有用于容纳模块载体的区域。这使得首先可以在完成的模块载体合并到卡载体之前对其正常工作进行测试。

5. 发明申请

US20090218667A1 SMART CARDS AND METHODS FOR PRODUCING A SMART CARD 审中-公开
标题翻译：用于生产智能卡的智能卡和方法
公开(公告)号：US20090218667A1
公开(公告)日：2009-09-03
申请号：US12392112
申请日：2009-02-25
申请人： Frank Pueschner , Detlef Houdeau , Andreas Mehlhaff , Peter Stampka
发明人： Frank Pueschner , Detlef Houdeau , Andreas Mehlhaff , Peter Stampka
IPC分类号： H01L23/00 , B32B27/28 , B32B37/00 , B32B38/00 , H01L21/50
CPC分类号： B32B27/36 , B32B3/02 , B32B3/08 , B32B7/12 , B32B27/08 , B32B27/304 , B32B27/365 , B32B37/04 , B32B2250/24 , B32B2250/42 , B32B2305/342 , B32B2305/347 , B32B2307/30 , B32B2307/412 , B32B2307/50 , B32B2307/714 , B32B2309/02 , B32B2309/105 , B32B2327/06 , B32B2367/00 , B32B2369/00 , B32B2425/00 , G06K19/07722 , G06K19/07749 , H01L2924/0002 , Y10T156/10 , Y10T428/269 , Y10T428/31507 , H01L2924/00
摘要： The invention relates to smart cards. In one embodiment a smart card has a card body having at least a first, a second and a third layer. The first and the second layer are at least partly composed of polycarbonate. The third layer is arranged between the first and the second layer and is composed of a material having a melting point of Ts
摘要翻译：本发明涉及智能卡。在一个实施例中，智能卡具有至少具有第一，第二和第三层的卡体。第一层和第二层至少部分地由聚碳酸酯构成。第三层布置在第一层和第二层之间，由熔点为Ts <150℃的材料构成。

6. 发明授权

US5896111A Antenna coil 失效
标题翻译：天线线圈
公开(公告)号：US5896111A
公开(公告)日：1999-04-20
申请号：US811502
申请日：1997-03-05
申请人： Detlef Houdeau , Lothar Kiesewetter , Josef Mundigl
发明人： Detlef Houdeau , Lothar Kiesewetter , Josef Mundigl
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077 , H01F27/30 , H01Q1/22 , H01Q1/38 , H01Q1/40 , H01Q7/00 , H04B5/00 , H01Q21/00
CPC分类号： H01Q1/2208 , G06K19/07749 , H01Q1/22 , H01Q1/38 , H01Q7/00
摘要： An antenna coil, in particular for a contactless smart card, includes coil turns formed of thin conductor tracks having first and second ends. The first end of a respective one of the conductor tracks is electrically conductively connected to the second end of an adjacent one of the conductor tracks. The conductor tracks include first and last conductor tracks, and the first end of the first conductor track and the second end of the last conductor track form coil connections. The conductor tracks are disposed in parallel on a flexible, non-conductive carrier strip. The carrier strip has bends and forms a polygon containing the connected ends of the conductor tracks. The bends are guided through approximately 180.degree., and the coil turns lie approximately in the same plane.
摘要翻译：特别是用于非接触式智能卡的天线线圈包括由具有第一端和第二端的薄导体轨道形成的线圈匝。导体轨道中的相应一个的第一端导电地连接到相邻导体轨迹的第二端。导体轨道包括第一和最后导体轨道，并且第一导体轨道的第一端和最后一个导体轨道的第二端形成线圈连接。导体轨道平行设置在柔性非导电载体条上。承载带具有弯曲并形成包含导体轨道的连接端的多边形。弯曲引导约180°，线圈大致在同一平面上。

7. 发明授权

US5809633A Method for producing a smart card module for contactless smart cards 失效
标题翻译：用于制造用于非接触式智能卡的智能卡模块的方法
公开(公告)号：US5809633A
公开(公告)日：1998-09-22
申请号：US812111
申请日：1997-03-05
申请人： Josef Mundigl , Detlef Houdeau
发明人： Josef Mundigl , Detlef Houdeau
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077 , H01L21/60 , H05K3/32 , H02P11/00
CPC分类号： G06K19/07747 , G06K19/07749 , G06K19/0775 , G06K19/07779 , G06K19/07781 , G06K19/07783 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/45147 , H01L2224/4813 , H01L2224/48472 , H01L2224/48699 , H01L2224/49 , H01L24/45 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , Y10T29/49016 , Y10T29/49121
摘要： A method for producing a smart card module includes bonding one end of a thin wire onto a first contact zone of a semiconductor chip. The wire is guided in a plurality of turns forming an antenna coil. The wire is bonded onto a second contact area of the semiconductor chip. The wire turns of the antenna coil and the semiconductor chip are placed on a carrier body.
摘要翻译：一种用于制造智能卡模块的方法包括将细线的一端接合到半导体芯片的第一接触区上。导线以形成天线线圈的多个匝引导。导线被接合到半导体芯片的第二接触区域上。天线线圈的线圈和半导体芯片放置在载体上。

8. 发明授权

US5623102A Three wafer semiconductor pressure-difference sensor and method for manufacture separating middle wafer into conducting diaphragm and web 失效
标题翻译：三晶硅半导体压差传感器及其制造方法，将中间晶圆分离成导电隔膜和网
公开(公告)号：US5623102A
公开(公告)日：1997-04-22
申请号：US295692
申请日：1994-12-13
申请人： Frank Arndt , Detlef Houdeau , Moritz von Rauch , Helmut Schlaak
发明人： Frank Arndt , Detlef Houdeau , Moritz von Rauch , Helmut Schlaak
IPC分类号： G01L9/00 , G01L13/02
CPC分类号： G01L9/0073 , G01L13/025 , G01L9/0042 , Y10T29/43
摘要： A pressure difference sensor having a semiconductor measuring diaphragm clamped between two bearing parts of insulating material thereby forming two inner chambers is described. Each of the bearing parts holds a flat electrode on its inside. An internal, pressurized, equalization chamber is provided in the clamping region of the pressure difference sensor and extends into both bearing parts around the inner chambers. The equalization chamber compensates for static pressure influences on the accuracy of the measurement of the sensor. A method for producing the sensor is also described.
摘要翻译： PCT No.PCT / DE93 / 00166 Sec。 371日期1994年12月13日第 102（e）日期1994年12月13日PCT提交1992年10月22日PCT公布。公开号WO93 / 17313 日期1993年9月7日描述了一种压差传感器，其具有夹在绝缘材料的两个轴承部分之间的半导体测量膜，从而形成两个内室。每个轴承部件在其内部保持平坦的电极。在压力差传感器的夹持区域内设有一个内部加压平衡腔，并延伸到内腔周围的两个轴承部分。均衡室补偿静压对传感器测量精度的影响。还描述了用于制造传感器的方法。

9. 发明授权

US06535262B2 Display unit for chip cards with folded sheet a method for manufacturing such a display unit 有权
标题翻译：具有折叠片的芯片卡的显示单元用于制造这种显示单元的方法
公开(公告)号：US06535262B2
公开(公告)日：2003-03-18
申请号：US10078145
申请日：2002-02-19
申请人： Detlef Houdeau
发明人： Detlef Houdeau
IPC分类号： G02F11333
CPC分类号： G02F1/13452
摘要： A display unit includes activation or driver electronics disposed on the rear side of a display element. A display unit has a front region with a display element; a rear region, facing away from the front region, with at least one control element for the activation of the at least one display element; and electrical lines for the connection of the at least one display element to the at least one control element. Preferably, an LCD display with a top layer, a liquid crystal layer, and a bottom sheet is used. The control element is disposed on the bottom sheet. The control element is, for example, an unpackaged IC, that is attached to the bottom sheet folded back on itself and is laterally offset in such a way that it cannot overheat the actual LCD display. The electrical lines are preferably conductor tracks on the bottom sheet.
摘要翻译：显示单元包括设置在显示元件的后侧上的激活或驱动电路。显示单元具有带有显示元件的前部区域; 背部区域，其背离前部区域，具有至少一个用于激活所述至少一个显示元件的控制元件; 以及用于将所述至少一个显示元件连接到所述至少一个控制元件的电线。优选地，使用具有顶层，液晶层和底片的LCD显示器。控制元件设置在底片上。控制元件例如是未封装的IC，其附接到自身折回的底部片材，并且以这样的方式横向偏移，使得其不能使实际的LCD显示器过热。电线优选在底片上的导体轨迹。

10. 发明授权

US06218727B1 Wafer frame 有权
标题翻译：晶圆框架
公开(公告)号：US06218727B1
公开(公告)日：2001-04-17
申请号：US09246745
申请日：1999-02-08
申请人： Reinhold Merkl , Detlef Houdeau , Harald Lösch , Marianne Lösch
发明人： Reinhold Merkl , Detlef Houdeau , Harald Lösch , Marianne Lösch
IPC分类号： H01L23495
CPC分类号： H01L21/6835
摘要： A wafer frame for fixing and handling 200 mm wafers is produced with a significantly reduced weight as compared to a metal wafer frame, while maintaining mechanical and thermal material properties. This is accomplished by producing the wafer frame from a plastic with a glass fiber content of from 1 to 40% by weight.
摘要翻译：与金属晶片框架相比，制造用于固定和处理200mm晶片的晶片框架，其重量显着降低，同时保持机械和热材料性质。这是通过从玻璃纤维含量为1至40重量％的塑料制造晶片框架来实现的。

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