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1. 发明申请

US20050244620A1 Wired circuit board and production method thereof 审中-公开
标题翻译：有线电路板及其制作方法
公开(公告)号：US20050244620A1
公开(公告)日：2005-11-03
申请号：US11108720
申请日：2005-04-19
申请人： Makoto Tsunekawa , Kei Nakamura , Keiko Toyozawa , Takeshi Yamato , Toshikazu Baba
发明人： Makoto Tsunekawa , Kei Nakamura , Keiko Toyozawa , Takeshi Yamato , Toshikazu Baba
IPC分类号： H05K1/09 , H05K3/10 , H05K3/24 , H05K3/28 , H05K3/38 , B32B15/00 , B05D5/12
CPC分类号： H05K3/388 , H05K3/108 , H05K3/244 , H05K3/28 , H05K2203/072 , Y10T428/12715 , Y10T428/1291 , Y10T428/24917
摘要： A wired circuit board which is formed so that even when a wired circuit pattern is formed at a fine pitch and then a tin plating layer is formed on the wired circuit pattern by the electroless tin plating, a wiring of the wired circuit pattern can be prevented from being stripped, and a production method of the same wired circuit board. After a thin metal film 2 formed of nickel-chromium alloy having a chromium content of 8-20 weight % is formed on an insulating layer 1, a wired circuit pattern 4 of copper is formed on the thin metal film 2. Then, a tin plating layer 5 is formed on exposed surfaces of the wired circuit pattern 4 by electroless tin plating.
摘要翻译：一种布线电路板，其形成为即使当以细间距形成布线电路图案，然后通过无电镀锡在布线电路图案上形成锡镀层时，可以防止布线电路图案的布线被剥离，以及相同布线电路板的制造方法。在绝缘层1上形成由铬含量为8〜20重量％的镍 - 铬合金形成的金属薄膜2之后，在金属薄膜2上形成铜布线电路图案4。然后，通过无电镀锡在布线电路图案4的露出表面上形成镀锡层5。

2. 发明授权

US07798062B2 Printing apparatus and printing method 失效
标题翻译：印刷装置和印刷方法
公开(公告)号：US07798062B2
公开(公告)日：2010-09-21
申请号：US11730033
申请日：2007-03-29
申请人： Makoto Tsunekawa , Toshikazu Baba
发明人： Makoto Tsunekawa , Toshikazu Baba
IPC分类号： B41M1/12
CPC分类号： H05K3/0091 , H05K1/0393 , H05K3/1216 , H05K3/28 , H05K2203/0759 , H05K2203/082 , H05K2203/1545
摘要： A printing apparatus includes a feed-out unit for feeding out an elongated base material which is wound up in a roll, a printing unit for printing a liquid resist onto the elongated base material that is fed out of the feed-out unit, a wind-up unit for winding up the elongated base material on which the liquid resist is printed by the printing unit into a roll, and a suction unit positioned between the printing unit and the wind-up unit in a transport direction of the elongated base material for sucking up a solvent in the liquid resist.
摘要翻译：一种印刷装置，包括用于输出卷绕在卷筒中的细长基材的送出单元，用于将液体抗蚀剂印刷到从送出单元送出的细长基材上的印刷单元，用于将由印刷单元印刷有液体抗蚀剂的细长基材卷绕成卷的单元，以及在细长基材的输送方向上位于印刷单元和卷绕单元之间的抽吸单元，吸取液体抗蚀剂中的溶剂。

3. 发明申请

US20070227372A1 Printing apparatus and printing method 失效
标题翻译：印刷装置和印刷方法
公开(公告)号：US20070227372A1
公开(公告)日：2007-10-04
申请号：US11730033
申请日：2007-03-29
申请人： Makoto Tsunekawa , Toshikazu Baba
发明人： Makoto Tsunekawa , Toshikazu Baba
IPC分类号： B05C17/04
CPC分类号： H05K3/0091 , H05K1/0393 , H05K3/1216 , H05K3/28 , H05K2203/0759 , H05K2203/082 , H05K2203/1545
摘要： A printing apparatus includes a feed-out unit for feeding out an elongated base material which is wound up in a roll, a printing unit for printing a liquid resist onto the elongated base material that is fed out of the feed-out unit, a wind-up unit for winding up the elongated base material on which the liquid resist is printed by the printing unit into a roll, and a suction unit positioned between the printing unit and the wind-up unit in a transport direction of the elongated base material for sucking up a solvent in the liquid resist.
摘要翻译：一种印刷装置，包括用于输出卷绕在卷筒中的细长基材的送出单元，用于将液体抗蚀剂印刷到从送出单元送出的细长基材上的印刷单元，用于将由印刷单元印刷有液体抗蚀剂的细长基材卷绕成卷的单元，以及在细长基材的输送方向上位于印刷单元和卷绕单元之间的抽吸单元，吸取液体抗蚀剂中的溶剂。

4. 发明授权

US08378226B2 Wired circuit board 有权
公开(公告)号：US08378226B2
公开(公告)日：2013-02-19
申请号：US12285600
申请日：2008-10-09
申请人： Makoto Tsunekawa , Kei Nakamura , Takatoshi Sakakura , Yoshihiro Toyoda
发明人： Makoto Tsunekawa , Kei Nakamura , Takatoshi Sakakura , Yoshihiro Toyoda
IPC分类号： H05K1/00 , H01L23/58
CPC分类号： H05K3/285 , G01N21/95684 , H05K1/0269 , H05K2201/0108 , H05K2203/161
摘要： A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.

5. 发明申请

US20090114426A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20090114426A1
公开(公告)日：2009-05-07
申请号：US12285600
申请日：2008-10-09
申请人： Makoto Tsunekawa , Kei Nakamura , Takatoshi Sakakura , Yoshihiro Toyoda
发明人： Makoto Tsunekawa , Kei Nakamura , Takatoshi Sakakura , Yoshihiro Toyoda
IPC分类号： H05K1/00
CPC分类号： H05K3/285 , G01N21/95684 , H05K1/0269 , H05K2201/0108 , H05K2203/161
摘要： A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.
摘要翻译：布线电路板包括导电图案和覆盖导电图案的绝缘层，并且相对于600至680nm范围内的波长具有不超过30％的透射率。

6. 发明授权

US06220090B1 Air flow meter 有权
标题翻译：空气流量计
公开(公告)号：US06220090B1
公开(公告)日：2001-04-24
申请号：US09253539
申请日：1999-02-22
申请人： Yasushi Kohno , Ryo Nagasaka , Minoru Kondo , Makoto Tsunekawa , Tomoyuki Takiguchi
发明人： Yasushi Kohno , Ryo Nagasaka , Minoru Kondo , Makoto Tsunekawa , Tomoyuki Takiguchi
IPC分类号： G01F500
CPC分类号： G01F5/00 , G01F1/6842
摘要： An air flow meter disposed in an intake pipe has a bypass member having a U-shaped bypass passage, into which part of air flowing through the intake pipe is introduced. An outflow port disposed at a downstream air side of the bypass passage is surrounded at its three sides by opposing surfaces of a pair of side walls and a wall surface of a partition wall disposed at “an upstream air side of the outflow port”. Further, the outflow port is opened in an air flow direction in the bypass passage and in an air flow direction in the air flow passage. Therefore, air flowing through the bypass passage is partially discharged into the air flow passage through the outflow port gradually before joining main air flow in the air flow passage, thereby restricting decrease in air flow velocity and occurrence of turbulence in the bypass passage.
摘要翻译：设置在进气管中的空气流量计具有具有U形旁通通路的旁通部件，导入通过进气管的空气的一部分被引入。设置在旁通通道的下游侧的流出口在其三侧被一对侧壁和设置在“流出口”的上游侧空气侧的分隔壁的壁面的相对面相对地包围。此外，流出口在旁通通路中的空气流动方向和空气流动通道中的空气流动方向上打开。因此，流入旁路通路的空气在与空气流路连通的主空气流之前逐渐地通过流出口排出到空气流路内，从而限制旁路通路的空气流速的减小和紊流的发生。

7. 发明申请

US20070077758A1 Process for producing wiring circuit board 失效
标题翻译：制造布线电路板的工艺
公开(公告)号：US20070077758A1
公开(公告)日：2007-04-05
申请号：US11541553
申请日：2006-10-03
申请人： Makoto Tsunekawa
发明人： Makoto Tsunekawa
IPC分类号： H01L21/44
CPC分类号： H05K3/244 , H05K3/06 , H05K3/108 , H05K3/28 , H05K2203/1105
摘要： The present invention provides a process for producing a wiring circuit board which can be inhibited from developing whiskers and can be reduced in the unevenness of connectivity with electronic parts while retaining the connectivity. According to the present invention, a wiring pattern 12 comprising a thin metal film 31 and a conductor layer 33 is formed on a base insulating layer BIL. A tin-plated layer 34 is formed by electroless plating so as to coat the wiring pattern 12 therewith. The wiring pattern 12 and the tin-plated layer 34 are then subjected to a heat treatment. The heat treatment temperature and heat treatment period are regulated to 175 to 225° C. and 2 to 10 minutes, respectively. By the heat treatment, a mixture layer 35 comprising copper and tin is formed. Thereafter, a solder resist SOL is formed over the base insulating layer so as to cover the wiring pattern 12 and tin-plated layer 34 in given regions. Subsequently, the solder resist SOL is subjected to a heat curing treatment.
摘要翻译：本发明提供一种制造布线电路板的方法，该布线电路板可以抑制晶须的形成，并且可以在保持连接性的同时减少与电子部件的连通性不均匀性。根据本发明，在基底绝缘层BIL上形成包括金属薄膜31和导体层33的布线图案12。通过无电镀形成镀锡层34，以便用其涂覆布线图案12。然后对布线图案12和镀锡层34进行热处理。热处理温度和热处理时间分别为175〜225℃和2〜10分钟。通过热处理，形成包含铜和锡的混合物层35。此后，在基底绝缘层上形成阻焊层SOL，以覆盖给定区域中的布线图案12和镀锡层34。随后，对抗焊剂SOL进行热固化处理。

8. 发明授权

US06938473B2 Apparatus for measuring flow amount 有权
标题翻译：用于测量流量的装置
公开(公告)号：US06938473B2
公开(公告)日：2005-09-06
申请号：US10298230
申请日：2002-11-18
申请人： Takao Iwaki , Toshiyuki Morishita , Yasushi Kohno , Hiroyuki Wado , Yasushi Goka , Makoto Tsunekawa , Toshirou Gotou , Kiyoyuki Sugiura
发明人： Takao Iwaki , Toshiyuki Morishita , Yasushi Kohno , Hiroyuki Wado , Yasushi Goka , Makoto Tsunekawa , Toshirou Gotou , Kiyoyuki Sugiura
IPC分类号： G01F1/684 , G01F1/68
CPC分类号： G01F1/6842
摘要： An airflow meter has a membrane type sensor element. The sensor element is supported on a support member so that a sensing surface of the sensor element is in parallel to the airflow direction. The airflow meter has at least one means for protecting the sensor element from dust such as foreign particles. The protecting means is provided with an obstruction member that is disposed upstream or downstream of the sensor element with respect to the airflow direction. The sensor element is hidden behind the obstruction member. The obstruction member has gradually spreading surfaces and gradually converging surfaces along the airflow direction. Alternatively, the protecting means can be provided with a deflector, a cover member, a flow guide member, an inlet or a dust collector.
摘要翻译：气流计具有膜式传感器元件。传感器元件支撑在支撑构件上，使得传感器元件的感测表面平行于气流方向。气流计具有至少一种用于保护传感器元件免受诸如外来颗粒的灰尘的装置。保护装置设置有相对于气流方向设置在传感器元件的上游或下游的阻塞构件。传感器元件隐藏在阻塞构件后面。阻塞构件具有逐渐扩散的表面并沿着气流方向逐渐收敛表面。或者，保护装置可以设置有偏转器，盖构件，导流构件，入口或集尘器。

9. 发明授权

US08893648B2 Electroless plating apparatus, method of electroless plating, and manufacturing method of printed circuit board 有权
标题翻译：化学镀装置，无电解电镀方法以及印刷电路板的制造方法
公开(公告)号：US08893648B2
公开(公告)日：2014-11-25
申请号：US13438238
申请日：2012-04-03
申请人： Makoto Tsunekawa
发明人： Makoto Tsunekawa
IPC分类号： B05C3/09 , B05C5/00 , B05C3/02 , C23C18/16 , C25D21/12 , C25D17/10 , C25D17/00 , H05K3/18 , H05K1/05
CPC分类号： C23C18/1619 , B05C3/02 , B05C3/09 , B05C5/00 , C23C18/1671 , C25D17/00 , C25D17/10 , C25D21/12 , H05K1/056 , H05K3/181 , H05K2203/1545
摘要： An electroless plating solution is contained in a plating tank of an electroless plating apparatus. A reference electrode and a counter electrode are immersed in the electroless plating solution. A conductive member is provided to be electrically in contact with a conductive layer formed of a long-sized substrate. The conductive member, the reference electrode, and the counter electrode are connected to a potentiostat. The potentiostat controls an electric current that flows between the conductive layer formed of the long-sized substrate and the counter electrode such that a potential of the conductive layer formed of the long-sized substrate (working electrode) is at a constant level with respect to a potential of the reference electrode.
摘要翻译：无电解镀液包含在化学镀设备的镀槽中。将参考电极和对电极浸入无电镀液中。导电构件设置成与由长尺寸基板形成的导电层电接触。导电构件，参考电极和对电极连接到恒电位仪。恒电位仪控制在由长尺寸基板形成的导电层和对电极之间流动的电流，使得由长尺寸基板（工作电极）形成的导电层的电位相对于参考电极的电位。

10. 发明授权

US08037597B2 Manufacturing method of tape carrier for TAB 失效
标题翻译： TAB胶带载体的制造方法
公开(公告)号：US08037597B2
公开(公告)日：2011-10-18
申请号：US12062573
申请日：2008-04-04
申请人： Makoto Tsunekawa
发明人： Makoto Tsunekawa
IPC分类号： H01K3/00
CPC分类号： H05K3/0008 , H01L21/4839 , H01L23/49565 , H01L23/49582 , H01L23/544 , H01L24/80 , H01L2223/5442 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K1/0269 , H05K3/0091 , H05K3/0097 , H05K3/1216 , H05K3/28 , H05K2201/09918 , H05K2201/10681 , H05K2203/1545 , H05K2203/166 , Y10T29/49121 , Y10T29/49124 , Y10T29/49144 , Y10T29/49155 , Y10T29/4916
摘要： Positioning marks are formed on both sides of each printing block on a tape carrier for TAB. A long-sized circuit board is transported by a roll-to-roll system in screen printing. When an optical sensor detects a positioning mark, transportation of the long-sized circuit board is stopped. Thereafter, the screen printing of a solder resist is performed to the printing block of the long-sized circuit board by a screen printing device.
摘要翻译：定位标记形成在用于TAB的带载体上的每个印刷块的两侧。一个长尺寸的电路板通过卷对卷系统进行丝网印刷传输。当光学传感器检测到定位标记时，停止长尺寸电路板的输送。此后，通过丝网印刷装置对长尺寸电路板的印刷块进行阻焊剂的丝网印刷。

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