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1. 发明授权

US07632378B2 Polishing apparatus 有权
公开(公告)号：US07632378B2
公开(公告)日：2009-12-15
申请号：US11078495
申请日：2005-03-14
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： C23F1/00 , H01L21/306
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

2. 发明授权

US06358128B1 Polishing apparatus 有权
公开(公告)号：US06358128B1
公开(公告)日：2002-03-19
申请号：US09663417
申请日：2000-09-15
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B700
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

3. 发明授权

US06682408B2 Polishing apparatus 失效
公开(公告)号：US06682408B2
公开(公告)日：2004-01-27
申请号：US10026763
申请日：2001-12-27
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B100
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

4. 发明申请

US20050159082A1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US20050159082A1
公开(公告)日：2005-07-21
申请号：US11078495
申请日：2005-03-14
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B37/04 , H01L21/306 , B24B49/00
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构在至少三个清洁装置之间。抛光装置还包括旋转输送器，其设置在可由所述顶环接近的位置，并且具有从旋转运送器的旋转中心定位在预定圆周上的多个部分，用于保持工件。

5. 发明授权

US06878044B2 Polishing apparatus 有权
公开(公告)号：US06878044B2
公开(公告)日：2005-04-12
申请号：US10750823
申请日：2004-01-05
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B37/04 , H01L21/306 , B24B7/00
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

6. 发明授权

US06354922B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06354922B1
公开(公告)日：2002-03-12
申请号：US09476905
申请日：2000-01-03
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B722
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The transfer structure comprises a plurality of robots and is capable of changing transfer routes between the three cleaning apparatuses.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构在至少三个清洁装置之间。传送结构包括多个机器人，并且能够改变三个清洁设备之间的传送路线。

7. 发明授权

US06578891B1 Substrate holder and substrate transfer apparatus using the same 有权
标题翻译：基板支架和使用其的基板输送装置
公开(公告)号：US06578891B1
公开(公告)日：2003-06-17
申请号：US09612212
申请日：2000-07-07
申请人： Hiroo Suzuki , Kenya Ito , Kunihiko Sakurai , Satoshi Wakabayashi , Tetsuji Togawa
发明人： Hiroo Suzuki , Kenya Ito , Kunihiko Sakurai , Satoshi Wakabayashi , Tetsuji Togawa
IPC分类号： B25J1500
CPC分类号： H01L21/67259 , B25J13/086 , B25J15/00 , B25J19/021 , H01L21/67766 , H01L21/68707 , Y10S294/907 , Y10S414/141
摘要： The present invention provides a substrate holder for holding and transferring a thin substrate, comprising a substrate support member having a recessed area for placing a thin substrate therein and substrate mount portions formed in the recessed area in the vicinity of a circumferential edge thereof. The substrate mount portions is adapted to be engaged with an outer circumferential portion of a backside of the substrate placed in the recessed area. The substrate holder further comprises a substrate detector for detecting presence or absence of the substrate in the recessed area.
摘要翻译：本发明提供了一种用于保持和转印薄基板的基板保持器，包括：具有用于放置薄基板的凹陷区域的基板支撑构件和形成在其周缘附近的凹陷区域中的基板安装部分。基板安装部分适于与放置在凹陷区域中的基板的背面的外周部分接合。衬底保持器还包括用于检测凹陷区域中的衬底的存在或不存在的衬底检测器。

8. 发明授权

US06358131B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06358131B1
公开(公告)日：2002-03-19
申请号：US09625490
申请日：2000-07-25
申请人： Kunihiko Sakurai , Satoshi Wakabayashi , Tetsuji Togawa
发明人： Kunihiko Sakurai , Satoshi Wakabayashi , Tetsuji Togawa
IPC分类号： B24B500
CPC分类号： B24B37/345 , B24B41/061
摘要： The present invention provides a polishing apparatus comprising a polishing table having a polishing surface, a substrate carrier having an axis about which the substrate carrier is rotatable. The substrate carrier includes a plurality of substrate holders positioned around a circle about the axis of the substrate carrier and spaced apart from each other at equal angular distances, with each of the substrate holders being adapted to hold a substrate and bring it into contact with the polishing surface. The apparatus further comprises a substrate loading device laterally spaced apart from the polishing table, in which device a substrate is picked up by one of the substrate holders which is positioned at the substrate loading device, and a substrate unloading device laterally spaced apart from the polishing table, in which device one of the substrate holders which is positioned at the substrate unloading device releases a wafer onto the unloading device. The substrate carrier is indexably rotated about the stated axis in such a manner that one of the substrate holders is selectively positioned at the loading device, while another substrate holder is positioned at the unloading device and at least one of the other substrate holders is positioned over the polishing surface.
摘要翻译：本发明提供了一种抛光装置，其包括具有抛光表面的抛光台，具有基板载体可旋转的轴线的基板载体。衬底载体包括多个衬底保持器，其围绕衬底载体的轴线围绕圆周定位，并以相等的角距彼此间隔开，衬底保持器中的每一个适于保持衬底并使其与抛光面。该装置还包括与抛光台横向间隔开的衬底加载装置，其中衬底被位于衬底装载装置的衬底保持器中的一个拾取，以及与抛光件横向间隔开的衬底卸载装置工作台，其中位于衬底卸载装置的衬底保持器之一的装置将晶片释放到卸载装置上。衬底载体可以以所述轴线可转动地旋转，使得衬底保持器中的一个选择性地定位在加载装置处，而另一衬底保持器定位在卸载装置处，并且至少一个衬底保持器位于抛光面。

9. 发明授权

US06602119B1 Dressing apparatus 失效
标题翻译：敷料机
公开(公告)号：US06602119B1
公开(公告)日：2003-08-05
申请号：US09588537
申请日：2000-06-07
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Nobuyuki Takada , Satoshi Wakabayashi
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Nobuyuki Takada , Satoshi Wakabayashi
IPC分类号： B24B700
CPC分类号： B24B53/017
摘要： Disclosed is a dressing apparatus wherein a polishing surface can be regenerated stably over a long period without any danger of an object to be polished being scratched. A dressing surface 50a of a dresser 48 is caused to slide on a polishing surface 30a of a polishing table 22 while the dressing surface is urged against the polishing surface. The dressing surface is formed from a grindstone 50.
摘要翻译：公开了一种修整装置，其中可以长时间稳定地再生抛光表面，而不会有被抛光的物体被划伤的危险。使修整器48的修整面50a在研磨台22的研磨面30a上滑动，同时使修整面抵靠着研磨面。修整表面由磨石50形成。

10. 发明授权

US06609962B1 Dressing apparatus and polishing apparatus 有权
标题翻译：敷料装置和抛光装置
公开(公告)号：US06609962B1
公开(公告)日：2003-08-26
申请号：US09572629
申请日：2000-05-17
申请人： Satoshi Wakabayashi , Kuniaki Yamaguchi , Tetsuji Togawa , Nobuyuki Takada , Osamu Nabeya
发明人： Satoshi Wakabayashi , Kuniaki Yamaguchi , Tetsuji Togawa , Nobuyuki Takada , Osamu Nabeya
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B1/04 , B24B53/12
摘要： A dressing apparatus is used for dressing a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer. The dressing apparatus for dressing apparatus comprises a dresser having a dressing surface for dressing the polishing surface, and the dressing surface has an area which covers an entire area of the polishing surface.
摘要翻译：修整装置用于修整用于抛光诸如半导体晶片的工件的抛光台的抛光表面。修整装置的敷料装置包括具有用于修整抛光表面的修整表面的修整器，并且修整表面具有覆盖抛光表面的整个区域的区域。

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