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1. 发明授权

US06746889B1 Optoelectronic device with improved light extraction 有权
标题翻译：具有改进光提取的光电器件
公开(公告)号：US06746889B1
公开(公告)日：2004-06-08
申请号：US10108292
申请日：2002-03-27
申请人： Ivan Eliashevich , Hari Venugopalan , Bob Karlicek , Stanton Weaver
发明人： Ivan Eliashevich , Hari Venugopalan , Bob Karlicek , Stanton Weaver
IPC分类号： H01L2000
CPC分类号： H01L25/0753 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2103/172 , H01L2924/0002 , H01S5/0201 , H01S5/0203 , H01S5/0217 , H01L2924/00
摘要： An improved method for producing optoelectronic devices such as light emitting diodes or laser diodes is provided. Light emitting diodes or laser diodes are provided with improved light extraction. Epitaxial layers including a light emitting p-n junction are deposited on a substrate, and separations are cut through the epitaxial layers to provide a structure including a plurality of individual dies on the substrate. The structure is mounted on a submount and the substrate is removed. An index matching material is then attached to improve light extraction from the optoelectronic device.
摘要翻译：提供了一种用于制造诸如发光二极管或激光二极管的光电子器件的改进方法。发光二极管或激光二极管具有改进的光提取。包含发光p-n结的外延层沉积在衬底上，并且通过外延层切割间隔以提供包括在衬底上的多个单个管芯的结构。该结构安装在底座上，并且移除基板。然后附加折射率匹配材料以改善从光电子器件的光提取。

2. 发明申请

US20070114557A1 Flip-chip light emitting diode device without sub-mount 审中-公开
公开(公告)号：US20070114557A1
公开(公告)日：2007-05-24
申请号：US11654165
申请日：2007-01-16
申请人： Bryan Shelton , Sebastien Libon , Hari Venugopalan , Ivan Eliashevich , Stanton Weaver , Chen-Lun Chen , Thomas Soules , Steven LeBoeuf , Stephen Arthur
发明人： Bryan Shelton , Sebastien Libon , Hari Venugopalan , Ivan Eliashevich , Stanton Weaver , Chen-Lun Chen , Thomas Soules , Steven LeBoeuf , Stephen Arthur
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/81 , H01L33/38 , H01L2224/0345 , H01L2224/03462 , H01L2224/0401 , H01L2224/04026 , H01L2224/05005 , H01L2224/05023 , H01L2224/05027 , H01L2224/0508 , H01L2224/05139 , H01L2224/05144 , H01L2224/05155 , H01L2224/05564 , H01L2224/05568 , H01L2224/05611 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/13639 , H01L2224/13644 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/3003 , H01L2224/73103 , H01L2224/73203 , H01L2224/83193 , H01L2224/83203 , H01L2224/83205 , H01L2224/8321 , H01L2224/8323 , H01L2224/83815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type bonding pad (62) defining a minimum bonding pads separation (dpads) that is larger than the minimum electrodes separation (delectrodes). At least one fanning layer (30) interposed between the front-side of the light emitting diode (10) and the bonding pad layer (50) includes a plurality of electrically conductive paths passing through vias (34, 54) of a dielectric layer (32, 52) to provide electrical communication between the at least one n-type electrode (14) and the at least one n-type bonding pad (64) and between the at least one p-type electrode (12) and the at least one p-type bonding pad (62).

3. 发明申请

US20050194605A1 Flip-chip light emitting diode device without sub-mount 有权
标题翻译：倒装芯片发光二极管器件无需安装
公开(公告)号：US20050194605A1
公开(公告)日：2005-09-08
申请号：US10794935
申请日：2004-03-05
申请人： Bryan Shelton , Sebastien Libon , Hari Venugopalan , Ivan Eliashevich , Stanton Weaver , Chen-Lun Chen , Thomas Soules , Steven LeBoeuf , Stephen Arthur
发明人： Bryan Shelton , Sebastien Libon , Hari Venugopalan , Ivan Eliashevich , Stanton Weaver , Chen-Lun Chen , Thomas Soules , Steven LeBoeuf , Stephen Arthur
IPC分类号： H01L27/15 , H01L33/38 , H01L33/62
CPC分类号： H01L33/62 , H01L24/81 , H01L33/38 , H01L2224/0345 , H01L2224/03462 , H01L2224/0401 , H01L2224/04026 , H01L2224/05005 , H01L2224/05023 , H01L2224/05027 , H01L2224/0508 , H01L2224/05139 , H01L2224/05144 , H01L2224/05155 , H01L2224/05564 , H01L2224/05568 , H01L2224/05611 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/13639 , H01L2224/13644 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/3003 , H01L2224/73103 , H01L2224/73203 , H01L2224/83193 , H01L2224/83203 , H01L2224/83205 , H01L2224/8321 , H01L2224/8323 , H01L2224/83815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type bonding pad (62) defining a minimum bonding pads separation (dpads) that is larger than the minimum electrodes separation (delectrodes). At least one fanning layer (30) interposed between the front-side of the light emitting diode (10) and the bonding pad layer (50) includes a plurality of electrically conductive paths passing through vias (34, 54) of a dielectric layer (32, 52) to provide electrical communication between the at least one n-type electrode (14) and the at least one n-type bonding pad (64) and between the at least one p-type electrode (12) and the at least one p-type bonding pad (62).
摘要翻译：发光二极管（10）具有背面和前侧，具有至少一个n型电极（14）和设置在其上的至少一个p型电极（12），其限定最小电极间隔（d < ）。接合焊盘层（50）包括至少一个n型接合焊盘（64）和至少一个限定最小接合焊盘间隔（p>焊盘）的p型接合焊盘（62）大于最小电极分离（d _{电极）。插入在发光二极管（10）的前侧和接合焊盘层（50）之间的至少一个扇形层（30）包括穿过电介质层的通孔（34,54）的多个导电路径以在所述至少一个n型电极（14）和所述至少一个n型焊盘（64）之间以及所述至少一个p型电极（12）和所述至少一个p型电极（12）之间提供电连通一个p型接合焊盘（62）。}

4. 发明授权

US08434906B2 Lighting system with thermal management system 有权
公开(公告)号：US08434906B2
公开(公告)日：2013-05-07
申请号：US12711000
申请日：2010-02-23
申请人： Mehmet Arik , Stanton Weaver , Thomas Stecher , Charles Seeley , Glenn Kuenzler , Charles Wolfe, Jr. , Yogen Utturkar , Rajdeep Sharma , Satish Prabhakaran , Tunc Icoz
发明人： Mehmet Arik , Stanton Weaver , Thomas Stecher , Charles Seeley , Glenn Kuenzler , Charles Wolfe, Jr. , Yogen Utturkar , Rajdeep Sharma , Satish Prabhakaran , Tunc Icoz
IPC分类号： F21V29/00 , H01L23/34
CPC分类号： H05B33/0803 , F21K9/23 , F21K9/232 , F21K9/238 , F21V23/006 , F21V29/02 , F21V29/63 , F21V29/74 , F21V29/763 , F21V29/83 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , F28F3/02 , H01L2924/0002 , H01L2924/00
摘要： Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

5. 发明申请

US20110204790A1 LIGHTING SYSTEM WITH THERMAL MANAGEMENT SYSTEM 有权
标题翻译：具有热管理系统的照明系统
公开(公告)号：US20110204790A1
公开(公告)日：2011-08-25
申请号：US12711000
申请日：2010-02-23
申请人： Mehmet Arik , Stanton Weaver , Thomas Stecher , Charles Seeley , Glenn Kuenzler , Charles Wolfe, JR. , Yogen Utturkar , Rajdeep Sharma , Satish Prabhakaran , Tunc Icoz
发明人： Mehmet Arik , Stanton Weaver , Thomas Stecher , Charles Seeley , Glenn Kuenzler , Charles Wolfe, JR. , Yogen Utturkar , Rajdeep Sharma , Satish Prabhakaran , Tunc Icoz
IPC分类号： H01J13/32 , H01J61/52
CPC分类号： H05B33/0803 , F21K9/23 , F21K9/232 , F21K9/238 , F21V23/006 , F21V29/02 , F21V29/63 , F21V29/74 , F21V29/763 , F21V29/83 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , F28F3/02 , H01L2924/0002 , H01L2924/00
摘要： Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.
摘要翻译：提供具有独特配置的照明系统。例如，照明系统可以包括光源，热管理系统和驱动器电子器件，每个都包含在外壳结构内。光源构造成通过壳体结构中的开口提供可见的照明。热管理系统被配置为通过壳体结构提供诸如单向空气流的空气流，以便冷却光源。驱动器电子器件被配置为向每个光源和热管理系统提供电力。

6. 发明申请

US20050087884A1 Flip-chip light emitting diode 失效
标题翻译：倒装芯片发光二极管
公开(公告)号：US20050087884A1
公开(公告)日：2005-04-28
申请号：US10693126
申请日：2003-10-24
申请人： Edward Stokes , Mark D'Evelyn , Stanton Weaver , Peter Sandvik , Abasifreke Ebong , Xian-an Cao , Steven LeBoeuf , Nikhil Taskar
发明人： Edward Stokes , Mark D'Evelyn , Stanton Weaver , Peter Sandvik , Abasifreke Ebong , Xian-an Cao , Steven LeBoeuf , Nikhil Taskar
IPC分类号： H01L23/48 , H01L33/38 , H01L33/40
CPC分类号： H01L33/405 , H01L33/387 , H01L2933/0083
摘要： A flip chip light emitting diode die (10, 10′, 10″) includes a light-transmissive substrate (12, 12′, 12″) and semiconductor layers (14, 14′, 14″) that are selectively patterned to define a device mesa (30, 30′, 30″). A reflective electrode (34, 34′, 34″) is disposed on the device mesa (30, 30′, 30″). The reflective electrode (34, 34′, 34″) includes a light-transmissive insulating grid (42, 42′, 60, 80) disposed over the device mesa (30, 30′, 30″), an ohmic material (44, 44′, 44″, 62) disposed at openings of the insulating grid (42, 42′, 60, 80) and making ohmic contact with the device mesa (30, 30′, 30″), and an electrically conductive reflective film (46, 46′, 46″) disposed over the insulating grid (42, 42′, 60, 80) and the ohmic material (44, 44′, 44″, 62). The electrically conductive reflective film (46, 46′, 46″) electrically communicates with the ohmic material (44, 44′, 44″, 62).
摘要翻译：倒装芯片发光二极管管芯（10,10'，10“）包括透光衬底（12,12'，12”）和半导体层（14,14'，14“），其被选择性地图案化以限定装置台面（30,30'，30“）。反射电极（34,34'，34“）设置在器件台面（30,30'，30”）上。反射电极（34,34'，34“）包括设置在器件台面（30,30'，30”）上方的透光绝缘栅极（42,42'，60,80），欧姆材料 44,44'，44“，62）设置在绝缘栅极（42,42'，60,80）的开口处并与器件台面（30,30'，30”）形成欧姆接触，设置在绝缘栅极（42,42'，60,80）上的导电反射膜（46,46'，46“）和欧姆材料（44,44'，44”，62）。导电反射膜（46,46'，46“）与欧姆材料（44,44'，44”，62）电连通。

7. 发明申请

US20070165402A1 LED lighting system with reflective board 有权
标题翻译： LED照明系统带反光板
公开(公告)号：US20070165402A1
公开(公告)日：2007-07-19
申请号：US11725410
申请日：2007-03-19
申请人： Stanton Weaver , Thomas Stecher
发明人： Stanton Weaver , Thomas Stecher
IPC分类号： F21V1/00
CPC分类号： H05K1/181 , F21K9/00 , H01L25/0753 , H01L2924/0002 , H01S5/005 , H01S5/02216 , H01S5/02292 , H01S5/4025 , H05K1/0274 , H05K2201/0195 , H05K2201/0209 , H05K2201/2054 , Y02P70/611 , Y10S362/80 , H01L2924/00
摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.
摘要翻译：发光装置（8）包括设置在印刷电路板（12）上的一个或多个发光芯片（10），并且发射主要在约400纳米至约470纳米的波长范围内。印刷电路板包括：（i）电绝缘板（14）; （ii）导电印刷电路（20）; 和（iii）具有通孔（24）的电绝缘的焊接掩模（22），所述一个或多个发光芯片通过该通孔与印刷电路电接触。焊料掩模（22）具有大于60％的反射率，至少在约400纳米和约470纳米之间。

8. 发明申请

US20070069357A1 Device for thermal transfer and power generation 有权
标题翻译：热转印和发电装置
公开(公告)号：US20070069357A1
公开(公告)日：2007-03-29
申请号：US11449002
申请日：2006-06-07
申请人： Stanton Weaver , Mehmet Arik
发明人： Stanton Weaver , Mehmet Arik
IPC分类号： H01L23/02
CPC分类号： H01L35/08 , H01J45/00 , H01L35/32
摘要： A system is provided. The system includes a device that includes top and bottom thermally conductive substrates positioned opposite to one another, wherein a top surface of the bottom thermally conductive substrate is substantially atomically flat and a thermal blocking layer disposed between the top and bottom thermally conductive substrates. The device also includes top and bottom electrodes separated from one another between the top and bottom thermally conductive substrates to define a tunneling path, wherein the top electrode is disposed on the thermal blocking layer and the bottom electrode is disposed on the bottom thermally conductive substrate.
摘要翻译：提供了一个系统。该系统包括一个装置，该装置包括彼此相对定位的顶部和底部导热基底，其中底部导热基底的顶表面基本上是原子上平坦的，以及设置在顶部和底部导热基底之间的热阻挡层。该装置还包括在顶部和底部导热基板之间彼此分离的顶部和底部电极以限定隧道路径，其中顶部电极设置在热阻挡层上，而底部电极设置在底部导热基底上。

9. 发明申请

US20060207643A1 Device for thermal transfer and power generation and system and method incorporating same 有权
标题翻译：用于热转印和发电的装置及其结合的系统和方法
公开(公告)号：US20060207643A1
公开(公告)日：2006-09-21
申请号：US11081986
申请日：2005-03-16
申请人： Stanton Weaver , Robert Wojnarowski
发明人： Stanton Weaver , Robert Wojnarowski
IPC分类号： H01L35/30
CPC分类号： H01L35/32 , Y10T156/1092
摘要： A device includes first and second electrically conductive substrates that are positioned opposite from one another. The device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.
摘要翻译：一种器件包括彼此相对定位的第一和第二导电衬底。该装置还包括设置在第一和第二导电基底之间的密封层和具有导电材料的多个中空结构，其中多个中空结构由第一和第二导电基底之间的密封层容纳。

10. 发明申请

US20060091778A1 Phosphor blends for green traffic signals 有权
标题翻译：荧光粉混合绿色交通信号
公开(公告)号：US20060091778A1
公开(公告)日：2006-05-04
申请号：US10979912
申请日：2004-11-02
申请人： Anant Setlur , Emil Radkov , Alok Srivastava , Stanton Weaver , Thomas Stecher , Holly Comanzo
发明人： Anant Setlur , Emil Radkov , Alok Srivastava , Stanton Weaver , Thomas Stecher , Holly Comanzo
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： C09K11/7734 , C09K11/7739 , C09K11/774 , H01L33/502 , H01L33/507 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2924/00012
摘要： There is provided a blue-green illumination system, including a semiconductor light emitter, and a luminescent material, wherein the system has an emission with CIE color coordinates located within an area of a of a pentagon on a CIE chromaticity diagram, whose corners have the following CIE color coordinates: i) x=0.0137 and y=0.4831; ii) x=0.2240 and y=0.3890; iii) x=0.2800 and y=0.4500; iv) x=0.2879 and y=0.5196; and v) x=0.0108 and y=0.7220. The luminescent material includes two or more phosphors. The illumination system may be used as the green light of a traffic light or an automotive display.
摘要翻译：提供了包括半导体光发射器和发光材料的蓝绿照明系统，其中该系统具有CIE色坐标位于CIE色度图的五边形区域内的发射，其角部具有遵循CIE色坐标：i）x = 0.0137和y = 0.4831; ii）x = 0.2240和y = 0.3890; iii）x = 0.2800和y = 0.4500; iv）x = 0.2879和y = 0.5196; 和v）x = 0.0108和y = 0.7220。发光材料包括两种或更多种荧光体。照明系统可以用作交通信号灯或汽车显示器的绿灯。

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