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1. 发明授权

US07837425B2 Transportation apparatus and drive mechanism 有权
标题翻译：运输装置及驱动机构
公开(公告)号：US07837425B2
公开(公告)日：2010-11-23
申请号：US10564618
申请日：2004-07-09
申请人： Hiroaki Saeki , Shigeru Ishizawa , Takehiro Shindo , Tsutomu Hiroki , Wataru Machiyama
发明人： Hiroaki Saeki , Shigeru Ishizawa , Takehiro Shindo , Tsutomu Hiroki , Wataru Machiyama
IPC分类号： B25J18/02
CPC分类号： H01L21/67742 , B25J9/042 , B25J9/107 , H01L21/68707 , Y10T74/20305
摘要： A transfer apparatus (20) for a target substrate (W) includes a rotatable rotary base (24). First and second arm mechanisms (26, 28) are attached to the rotary base and configured to bend and stretch. Each of the first and second arm mechanisms has a proximal end arm (26A, 28A), an intermediate arm (26B, 28B), and a pick (26C, 28C) which are pivotally coupled to each other sequentially from the rotary base. The picks are disposed to support the target substrate. A link mechanism (30) is coupled to the proximal end arms of the first and second arm mechanisms to drive the first and second arm mechanisms. A first driving source (32) is disposed to rotatably drive the rotary base. A second driving source (34) is disposed to drive the link mechanism so as to bend or stretch the first and second arm mechanisms.
摘要翻译：用于目标基板（W）的转印装置（20）包括可旋转的旋转基座（24）。第一和第二臂机构（26,28）附接到旋转底座并且构造成弯曲和拉伸。第一和第二臂机构中的每一个具有近端臂（26A，28A），中间臂（26B，28B）和拾取器（26C，28C），其从旋转底座依次枢转地联接。设置拾取器以支撑目标衬底。连杆机构（30）联接到第一和第二臂机构的近端臂以驱动第一和第二臂机构。第一驱动源（32）设置成可旋转地驱动旋转底座。第二驱动源（34）设置成驱动连杆机构以使第一和第二臂机构弯曲或拉伸。

2. 发明申请

US20060210387A1 Transportation apparatus and drive mechanism 有权
标题翻译：运输装置及驱动机构
公开(公告)号：US20060210387A1
公开(公告)日：2006-09-21
申请号：US10564618
申请日：2004-07-09
申请人： Hiroaki Saeki , Shigeru Ishizawa , Takehiro Shindo , Tsutomu Hiroki , Wataru Machiyama
发明人： Hiroaki Saeki , Shigeru Ishizawa , Takehiro Shindo , Tsutomu Hiroki , Wataru Machiyama
IPC分类号： B66C23/00
CPC分类号： H01L21/67742 , B25J9/042 , B25J9/107 , H01L21/68707 , Y10T74/20305
摘要： A transfer apparatus (20) for a target substrate (W) includes a rotatable rotary base (24). First and second arm mechanisms (26, 28) are attached to the rotary base and configured to bend and stretch. Each of the first and second arm mechanisms has a proximal end arm (26A, 28A), an intermediate arm (26B, 28B), and a pick (26C, 28C) which are pivotally coupled to each other sequentially from the rotary base. The picks are disposed to support the target substrate. A link mechanism (30) is coupled to the proximal end arms of the first and second arm mechanisms to drive the first and second arm mechanisms. A first driving source (32) is disposed to rotatably drive the rotary base. A second driving source (34) is disposed to drive the link mechanism so as to bend or stretch the first and second arm mechanisms.
摘要翻译：用于目标基板（W）的转印装置（20）包括可旋转的旋转基座（24）。第一和第二臂机构（26,28）附接到旋转底座并且构造成弯曲和拉伸。第一和第二臂机构中的每一个具有近端臂（26A，28A），中间臂（26B，28B）和拾取器（26C，28C），该拾取器彼此顺序地相互联接从旋转底座。设置拾取器以支撑目标衬底。连杆机构（30）联接到第一和第二臂机构的近端臂以驱动第一和第二臂机构。第一驱动源（32）设置成可旋转地驱动旋转底座。第二驱动源（34）设置成驱动连杆机构以使第一和第二臂机构弯曲或拉伸。

3. 外观设计

USD562524S1 Wafer transfer apparatus 有权
标题翻译：晶圆传送装置
公开(公告)号：USD562524S1
公开(公告)日：2008-02-19
申请号：US29220627
申请日：2005-01-05
申请人： Tsutomu Hiroki , Wataru Machiyama , Takehiro Shindo
设计人： Tsutomu Hiroki , Wataru Machiyama , Takehiro Shindo

4. 发明授权

US08821644B2 Bevel/backside polymer removing method and device, substrate processing apparatus and storage medium 有权
标题翻译：斜面/背面聚合物去除方法和装置，基板处理装置和存储介质
公开(公告)号：US08821644B2
公开(公告)日：2014-09-02
申请号：US12268649
申请日：2008-11-11
申请人： Isamu Sakuragi , Akinori Kitamura , Tsutomu Hiroki , Takehiro Shindo
发明人： Isamu Sakuragi , Akinori Kitamura , Tsutomu Hiroki , Takehiro Shindo
IPC分类号： B08B1/00 , B24B37/34 , H01L21/02 , H01L21/67
CPC分类号： H01L21/02087 , B24B37/345 , H01L21/0209 , H01L21/67046 , H01L21/67069 , H01L21/67115 , H01L21/67207 , Y10S134/902
摘要： A bevel/backside polymer removing method removes multi-layered bevel/backside polymers adhering to a bevel surface and a backside of a target substrate. The multi-layered bevel/backside polymers include an inorganic layer and an organic layer. The bevel/backside polymer removing method includes mechanically destroying the multi-layered bevel/backside polymers and heating residues of the multi-layered bevel/backside polymers mechanically destroyed.
摘要翻译：斜面/背面聚合物去除方法去除粘附到目标基底的斜面和背面的多层斜面/背面聚合物。多层斜面/背面聚合物包括无机层和有机层。斜面/背面聚合物去除方法包括机械破坏多层斜面/背面聚合物和加热机械破坏的多层斜面/背面聚合物的残余物。

5. 发明申请

US20090184234A1 METHOD FOR ADJUSTING POSITION OF LASER EMITTING DEVICE 审中-公开
标题翻译：用于调整激光发射装置的位置的方法
公开(公告)号：US20090184234A1
公开(公告)日：2009-07-23
申请号：US12302334
申请日：2007-08-27
申请人： Takehiro Shindo , Tsutomu Hiroki
发明人： Takehiro Shindo , Tsutomu Hiroki
IPC分类号： G01J1/44
CPC分类号： B23K26/046 , B23K26/042 , B23K26/705 , H01L21/681
摘要： Performed is a process of setting, on a mounting table, an adjustment substrate, which is provided with a slit of a preset width extended toward a center from a peripheral portion of the adjustment substrate; irradiating the laser beam toward a light receiving surface of a light energy measuring device, which is disposed on a front surface side of the adjustment substrate, from a rear surface side of the adjustment substrate through the slit; and measuring a variation in an energy amount of the laser beam irradiated onto the light receiving surface by the light energy measuring device while moving the laser emitting device in the optical axis direction, and adjusting a position of the laser emitting device in the optical axis direction to a desired position based on the variation in the energy amount on the light receiving surface.
摘要翻译：执行的是在安装台上设置调整基板的处理，该调整基板设置有从调整基板的周边部向中心延伸的预定宽度的狭缝; 从配置在调整用基板的前表面侧的光能测量装置的受光面朝向通过狭缝的调整基板的背面侧照射激光束; 并且在沿着光轴方向移动激光发射装置的同时测量由光能测量装置照射到光接收表面上的激光束的能量的变化，并且调整激光发射装置在光轴方向上的位置基于光接收表面上的能量的变化而到达期望位置。

6. 发明申请

US20090143894A1 BEVEL/BACKSIDE POLYMER REMOVING METHOD AND DEVICE, SUBSTRATE PROCESSING APPARATUS AND STORAGE MEDIUM 有权
标题翻译：水平/背面聚合物去除方法和装置，基板处理装置和储存介质
公开(公告)号：US20090143894A1
公开(公告)日：2009-06-04
申请号：US12268649
申请日：2008-11-11
申请人： Isamu SAKURAGI , Akinori Kitamura , Tsutomu Hiroki , Takehiro Shindo
发明人： Isamu SAKURAGI , Akinori Kitamura , Tsutomu Hiroki , Takehiro Shindo
IPC分类号： G06F17/00 , B24B1/00 , B23K26/16 , B24B7/04
CPC分类号： H01L21/02087 , B24B37/345 , H01L21/0209 , H01L21/67046 , H01L21/67069 , H01L21/67115 , H01L21/67207 , Y10S134/902
摘要： A bevel/backside polymer removing method removes multi-layered bevel/backside polymers adhering to a bevel surface and a backside of a target substrate. The multi-layered bevel/backside polymers include an inorganic layer and an organic layer. The bevel/backside polymer removing method includes mechanically destroying the multi-layered bevel/backside polymers and heating residues of the multi-layered bevel/backside polymers mechanically destroyed.
摘要翻译：斜面/背面聚合物去除方法去除粘附到目标基底的斜面和背面的多层斜面/背面聚合物。多层斜面/背面聚合物包括无机层和有机层。斜面/背面聚合物去除方法包括机械破坏多层斜面/背面聚合物和加热机械破坏的多层斜面/背面聚合物的残余物。

7. 发明授权

US08135486B2 Substrate position determining method and substrate position detecting method 有权
标题翻译：基板位置确定方法和基板位置检测方法
公开(公告)号：US08135486B2
公开(公告)日：2012-03-13
申请号：US12439833
申请日：2007-08-20
申请人： Takehiro Shindo
发明人： Takehiro Shindo
IPC分类号： G06F19/00 , G05B19/04 , G05B19/18 , G01B11/00 , G01B11/14
CPC分类号： H01L21/67259
摘要： Even in case that a wafer is so greatly deviated that a peripheral portion of the wafer cannot be detected, position determination of the wafer can be performed without inflicting a damage on the wafer. The wafer peripheral portion, which is a target, is detected based on output images from a plurality of imaging units disposed along a peripheral portion shape of the wafer (step S210), and a wafer position deviation correcting step (step S220) or a rough correcting step (step 230) is performed according to the number of the imaging units capable of detecting the wafer peripheral portion. In case that the wafer peripheral portion cannot be detected by all the imaging units, a wafer position adjusting step (step 240) for moving the wafer is performed in a position adjusting direction acquired by a combination of the output images by each imaging unit.
摘要翻译：即使在晶片如此大的偏离使得不能检测晶片的周边部分的情况下，也可以进行晶片的位置确定而不会对晶片造成损坏。基于来自沿着晶片的周边部分形状设置的多个成像单元的输出图像（步骤S210）和晶片位置偏差校正步骤（步骤S220）或粗糙度（步骤S220），检测作为目标的晶片周边部分根据能够检测晶片周边部分的成像单元的数量进行校正步骤（步骤230）。在通过所有摄像部不能检测到晶片周边部的情况下，通过各摄像部的输出图像的组合而获得的位置调整方向进行用于移动晶片的晶片位置调整步骤（步骤240）。

8. 发明授权

US08159653B2 Substrate position detection apparatus, and method of adjusting a position of an imaging component of the same 有权
标题翻译：基板位置检测装置以及调整其成像部件的位置的方法
公开(公告)号：US08159653B2
公开(公告)日：2012-04-17
申请号：US12523188
申请日：2008-02-12
申请人： Takehiro Shindo
发明人： Takehiro Shindo
IPC分类号： G03B27/58
CPC分类号： H01L21/67259
摘要： A method is disclosed for adjusting an arrangement of coordinates in an imaging area of an imaging component in a substrate imaging plane in a substrate position detection apparatus that detects a position of a substrate in accordance with an image taken of a circumferential portion of the substrate by the imaging component, the apparatus being arranged near a rotatable susceptor on which the substrate is placed and a substrate transferring apparatus prepared separately from the susceptor and configured to horizontally drive a supporting pin for transferring the substrate to and/or from the susceptor. This method includes supporting at a predetermined height above the susceptor by the supporting pin a mark-equipped wafer with a mark arranged corresponding to the circumferential portion of the substrate, bringing the mark into the imaging area, detecting the mark at plural points while horizontally moving the mark in one direction within the imaging area by a predetermined distance by horizontally driving the supporting pin, and calibrating an axis direction of the coordinates in accordance with a direction in which the plural points are arranged; and maintaining the mark-equipped wafer with a height adjustment jig at the predetermined height above the susceptor, bringing the mark into the imaging area, detecting the mark at plural points while moving the mark within the imaging area by a predetermined angle by rotating the susceptor, and calibrating an origin position of the coordinates in accordance with a rotation center obtained in accordance with the plural points.
摘要翻译：公开了一种用于调整基板位置检测装置中的基板成像平面中的成像部件的成像区域中的坐标的布置的方法，该基板位置检测装置根据通过基板的圆周部分拍摄的图像来检测基板的位置所述成像部件设置在其上放置有所述基板的旋转基座附近，以及基板传送装置，所述基板传送装置与所述基座分开设置并且被配置为水平地驱动用于将所述基板传送到所述基座和/或从所述基座传送的支撑销。该方法包括通过支撑销在基座上方的预定高度处支撑具有标记的晶片，该晶片具有对应于基板的圆周部分布置的标记，使标记进入成像区域，在水平移动的同时检测多个点处的标记通过水平驱动支撑销，在成像区域内的一个方向上的一个方向上的标记预定距离，并且根据布置多个点的方向来校准坐标的轴线方向; 并且将具有标记的晶片保持在基座上方的预定高度处，将标记保持在成像区域中，同时通过旋转基座来检测成像区域内的标记以预定角度移动多个点处的标记并且根据根据多个点获得的旋转中心来校准坐标的原点位置。

9. 发明申请

US20100030347A1 SUBSTRATE POSITION DETERMINING METHOD, SUBSTRATE POSITION DETECTING METHOD, AND SUBSTRATE COLLECTING METHOD 有权
标题翻译：基板位置确定方法，基板位置检测方法和基板收集方法
公开(公告)号：US20100030347A1
公开(公告)日：2010-02-04
申请号：US12439833
申请日：2007-08-20
申请人： Takehiro Shindo
发明人： Takehiro Shindo
IPC分类号： G05D3/12 , G01B11/14
CPC分类号： H01L21/67259
摘要： Even in case that a wafer is so greatly deviated that a peripheral portion of the wafer cannot be detected, position determination of the wafer can be performed without inflicting a damage on the wafer. The wafer peripheral portion, which is a target, is detected based on output images from a plurality of imaging units disposed along a peripheral portion shape of the wafer (step S210), and a wafer position deviation correcting step (step S220) or a rough correcting step (step 230) is performed according to the number of the imaging units capable of detecting the wafer peripheral portion. In case that the wafer peripheral portion cannot be detected by all the imaging units, a wafer position adjusting step (step 240) for moving the wafer is performed in a position adjusting direction acquired by a combination of the output images by each imaging unit.
摘要翻译：即使在晶片如此大的偏离使得不能检测晶片的周边部分的情况下，也可以进行晶片的位置确定而不会对晶片造成损坏。基于来自沿着晶片的周边部分形状设置的多个成像单元的输出图像（步骤S210）和晶片位置偏差校正步骤（步骤S220）或粗糙度（步骤S220），检测作为目标的晶片周边部分根据能够检测晶片周边部分的成像单元的数量进行校正步骤（步骤230）。在通过所有摄像部不能检测到晶片周边部的情况下，通过各摄像部的输出图像的组合而获得的位置调整方向进行用于移动晶片的晶片位置调整步骤（步骤240）。

10. 发明申请

US20090084403A1 SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE CLEANING METHOD, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM 审中-公开
标题翻译：基板清洗装置，基板处理装置，基板清洗方法，基板处理方法和储存介质
公开(公告)号：US20090084403A1
公开(公告)日：2009-04-02
申请号：US12235740
申请日：2008-09-23
申请人： Takehiro Shindo
发明人： Takehiro Shindo
IPC分类号： B08B1/00 , B08B11/02 , H01L21/67
CPC分类号： H01L21/67051 , H01L21/67069 , H01L21/6708 , H01L21/67207 , H01L21/68742 , H01L21/68764
摘要： A deposit adhered to a rear surface peripheral portion of a substrate is easily and reliably removed, and a cycle of maintenance such as an exchange or a cleaning of a member required for removing the deposit is extended. An outer peripheral surface of a first cleaning rotational body having a roughly cylindrical shape has an adhesive property, and is brought into contact with a substrate from its side surface to its rear surface peripheral portion. Further, an outer peripheral surface of a second cleaning rotational body, which has an adhesive property stronger than that of the outer peripheral surface of the first cleaning rotational body, is brought into contact with the outer peripheral surface of the first cleaning rotational body, and the substrate, the first cleaning rotational body and the second cleaning rotational body are integrally rotated.
摘要翻译：附着在基板的后表面周边部分的沉积物容易且可靠地移除，并且延长了用于除去沉积物所需的构件的更换或清洁的维护周期。具有大致圆筒形的第一清洁旋转体的外周面具有粘合性，并且从其侧表面到其后表面周边部分与基底接触。此外，具有比第一清洁旋转体的外周面更强的粘合性的第二清洁旋转体的外周面与第一清洁旋转体的外周面接触，基板，第一清洁旋转体和第二清洁旋转体一体地旋转。

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