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    • 4. 发明申请
    • METHOD FOR MANUFACTURING SOLAR CELL
    • 制造太阳能电池的方法
    • US20110306164A1
    • 2011-12-15
    • US12893944
    • 2010-09-29
    • Young Su KIMDoo-Youl LEE
    • Young Su KIMDoo-Youl LEE
    • H01L31/0352
    • H01L31/022441H01L31/0682H01L31/1804Y02E10/547Y02P70/521
    • A method for manufacturing a solar cell according to an exemplary embodiment includes: forming a first doping film on a substrate; patterning the first doping film so as to form a first doping film pattern and so as to expose a portion of the substrate; forming a diffusion prevention film on the first doping film pattern so as to cover the exposed portion of the substrate; etching the diffusion prevention film so as to form spacers on lateral surfaces of the first doping film pattern; forming a second doping film on the first doping film pattern so as to cover the spacer and exposed substrate; forming a first doping region on the substrate surface by diffusing an impurity from the first doping film pattern into the substrate; and forming a second doping region on the substrate surface by diffusing an impurity from the second doping film pattern into the substrate.
    • 根据示例性实施例的太阳能电池的制造方法包括:在基板上形成第一掺杂膜; 图案化第一掺杂膜以形成第一掺杂膜图案并且暴露基板的一部分; 在所述第一掺杂膜图案上形成扩散防止膜以覆盖所述基板的所述暴露部分; 蚀刻扩散防止膜,以在第一掺杂膜图案的侧表面上形成间隔物; 在所述第一掺杂膜图案上形成第二掺杂膜以覆盖所述间隔物和暴露的基板; 通过将杂质从第一掺杂膜图案扩散到衬底中而在衬底表面上形成第一掺杂区; 以及通过将杂质从所述第二掺杂膜图案扩散到所述衬底中而在所述衬底表面上形成第二掺杂区域。
    • 5. 发明申请
    • METHOD FOR MANUFACTURING SOLAR CELL
    • 制造太阳能电池的方法
    • US20120270365A1
    • 2012-10-25
    • US13540724
    • 2012-07-03
    • Young Su KIMDoo-Youl LEE
    • Young Su KIMDoo-Youl LEE
    • H01L31/18
    • H01L31/022441H01L31/0682H01L31/1804Y02E10/547Y02P70/521
    • A method for manufacturing a solar cell according to an exemplary embodiment includes: forming a first doping film on a substrate; patterning the first doping film so as to form a first doping film pattern and so as to expose a portion of the substrate; forming a diffusion prevention film on the first doping film pattern so as to cover the exposed portion of the substrate; etching the diffusion prevention film so as to form spacers on lateral surfaces of the first doping film pattern; forming a second doping film on the first doping film pattern so as to cover the spacer and exposed substrate; forming a first doping region on the substrate surface by diffusing an impurity from the first doping film pattern into the substrate; and forming a second doping region on the substrate surface by diffusing an impurity from the second doping film pattern into the substrate.
    • 根据示例性实施例的太阳能电池的制造方法包括:在基板上形成第一掺杂膜; 图案化第一掺杂膜以形成第一掺杂膜图案并且暴露基板的一部分; 在所述第一掺杂膜图案上形成扩散防止膜以覆盖所述基板的所述暴露部分; 蚀刻扩散防止膜,以在第一掺杂膜图案的侧表面上形成间隔物; 在所述第一掺杂膜图案上形成第二掺杂膜以覆盖所述间隔物和暴露的基板; 通过将杂质从第一掺杂膜图案扩散到衬底中而在衬底表面上形成第一掺杂区; 以及通过将杂质从所述第二掺杂膜图案扩散到所述衬底中而在所述衬底表面上形成第二掺杂区域。
    • 8. 发明申请
    • INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE WITH OVERLAY KEY AND ALIGNMENT KEY AND METHOD OF FABRICATING THE SAME
    • 具有覆盖键和对准的集成电路半导体器件及其制造方法
    • US20080203590A1
    • 2008-08-28
    • US12111651
    • 2008-04-29
    • Chang-Jin KANGMyeong-Cheol KIMMan-Hyoung RYOOSi-Hyeung LEEDoo-Youl LEE
    • Chang-Jin KANGMyeong-Cheol KIMMan-Hyoung RYOOSi-Hyeung LEEDoo-Youl LEE
    • H01L23/544
    • H01L23/544G03F7/70633G03F9/7076G03F9/708G03F9/7084H01L2223/54453H01L2924/0002H01L2924/00
    • An integrated circuit semiconductor device including a cell region formed in a first portion of a silicon substrate, the cell region including a first trench formed in the silicon substrate, a first buried insulating layer filled in the first trench, a first insulating pattern formed over the silicon substrate, and a first conductive pattern formed over the first insulating pattern. An overlay key region is formed in a second portion of the silicon substrate and includes a second trench formed in the silicon substrate, a second insulating pattern formed over the silicon substrate and used as an overlay key, and a second conductive pattern formed over the second insulating pattern and formed by correcting overlay and alignment errors using the second insulating pattern. An alignment key region is formed in a third portion of the silicon substrate and includes a third trench formed in the silicon substrate and used as an alignment key, a second buried insulating layer formed in the third trench, and a third conductive pattern formed over the second buried insulating layer and the third trench.
    • 一种集成电路半导体器件,包括形成在硅衬底的第一部分中的单元区域,所述单元区域包括形成在所述硅衬底中的第一沟槽,填充在所述第一沟槽中的第一掩埋绝缘层,形成在所述第一沟槽上的第一绝缘图案 硅衬底和形成在第一绝缘图案上的第一导电图案。 覆盖键区域形成在硅衬底的第二部分中,并且包括在硅衬底中形成的第二沟槽,形成在硅衬底上并用作覆盖键的第二绝缘图案,以及形成在第二衬底上的第二导电图案 绝缘图案,并且通过使用第二绝缘图案校正覆盖和对准误差而形成。 对准键区域形成在硅衬底的第三部分中,并且包括形成在硅衬底中并用作对准键的第三沟槽,形成在第三沟槽中的第二掩埋绝缘层和形成在第三沟槽上的第三导电图案 第二掩埋绝缘层和第三沟槽。