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1. 发明申请

US20140248809A1 FITTING TYPE CONNECTING TERMINAL AND METHOD FOR PRODUCING SAME 有权
标题翻译：连接型连接端子及其制造方法
公开(公告)号：US20140248809A1
公开(公告)日：2014-09-04
申请号：US14351586
申请日：2012-10-10
申请人： DOWA METALTECH CO., LTD , YAZAKI CORPORATION
发明人： Akifumi Onodera , Masatoshi Nakamura , Akira Sugawara , Hiroto Narieda
IPC分类号： H01R13/02 , H01R43/16
CPC分类号： H01R13/02 , H01R13/03 , H01R13/187 , H01R43/16 , Y10T29/49224
摘要： In a fitting type connecting terminal having male and female terminals, each of which has a tin plating layer formed on an electrically conductive base material, a surface of a contact portion of one of the male and female terminals with the other thereof has a plurality of grooves or recessed portions which are spaced from each other in longitudinal directions, and the grooves or recessed portions are formed so as to satisfy d≦b, d≦a≦L and a+c≦L assuming that the width of each of the grooves or recessed portions is a (μm), the depth thereof being b (μm), the distance between two of the grooves or recessed portions adjacent to each other in the longitudinal directions being c (μm), the sliding distance producible between the male terminal and the female terminal in a state that the male terminal is fitted into and fixed to the female terminal being L (μm), and the maximum grain size of the oxide of abrasion powder producible due to sliding between the male terminal and the female terminal being d (μm).
摘要翻译：在具有阳，阴端子的配合型连接端子中，每个具有形成在导电基材上的镀锡层，其中一个阳，阴端子的一个接触部分的表面与另一个具有多个凹槽或凹部在纵向上彼此间隔开，并且凹槽或凹部形成为满足d＆nlE; b，d＆nlE; a＆nlE; L和a + c＆nlE; L，假设每个凹槽的宽度或凹部为（μm），其深度为b（μm），在长度方向上彼此相邻的两个槽或凹部之间的距离为c（μm），在公端子之间产生的滑动距离并且在母端子嵌入并固定到母端子的状态下的母端子为L（μm），并且由于阳端子之间的滑动而可生产的磨损粉末的氧化物的最大晶粒尺寸女性终端为d（μm）。

2. 发明申请

US20190136398A1 TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20190136398A1
公开(公告)日：2019-05-09
申请号：US16099791
申请日：2017-04-18
申请人： DOWA METALTECH CO., LTD. , Yazaki Corporation
发明人： Hirotaka Kotani , Hiroto Narieda , Akira Sugawara , Yuta Sonoda , Yoshitaka Ito
IPC分类号： C25D5/50 , C25D3/30 , C25D5/12 , C25D7/00 , B32B15/01 , C22F1/16 , H01R13/03 , H01R43/16
摘要： After drying the surface of a tin plating layer having a thickness of 0.4 to 3 μm which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dm2 in a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.

3. 发明授权

US09614300B2 Electrical connector and manufacturing method thereof 有权
公开(公告)号：US09614300B2
公开(公告)日：2017-04-04
申请号：US14327073
申请日：2014-07-09
申请人： Yazaki Corporation , Dowa Metaltech Co., Ltd.
发明人： Masatoshi Nakamura , Akifumi Onodera , Akira Sugawara , Hiroto Narieda
IPC分类号： H01R13/11 , H01R13/24 , H01R4/48 , H01R13/20 , H01R43/16 , H01R13/05
CPC分类号： H01R4/48 , H01R13/05 , H01R13/11 , H01R13/113 , H01R13/114 , H01R13/20 , H01R13/2464 , H01R43/16 , Y10T29/49204 , Y10T29/49224
摘要： An electrical connector connecting a male connector and a female connector in a freely engageable and detachable manner, in which: a male tab is provided at the male connector; a housing part where the male tab is inserted is provided at the female connector; a spring state contact piece and a beat piece to sandwich the male tab are provided at the housing part; and a protrusion protruding toward the male tab inserted into the housing part is provided at least one of the contact piece and the beat piece, wherein the protrusion includes a contact part which is in contact with the male tab inserted into the housing part and a sidewall part which is provided at a periphery of the contact part, and the contact part has so-called a star-shape in a plan view.

4. 发明授权

US10829862B2 Tin-plated product and method for producing same 有权
公开(公告)号：US10829862B2
公开(公告)日：2020-11-10
申请号：US15122568
申请日：2015-02-25
申请人： DOWA METALTECH CO., LTD. , YAZAKI CORPORATION
发明人： Tatsunori Murata , Hirotaka Kotani , Hideki Endo , Akira Sugawara , Yuta Sonoda , Tetsuo Kato , Hideki Ohsumi , Jyun Toyoizumi
IPC分类号： C25D5/50 , B32B15/01 , C25D5/34 , C25D5/12 , C25D7/00 , C25D3/12 , C25D3/32 , C25D3/38 , C25F1/00
摘要： In a tin-plated product wherein a surface of a substrate 10 of copper or a copper alloy is plated with tin, an underlying layer 12 of at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate 10, and an outermost layer formed on the surface of the underlying layer 12 is composed of a copper-tin alloy layer 14 and tin layers 16, the copper-tin alloy 14 being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers 16 being arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layers 16 on the outermost surface being 20 to 80%, and the maximum thickness of the tin layers 16 being smaller than the average particle diameter of the crystal grains of the copper-tin alloy.

5. 发明申请

US20180080135A1 TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20180080135A1
公开(公告)日：2018-03-22
申请号：US15564538
申请日：2016-04-20
申请人： Dowa Metaltech Co., Ltd. , Yazaki Corporation
发明人： Hirotaka Kotani , Hiroto Narieda , Hideki Endo , Akira Sugawara , Yuta Sonoda , Takaya Kondo , Jyun Toyoizumi , Yuya Kishibata
IPC分类号： C25D3/60 , C25D5/10 , C25D5/12 , C25D3/30 , C25D3/12 , H01R13/03
摘要： There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 μm by electroplating, a tin-copper plating layer 12 containing tin 12b mixed with a copper-tin alloy 12a is formed thereon so as to have a thickness of 0.6 to 10 μm by electroplating using a tin-copper plating bath which contains 5 to 35% by weight of copper with respect to the total amount of tin and copper, and then, a tin layer 14 is formed thereon so as to have a thickness of 1 μm or less by electroplating if necessary.

6. 发明授权

US11078587B2 Tin-plated product and method for producing same 有权
公开(公告)号：US11078587B2
公开(公告)日：2021-08-03
申请号：US15752996
申请日：2016-08-23
申请人： Dowa Metaltech Co., Ltd. , Yazaki Corporation
发明人： Yuta Sonoda , Hiroto Narieda , Hideki Endo , Akira Sugawara , Hirotaka Kotani , Jyun Toyoizumi , Takaya Kondo , Yuya Kishibata
IPC分类号： B32B15/01 , C25D5/12 , H01R13/03 , C25D5/50 , H01R43/16 , C25D3/32 , C25D3/38 , C25D3/12
摘要： A tin-plated product contains: a substrate 10 of copper or a copper alloy; an underlying layer 12 of nickel which is formed on the surface of the substrate 10; and an outermost layer 14 containing tin, the outermost layer 14 being formed on the surface of the underlying layer 12, the outermost layer 14 being composed of a copper-tin alloy layer 14a of a large number of crystal grains of a copper-tin alloy, tin layers 14b of tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layers 14c of a copper-nickel-tin alloy, each of the tin layers 14b being formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layers 14c being arranged on the side of the underlying layer 12 in the copper-tin alloy layer 14a so as to be apart from each other.

7. 发明授权

US10982345B2 Tin-plated product and method for producing same 有权
公开(公告)号：US10982345B2
公开(公告)日：2021-04-20
申请号：US16099791
申请日：2017-04-18
申请人： DOWA METALTECH CO., LTD. , Yazaki Corporation
发明人： Hirotaka Kotani , Hiroto Narieda , Akira Sugawara , Yuta Sonoda , Yoshitaka Ito
IPC分类号： C25D5/50 , C25D5/12 , C25D7/00 , B32B15/01 , C22F1/16 , C25D3/30 , H01R13/03 , H01R43/16
摘要： After drying the surface of a tin plating layer having a thickness of 0.4 to 3 μm which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dm2 in a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.

8. 发明授权

US10676835B2 Tin-plated product and method for producing same 有权
公开(公告)号：US10676835B2
公开(公告)日：2020-06-09
申请号：US15564538
申请日：2016-04-20
申请人： Dowa Metaltech Co., Ltd. , Yazaki Corporation
发明人： Hirotaka Kotani , Hiroto Narieda , Hideki Endo , Akira Sugawara , Yuta Sonoda , Takaya Kondo , Jyun Toyoizumi , Yuya Kishibata
IPC分类号： B32B15/00 , C25D3/60 , C25D5/10 , C25D5/12 , H01R13/03 , C25D7/00 , C25D3/58 , C25D3/38 , C25D3/12 , C25D3/30
摘要： There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 μm by electroplating, a tin-copper plating layer 12 containing tin 12b mixed with a copper-tin alloy 12a is formed thereon so as to have a thickness of 0.6 to 10 μm by electroplating using a tin-copper plating bath which contains 5 to 35% by weight of copper with respect to the total amount of tin and copper, and then, a tin layer 14 is formed thereon so as to have a thickness of 1 μm or less by electroplating if necessary.

9. 发明申请

US20170088965A1 TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20170088965A1
公开(公告)日：2017-03-30
申请号：US15122568
申请日：2015-02-25
申请人： DOWA METALTECH CO., LTD. , YAZAKI CORPORATION
发明人： Tatsunori Murata , Hirotaka Kotani , Hideki Endo , Akira Sugawara , Yuta Sonoda , Tetsuo Kato , Hideki Ohsumi , Jyun Toyoizumi
IPC分类号： C25D5/12 , C25F1/00 , B32B15/01 , C25D3/38 , C25D3/32 , C25D5/50 , C25D5/34 , C25D3/12
摘要： In a tin-plated product wherein a surface of a substrate 10 of copper or a copper alloy is plated with tin, an underlying layer 12 of at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate 10, and an outermost layer formed on the surface of the underlying layer 12 is composed of a copper-tin alloy layer 14 and tin layers 16, the copper-tin alloy 14 being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers 16 being arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layers 16 on the outermost surface being 20 to 80%, and the maximum thickness of the tin layers 16 being smaller than the average particle diameter of the crystal grains of the copper-tin alloy.

10. 发明授权

US09318818B2 Electrical connector and manufacturing method thereof 有权
标题翻译：电连接器及其制造方法
公开(公告)号：US09318818B2
公开(公告)日：2016-04-19
申请号：US14327103
申请日：2014-07-09
申请人： Yazaki Corporation , Dowa Metaltech Co., Ltd.
发明人： Masatoshi Nakamura , Akifumi Onodera , Akira Sugawara , Hiroto Narieda , Tatsunori Murata
IPC分类号： H01R13/115 , H01R13/20 , H01R4/48 , H01R13/04 , H01R13/11 , H01R43/16
CPC分类号： H01R4/48 , H01R13/04 , H01R13/111 , H01R13/20 , H01R43/16 , Y10T29/49204
摘要： An electrical connector connecting a male connector and a female connector in a freely engageable and detachable manner includes, a male tab is provided at the male connector; a housing part where the male tab is inserted is provided at the female connector; a contact piece and a beat piece to hold and press the male tab to enable electrical connection are provided at the housing part; and a protrusion is provided at least at one of the contact piece and the beat piece, and a recessed part capable of accepting the protrusion is provided at the male tab, wherein the contact piece, the beat piece, and the protrusion are constituted to be one component.
摘要翻译：以可自由接合和可拆卸的方式连接阳连接器和母连接器的电连接器包括：阳连接器上设有阳突片; 在阴连接器处设置插入阳片的壳体部分; 在所述壳体部分设置有用于保持并按压所述阳接头以实现电连接的接触片和打片; 并且至少在所述接触片和所述节拍片之一上设置有突起，并且在所述阳片上设置有能够接受所述突起的凹部，其中，所述接触片，所述节拍片和所述突起构成为一个组件。

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