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1. 发明授权

US07767472B2 Substrate processing method and substrate processing apparatus 有权
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US07767472B2
公开(公告)日：2010-08-03
申请号：US11882398
申请日：2007-08-01
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： H01L21/00
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

2. 发明申请

US20060019417A1 Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20060019417A1
公开(公告)日：2006-01-26
申请号：US11187024
申请日：2005-07-22
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： H01L21/66 , H01L21/302
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

3. 发明申请

US20100255757A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：US20100255757A1
公开(公告)日：2010-10-07
申请号：US12819578
申请日：2010-06-21
申请人： Atsushi SHIGETA , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi SHIGETA , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： B24B49/10 , B24B49/16 , B24B21/12
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

4. 发明申请

US20070287364A1 Substrate processing method and substrate processing apparatus 有权
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20070287364A1
公开(公告)日：2007-12-13
申请号：US11882398
申请日：2007-08-01
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： B24B7/00 , B24B1/00
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

5. 发明授权

US5145780A Method of decomposing nucleic acids with a heat stable nuclease from Trichoderma or Fusarium 失效
标题翻译：用木霉属或镰孢属的热稳定核酸酶分解核酸的方法
公开(公告)号：US5145780A
公开(公告)日：1992-09-08
申请号：US807816
申请日：1991-12-16
申请人： Kunio Oishi , Shuichi Aoi
发明人： Kunio Oishi , Shuichi Aoi
IPC分类号： C12N9/22 , C12P19/34
CPC分类号： C12P19/34 , C12N9/22 , Y10S435/929 , Y10S435/945
摘要： An enzyme preparation is obtained containing a nuclease that is produced by a fungus such as Trichoderma, Aspergillus and Fusarium and which remains active even after heating at 100.degree. C. for 30 minutes. This enzyme preparation may be effectively used when it is necessary to decompose nucleic acids at elevated temperature over a prolonged period.
摘要翻译：得到含有由真菌如木霉属，曲霉属和镰刀菌属产生的核酸酶的酶制剂，即使在100℃下加热30分钟后仍保持活性。当需要在高温下长时间分解核酸时，可以有效地使用该酶制剂。

6. 发明授权

US4771121A Substance GIF-2 and process for production of the same 失效
标题翻译：物质GIF-2及其生产方法相同
公开(公告)号：US4771121A
公开(公告)日：1988-09-13
申请号：US807066
申请日：1985-11-27
申请人： Sachio Wakayama , Fumiyasu Ishikawa , Kunio Oishi
发明人： Sachio Wakayama , Fumiyasu Ishikawa , Kunio Oishi
IPC分类号： C12P21/04 , A61K35/74 , A61K38/00 , A61P31/04 , C07K7/54 , C07K7/56 , C07K14/005 , C07K14/195 , C07K14/41 , C12P1/04 , C12P21/00 , C12P21/02 , C12R1/085 , C12R1/85 , C07K5/12
CPC分类号： C12R1/07 , C07K7/56 , Y10S930/19 , Y10S930/27
摘要： A substance GIF-2 having bacteriostatic activities and a process for producing the same are disclosed.GIF-2 is produced by culturing bacteria capable of producing GIF-2 and belonging to genus Bacillus, and isolating GIF-2 from the culture medium. GIF-2 is presumed to have the following structure: ##STR1## wherein one of three X's is an amido bond and R is a .beta.-amino acid residue represented by the formula ##STR2##
摘要翻译： PCT No.PCT / JP85 / 00154 Sec。 371日期：1985年11月27日 102（e）日期1985年11月27日PCT 1985年3月29日PCT PCT。出版物WO85 / 04883 1985年11月7日，公开了具有抑菌活性的物质GIF-2及其制造方法。通过培养能够产生GIF-2并属于芽孢杆菌属的细菌并从培养基中分离GIF-2产生GIF-2。假设GIF-2具有以下结构：其中三个X中的一个是酰胺键，R是由式表示的β-氨基酸残基，

7. 发明授权

US4929548A Substance GIF-2 and process for production of the same 失效
标题翻译：物质GIF-2及其生产方法相同
公开(公告)号：US4929548A
公开(公告)日：1990-05-29
申请号：US128338
申请日：1987-12-02
申请人： Sachio Wakayama , Fumiyasu Ishikawa , Kunio Oishi
发明人： Sachio Wakayama , Fumiyasu Ishikawa , Kunio Oishi
IPC分类号： C07K7/56 , C12P21/02
CPC分类号： C12R1/07 , C07K7/56 , C12P21/02
摘要： A process for producing GIF-2, an antimicrobial peptide, by culturing Bacillus cereus, FERM BP-746, under conditions sufficient to produce GIF-2 and recovering GIF-2 from the culture medium.
摘要翻译：在足以产生GIF-2并从培养基中回收GIF-2的条件下通过培养蜡状芽孢杆菌FERM BP-746生产GIF-2的抗微生物肽的方法。

8. 发明授权

US08655472B2 Scheduler, substrate processing apparatus, and method of transferring substrates in substrate processing apparatus 有权
标题翻译：调度器，基板处理装置以及在基板处理装置中传送基板的方法
公开(公告)号：US08655472B2
公开(公告)日：2014-02-18
申请号：US13004208
申请日：2011-01-11
申请人： Ryuya Koizumi , Kunio Oishi , Yoichi Kobayashi
发明人： Ryuya Koizumi , Kunio Oishi , Yoichi Kobayashi
IPC分类号： G06F19/00 , G06Q10/06
CPC分类号： G06Q10/06 , G05B19/41865 , G05B2219/45031 , H01L21/67253 , H01L21/67276 , Y02P90/20
摘要： A scheduler generates not only normal substrate transferring schedules for substrates newly supplied to a substrate processing apparatus, but also substrate transferring schedules for keeping a high production quantity in the event of a failure. The scheduler is used in a substrate processing apparatus including a plurality of substrate processing sections for processing substrates, a transfer device for transferring the substrates, and a controller for controlling the substrate processing units to process the substrates and controlling the transfer device to transfer the substrates. The scheduler is incorporated in the controller for calculating a substrate transferring schedule and has a function to successively calculate substrate transferring schedules for substrates which are newly supplied to the substrate processing apparatus, and, in the event of a fault occurring in the substrate processing apparatus, to recalculate the substrate transferring schedules with an initial state represented by a state including the fault.
摘要翻译：调度器不仅产生新提供给基板处理装置的基板的正常的基板转印时间表，而且生成在发生故障的情况下保持高生产量的基板转印时间表。调度器用于包括用于处理衬底的多个衬底处理部分，用于转移衬底的转移装置和用于控制衬底处理单元以处理衬底并控制转移装置以转移衬底的衬底处理装置。调度器被结合在控制器中用于计算衬底传送时间表，并且具有连续地计算新提供给衬底处理设备的衬底的衬底传送时间表的功能，并且在衬底处理设备中发生故障的情况下，重新计算由包括故障的状态表示的初始状态的基板传送调度。

9. 发明授权

US08078306B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08078306B2
公开(公告)日：2011-12-13
申请号：US12289507
申请日：2008-10-29
申请人： Hidetaka Nakao , Eisaku Hayashi , Kunio Oishi , Isao Hayakawa , Yoshiaki Miyake , Yoshikuni Tateyama , Takeshi Ashihara
发明人： Hidetaka Nakao , Eisaku Hayashi , Kunio Oishi , Isao Hayakawa , Yoshiaki Miyake , Yoshikuni Tateyama , Takeshi Ashihara
IPC分类号： G06F19/00
CPC分类号： B24B37/013 , B24B49/16
摘要： An apparatus polishes an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.
摘要翻译：一种装置在基板上抛光诸如膜之类的物体材料。该设备包括：用于保持具有抛光表面的抛光垫的抛光台，构造成驱动抛光台的电机;保持机构，其构造成保持具有待抛光物体的基板，并将基板压靠在抛光表面上; 修整器，其被配置为修整抛光表面;以及监视单元，被配置为监视对象材料的移除量。监视单元可操作以使用包含表示电机的转矩电流的积分值的变量的模型方程来计算物体材料的去除量，以及表示修整器的累积操作时间的变量。

10. 发明申请

US20090111358A1 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US20090111358A1
公开(公告)日：2009-04-30
申请号：US12289507
申请日：2008-10-29
申请人： Hidetaka Nakao , Eisaku Hayashi , Kunio Oishi , Isao Hayakawa , Yoshiaki Miyake , Yoshikuni Tateyama , Takeshi Ashihara
发明人： Hidetaka Nakao , Eisaku Hayashi , Kunio Oishi , Isao Hayakawa , Yoshiaki Miyake , Yoshikuni Tateyama , Takeshi Ashihara
IPC分类号： B24B49/00 , B24B49/16 , B24B7/20
CPC分类号： B24B37/013 , B24B49/16
摘要： The present invention provides a apparatus for polishing an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.
摘要翻译：本发明提供一种用于在基板上研磨诸如膜的物体材料的装置。该设备包括：用于保持具有抛光表面的抛光垫的抛光台，构造成驱动抛光台的电机;保持机构，其构造成保持具有待抛光物体的基板，并将基板压靠在抛光表面上; 修整器，其被配置为修整抛光表面;以及监视单元，被配置为监视对象材料的移除量。监视单元可操作以使用包含表示电机的转矩电流的积分值的变量的模型方程来计算物体材料的去除量，以及表示修整器的累积操作时间的变量。

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