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    • 1. 发明授权
    • Laser welding apparatus and method
    • 激光焊接设备及方法
    • US08796582B2
    • 2014-08-05
    • US11348552
    • 2006-02-07
    • Hitoshi KawaiYuji HamaguchiTatsuya Sakurai
    • Hitoshi KawaiYuji HamaguchiTatsuya Sakurai
    • B23K26/00G02B7/02
    • B23K26/0884B23K26/046B23K26/073B23K26/082
    • A laser welding apparatus includes a laser welding unit including a first lens adapted to focus a laser beam; a second lens adapted to diffuse the laser beam to the first lens; and a third lens adapted to guide the laser beam to the second lens. The relative positions of the first lens, the second lens, and the third lens, are adjusted to adjust a diffusion angle and a beam width of the laser beam entering the first lens. The laser welding apparatus performs: actuating the laser welding unit to travel at a predetermined speed along a predetermined trajectory; directing the laser beam at a first welding spot; adjusting the focal length to focus the laser beam at the first welding spot; holding the laser focal spot size substantially constant; and directing the laser beam at a second welding spot after completion of welding for the first welding spot.
    • 激光焊接装置包括激光焊接单元,其包括适于聚焦激光束的第一透镜; 第二透镜,适于将激光束扩散到第一透镜; 以及适于将激光束引导到第二透镜的第三透镜。 调整第一透镜,第二透镜和第三透镜的相对位置,以调节进入第一透镜的激光束的扩散角和光束宽度。 该激光焊接装置执行以下步骤:致动激光焊接单元沿预定轨迹以预定速度行进; 将激光束引导到第一焊接点; 调整焦距以将激光束聚焦在第一焊接点处; 保持激光焦点尺寸基本恒定; 以及在第一焊接点的焊接完成之后将激光束引导到第二焊接点。
    • 2. 发明申请
    • LASER CUTTING METHOD
    • 激光切割方法
    • US20130146573A1
    • 2013-06-13
    • US13818228
    • 2011-10-14
    • Yuji Hamaguchi
    • Yuji Hamaguchi
    • B23K26/06
    • B23K26/06B23K26/046B23K26/064B23K26/14B23K26/1476B23K26/38B23K26/382B23K26/40B23K2103/16H01M2/30H01M10/04H01M10/058
    • The laser cutting method for cutting a pair of plate materials, each of which has a different thickness and melting point, by irradiating them with a laser is provided with a plate material placement process for placing the pair of plate materials side by side so that, out of the pair of plate materials, an opposite surface of a laser irradiated surface of a plate material with a lower melting point protrudes more than an opposite surface of a laser irradiated surface of a plate material with a higher melting point, a focus adjustment process for aligning a focus position of the laser with an undersurface opposite the laser irradiated surface of the plate material with a higher melting point out of the pair of plate materials, and a plate material cutting process for cutting the pair of plate materials through irradiation with the laser according to a series of operations while sustaining a focus position of the laser to the pair of plate materials.
    • 提供了通过用激光照射切割具有不同厚度和熔点的一对板材的激光切割方法,该平板材料放置方法并排放置该对板材, 在一对板材中,具有较低熔点的板材的激光照射表面的相对表面比具有较高熔点的板材的激光照射表面的相反表面突出,聚焦调整过程 用于使所述激光的焦点位置与所述一对板材中具有较高熔点的与所述板材的激光照射表面相对的下表面对准,以及用于通过照射所述一对板材切割所述一对板材的板材切割工艺 激光器根据一系列操作,同时将激光器的聚焦位置维持在该对板材料上。
    • 4. 发明授权
    • Laser cutting method
    • 激光切割方法
    • US09168611B2
    • 2015-10-27
    • US13818228
    • 2011-10-14
    • Yuji Hamaguchi
    • Yuji Hamaguchi
    • B23K26/06B23K26/14H01M2/30B23K26/40H01M10/04B23K26/04B23K26/38H01M10/058
    • B23K26/06B23K26/046B23K26/064B23K26/14B23K26/1476B23K26/38B23K26/382B23K26/40B23K2103/16H01M2/30H01M10/04H01M10/058
    • The laser cutting method for cutting a pair of plate materials, each of which has a different thickness and melting point, by irradiating them with a laser is provided with a plate material placement process for placing the pair of plate materials side by side so that, out of the pair of plate materials, an opposite surface of a laser irradiated surface of a plate material with a lower melting point protrudes more than an opposite surface of a laser irradiated surface of a plate material with a higher melting point, a focus adjustment process for aligning a focus position of the laser with an undersurface opposite the laser irradiated surface of the plate material with a higher melting point out of the pair of plate materials, and a plate material cutting process for cutting the pair of plate materials through irradiation with the laser according to a series of operations while sustaining a focus position of the laser to the pair of plate materials.
    • 提供了通过用激光照射切割具有不同厚度和熔点的一对板材的激光切割方法,该平板材料放置方法并排放置该对板材, 在一对板材中,具有较低熔点的板材的激光照射表面的相对表面比具有较高熔点的板材的激光照射表面的相反表面突出,聚焦调整过程 用于使所述激光的焦点位置与所述一对板材中具有较高熔点的与所述板材的激光照射表面相对的下表面对准,以及用于通过照射所述一对板材切割所述一对板材的板材切割工艺 激光器根据一系列操作,同时将激光器的聚焦位置维持在该对板材料上。
    • 7. 发明申请
    • Laser welding apparatus and method
    • 激光焊接设备及方法
    • US20070193984A1
    • 2007-08-23
    • US11348552
    • 2006-02-07
    • Hitoshi KawaiYuji HamaguchiTatsuya Sakurai
    • Hitoshi KawaiYuji HamaguchiTatsuya Sakurai
    • B23K26/20B23K26/06B23K26/08
    • B23K26/0884B23K26/046B23K26/073B23K26/082
    • A laser welding apparatus includes a laser welding unit including a first lens adapted to focus a laser beam; a second lens adapted to diffuse the laser beam to the first lens; and a third lens adapted to guide the laser beam to the second lens. The relative positions of the first lens, the second lens, and the third lens, are adjusted to adjust a diffusion angle and a beam width of the laser beam entering the first lens. The laser welding apparatus performs: actuating the laser welding unit to travel at a predetermined speed along a predetermined trajectory; directing the laser beam at a first welding spot; adjusting the focal length to focus the laser beam at the first welding spot; holding the laser focal spot size substantially constant; and directing the laser beam at a second welding spot after completion of welding for the first welding spot.
    • 激光焊接装置包括激光焊接单元,其包括适于聚焦激光束的第一透镜; 第二透镜,适于将激光束扩散到第一透镜; 以及适于将激光束引导到第二透镜的第三透镜。 调整第一透镜,第二透镜和第三透镜的相对位置,以调节进入第一透镜的激光束的扩散角和光束宽度。 该激光焊接装置执行以下步骤:致动激光焊接单元沿预定轨迹以预定速度行进; 将激光束引导到第一焊接点; 调整焦距以将激光束聚焦在第一焊接点处; 保持激光焦点尺寸基本恒定; 以及在第一焊接点的焊接完成之后将激光束引导到第二焊接点。