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1. 发明授权

US07663886B2 Electric circuit device and the manufacturing method 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US07663886B2
公开(公告)日：2010-02-16
申请号：US12003037
申请日：2007-12-19
申请人： Kazuo Aoki , Junji Tsuruoka , Seiji Yasui , Yasushi Kabata , Shin Soyano
发明人： Kazuo Aoki , Junji Tsuruoka , Seiji Yasui , Yasushi Kabata , Shin Soyano
IPC分类号： H05K7/20 , H01L23/02
CPC分类号： H05K1/144 , H01L23/24 , H01L24/40 , H01L25/072 , H01L25/162 , H01L25/18 , H01L2224/40137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H05K3/0061 , H05K3/284 , H05K2201/042 , H05K2201/10924 , H05K2201/2018 , Y10T29/49126 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.
摘要翻译：电子电路装置包括形成有主电路的下侧基板; 形成有驱动控制主电路的驱动控制电路的上侧基板; 以硬化状态的树脂位于下侧基板的上方固定的支撑体; 以及壳体，具有外周面，外周面具有至少一部分驱动控制电路的外部引出端子和主电路，以及基板收纳空间，其在下侧容纳下侧基板从周边部分向内。

2. 发明申请

US20080290506A1 Semiconductor module and inverter device 有权
标题翻译：半导体模块和逆变器
公开(公告)号：US20080290506A1
公开(公告)日：2008-11-27
申请号：US12078164
申请日：2008-03-27
申请人： Kazuo Aoki , Junji Tsuruoka , Seiji Yasui
发明人： Kazuo Aoki , Junji Tsuruoka , Seiji Yasui
IPC分类号： H01L23/34
CPC分类号： H02M7/003 , H01L23/473 , H01L24/73 , H01L25/072 , H01L25/16 , H01L2224/291 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate.
摘要翻译：半导体模块包括基板; 放置在所述基板的一个表面上的多个基板，所述多个基板的每个基板包括开关元件，二极管元件和连接端子区域; 以及平行流动形成装置，其形成平行的冷却剂流动路径，其设置成与所述基板的另一个表面接触。

3. 发明授权

US07433187B2 Heat spreader module 有权
标题翻译：散热器模块
公开(公告)号：US07433187B2
公开(公告)日：2008-10-07
申请号：US10807674
申请日：2004-03-24
申请人： Takahiro Ishikawa , Masayuki Shinkai , Makoto Miyahara , Shuhei Ishikawa , Nobuaki Nakayama , Seiji Yasui
发明人： Takahiro Ishikawa , Masayuki Shinkai , Makoto Miyahara , Shuhei Ishikawa , Nobuaki Nakayama , Seiji Yasui
IPC分类号： H05K7/20
CPC分类号： C04B37/026 , B23K35/3006 , B32B2311/12 , C04B35/08 , C04B35/52 , C04B35/522 , C04B35/565 , C04B2235/407 , C04B2235/80 , C04B2235/96 , C04B2235/9607 , C04B2237/125 , C04B2237/34 , C04B2237/343 , C04B2237/36 , C04B2237/363 , C04B2237/365 , C04B2237/368 , C04B2237/407 , H01L21/4882 , H01L23/3735 , H01L2924/0002 , Y10T428/12493 , H01L2924/00
摘要： A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 μm when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 μg/cm2.
摘要翻译：散热器模块具有基座，通过第一主动硬钎焊材料接合到基座的散热构件，通过第二主动硬钎焊材料连接到散热构件的中间层，通过第二主动硬钎焊材料接合到中间层的绝缘板第三活性硬钎料，以及通过第四活性硬钎焊材料与绝缘板接合的电路板。供给第一至第四活性硬钎焊材料，使得当散热器组件的组件在压力下接合在一起时，活性硬钎焊材料的厚度范围为3-20μm，并且含有活性元素的量为 400至1000杯/厘米2。

4. 发明授权

US06933531B1 Heat sink material and method of manufacturing the heat sink material 失效
标题翻译：散热材料及散热材料的制造方法
公开(公告)号：US06933531B1
公开(公告)日：2005-08-23
申请号：US09913353
申请日：2000-12-22
申请人： Shuhei Ishikawa , Tsutomu Mitsui , Ken Suzuki , Nobuaki Nakayama , Hiroyuki Takeuchi , Seiji Yasui
发明人： Shuhei Ishikawa , Tsutomu Mitsui , Ken Suzuki , Nobuaki Nakayama , Hiroyuki Takeuchi , Seiji Yasui
IPC分类号： B22F3/14 , C04B35/52 , C04B35/565 , C04B35/65 , C04B35/653 , C04B38/06 , C04B41/45 , C04B41/88 , C22C1/10 , C22C29/00 , H01L21/48 , H01L23/373 , H01L23/12
CPC分类号： C04B41/009 , B22F3/14 , C04B35/522 , C04B35/565 , C04B35/65 , C04B35/653 , C04B38/0615 , C04B41/4523 , C04B41/88 , C04B2111/00844 , C04B2235/3817 , C04B2235/40 , C04B2235/402 , C04B2235/404 , C04B2235/407 , C04B2235/425 , C04B2235/5427 , C04B2235/5436 , C04B2235/77 , C04B2235/80 , C04B2235/96 , C04B2235/9607 , C22C1/1036 , C22C29/00 , C22C2001/1073 , H01L21/4871 , H01L23/373 , H01L23/3733 , H01L2924/0002 , Y10T428/249957 , Y10T428/249967 , Y10T428/30 , C04B35/52 , C04B38/0051 , C04B38/0058 , C04B38/0074 , C04B41/5127 , C04B41/5155 , C04B41/5116 , C04B38/00 , H01L2924/00
摘要： Graphite is placed in a case, and the case is set in a furnace. The interior of the furnace is subjected to sintering to produce a porous sintered member of graphite. After that, the case with the porous sintered member therein is taken out of the furnace, and is set in a recess of a press machine. Subsequently, molten metal of metal is poured into the case, and then a punch is inserted into the recess to forcibly press the molten metal in the case downwardly. Open pores of the porous sintered member are infiltrated with the molten metal of the metal by the pressing treatment with the punch.
摘要翻译：将石墨放置在壳体中，并将壳体放置在炉中。对炉内进行烧结，制成石墨的多孔烧结体。之后，将其中的多孔烧结构件的壳体从炉中取出，并设置在冲压机的凹部中。随后，将金属熔融金属倒入壳体中，然后将冲头插入凹槽中以将壳体中的熔融金属强制地向下压。多孔烧结体的开孔通过用冲头的压制处理与金属的熔融金属渗透。

5. 发明授权

US5238147A Method of metering molding compound and a metering system for carrying out the same 失效
标题翻译：测量成型化合物的方法和实施该方法的计量系统
公开(公告)号：US5238147A
公开(公告)日：1993-08-24
申请号：US940990
申请日：1992-09-04
申请人： Seiji Yasui , Masanobu Kurumaji
发明人： Seiji Yasui , Masanobu Kurumaji
IPC分类号： B29C45/17 , B29C45/18 , B29C45/53 , B29C45/82
CPC分类号： B29C45/53 , B29C45/1808 , B29C45/82
摘要： A molding compound metering system meters a molding compound in supplying the molding compound from a molding compound stocker into the injection chamber of an injection barrel by detecting the backward stroke of the injection plunger of an injection cylinder, axially slidably fitted in the injection chamber and detecting the pressure of the molding compound in the injection chamber of the injection barrel. When the injection plunger is moved backward by the pressure of the molding compound supplied into the injection chamber, the discharge of the working fluid from the back working chamber of the injection cylinder is regulated to apply back pressure to the injection plunger by an adjustable-pressure relief valve, and a regulated pressure is applied to the front working chamber of the injection cylinder. Thus, the adjustable-pressure relief valve is able to regulate the back pressure in a relatively high pressure range and, consequently, the back pressure can be accurately regulated to enhance the reliability of the metering operation.
摘要翻译：成型复合计量系统通过检测注射缸的注射柱塞的向后冲程，将成型化合物从模制复合储料器供应到注射筒的注射室中，测量模制化合物，其轴向可滑动地装配在注射室中并检测注射筒的注射室中的模塑料的压力。当注射柱塞通过供给到注射室的模塑料的压力向后移动时，调节来自注射缸的后部工作室的工作流体的排放，以通过可调压力向注射柱塞施加反压力安全阀，并且调节压力施加到注射缸的前工作室。因此，可调压力释放阀能够在相对高的压力范围内调节背压，因此可以精确地调整背压以提高计量操作的可靠性。

6. 发明授权

US07760503B2 Semiconductor module and inverter device 有权
标题翻译：半导体模块和逆变器
公开(公告)号：US07760503B2
公开(公告)日：2010-07-20
申请号：US12078167
申请日：2008-03-27
申请人： Kazuo Aoki , Junji Tsuruoka , Seiji Yasui
发明人： Kazuo Aoki , Junji Tsuruoka , Seiji Yasui
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L23/473 , H01L25/072 , H01L25/16 , H01L2224/291 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/014 , H01L2924/00
摘要： A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate. The coolant flow paths are formed such that coolant flows in a coolant flow direction.
摘要翻译：半导体模块包括基板; 放置在所述基板的一个表面上的多个基板，所述多个基板的每个基板包括开关元件，二极管元件和连接端子区域; 以及平行流动形成装置，其形成平行的冷却剂流动路径，其设置成与所述基板的另一个表面接触。冷却剂流动路径形成为使得冷却剂沿冷却剂流动方向流动。

7. 发明申请

US20080291710A1 Semiconductor module and inverter device 有权
标题翻译：半导体模块和逆变器
公开(公告)号：US20080291710A1
公开(公告)日：2008-11-27
申请号：US12078162
申请日：2008-03-27
申请人： Kazuo Aoki , Junji Tsuruoka , Seiji Yasui
发明人： Kazuo Aoki , Junji Tsuruoka , Seiji Yasui
IPC分类号： H02M7/537 , H05K7/20
CPC分类号： H02M7/003 , H01L23/473 , H01L24/73 , H01L25/072 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/3011 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other.
摘要翻译：半导体模块包括基板; 放置在所述基板的一个表面上的多个基板，所述多个基板的每个基板包括开关元件，二极管元件和连接端子区域; 以及平行流动形成装置，其形成平行的冷却剂流动路径，其设置成与另一个流体接触。

8. 发明申请

US20080179972A1 Heat generating member cooling structure and drive unit 有权
标题翻译：发热件冷却结构和驱动单元
公开(公告)号：US20080179972A1
公开(公告)日：2008-07-31
申请号：US12010168
申请日：2008-01-22
申请人： Kazuo Aoki , Junji Tsuruoka , Seiji Yasui , Yasushi Kabata , Hideyuki Miyahara , Masaharu Kumagai
发明人： Kazuo Aoki , Junji Tsuruoka , Seiji Yasui , Yasushi Kabata , Hideyuki Miyahara , Masaharu Kumagai
IPC分类号： H02K9/00 , F28D15/00
CPC分类号： H05K7/20927 , H01L21/4878 , H01L23/473 , H01L2924/0002 , H02K5/20 , H02K9/19 , H02K11/33 , H01L2924/00
摘要： A heat generating member cooling structure in which a coolant space is formed between a heat releasing surface that is thermally connected to a heat generating member and an opposing surface that is positioned opposite the heat releasing surface, includes a plurality of heat releasing fins that are provided within the coolant space so as to be parallel to one another and stand from the heat releasing surface toward the opposing surface, and an inter-fin passage, through which a coolant flows, formed between every two of the plurality of heat releasing fins that are positioned adjacent to each other.
摘要翻译：一种发热元件冷却结构，其中在与热发生元件热连接的散热表面和与放热表面相对的相对表面之间形成冷却剂空间，包括多个散热片，在冷却剂空间内彼此平行并且从散热表面朝向相对表面，并且在多个散热片中的每两个之间形成冷却剂流过的翅片间通道，彼此相邻定位。

9. 发明申请

US20130113120A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件的半导体器件和制造方法
公开(公告)号：US20130113120A1
公开(公告)日：2013-05-09
申请号：US13646151
申请日：2012-10-05
申请人： Junji TSURUOKA , Seiji YASUI , Osamu YAMATO , Takayuki MAEDA
发明人： Junji TSURUOKA , Seiji YASUI , Osamu YAMATO , Takayuki MAEDA
IPC分类号： H01L23/52 , H01L21/58
CPC分类号： H01L24/40 , H01L23/24 , H01L23/3107 , H01L23/36 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/40095 , H01L2224/40137 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor device includes a metal substrate; a semiconductor element placed on the metal substrate; a flexible circuit substrate that has one end placed on the metal substrate and is electrically connected to the semiconductor element, the flexible circuit substrate extending over an edge of the metal substrate to outside the metal substrate; a resin wall portion placed, in an outer periphery of the metal substrate, at least at the edge of the metal substrate over which the flexible circuit substrate extends, the resin wall portion being provided on the flexible circuit substrate at the edge; and a resin seal portion provided inside the resin wall portion so as to cover the metal substrate.
摘要翻译：半导体器件包括金属基板; 放置在金属基板上的半导体元件; 柔性电路基板，其一端放置在所述金属基板上，并且电连接到所述半导体元件，所述柔性电路基板在所述金属基板的边缘上延伸到所述金属基板的外部; 在所述金属基板的外周至少在所述柔性电路基板所延伸的所述金属基板的边缘处设置树脂壁部，所述树脂壁部设置在所述柔性电路基板的所述边缘处; 以及设置在树脂壁部内部以覆盖金属基板的树脂密封部。

10. 发明申请

US20120118635A1 CONNECTION TERMINAL AND CIRCUIT COMPONENT 审中-公开
标题翻译：连接终端和电路组件
公开(公告)号：US20120118635A1
公开(公告)日：2012-05-17
申请号：US13282764
申请日：2011-10-27
申请人： Junji TSURUOKA , Seiji YASUI
发明人： Junji TSURUOKA , Seiji YASUI
IPC分类号： H01R4/02
CPC分类号： H01R13/02 , H01L23/492 , H01L2924/0002 , H01L2924/00
摘要： A conductive connection terminal having a planar joining surface joined to a joining target surface by a soldering material interposed between the joining surface and the joining target surface. The conductive connection terminal is configured such that, on either side across a predetermined reference straight line which, as well as passing through a center of gravity of the joining surface, extends along the joining surface, the joining surface includes indented portions indented from outer edge portions of the joining surface toward the reference straight line side.
摘要翻译：一种导电连接端子，其具有通过插入在接合表面和接合目标表面之间的焊接材料接合到接合目标表面的平面接合表面。导电连接端子被构造成使得在穿过连接表面的重心的预定参考直线的任一侧上沿着接合表面延伸，接合表面包括从外边缘缩进的凹陷部分接合面朝向基准直线侧的部分。

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