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1. 发明授权

US5806126A Apparatus for a brush assembly 失效
标题翻译：刷组件装置
公开(公告)号：US5806126A
公开(公告)日：1998-09-15
申请号：US932292
申请日：1997-09-17
申请人： John Martin de Larios , Mikhail Ravkin , Douglas Grant Gardner
发明人： John Martin de Larios , Mikhail Ravkin , Douglas Grant Gardner
IPC分类号： A46B11/06 , B08B1/04 , B08B3/08 , H01L21/00 , H01L21/306 , H01L21/311 , B08B7/00
CPC分类号： H01L21/02052 , A46B11/06 , B08B1/007 , B08B1/04 , B08B3/08 , H01L21/31111 , H01L21/67046 , Y10S134/902
摘要： A Method and Apparatus for Chemical Delivery Through the Brush used in semiconductor substrate cleaning processes. The chemical solutions are delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the substrate. This delivery system applies the chemical solutions uniformly to the semiconductor substrate, reduces the volumes of chemical solutions used in a scrubbing process, and helps maintain control of the pH profile of a substrate. This system is described and illustrated in the manner it is used in conjunction with a scrubber that scrubs both sides of a semiconductor substrate.
摘要翻译：用于化学输送的方法和装置通过用于半导体衬底清洁工艺中的刷子。化学溶液被递送到刷子的芯部，其中溶液被刷子吸收，然后通过刷子施加到基底上。该递送系统将化学溶液均匀地施加到半导体衬底，减少了在洗涤过程中使用的化学溶液的体积，并且有助于维持对衬底pH分布的控制。该系统以与擦洗半导体衬底的两侧的洗涤器结合使用的方式进行描述和说明。

2. 发明授权

US06616772B2 Methods for wafer proximity cleaning and drying 有权
标题翻译：晶圆接近清洗和干燥方法
公开(公告)号：US06616772B2
公开(公告)日：2003-09-09
申请号：US10309641
申请日：2002-12-03
申请人： John Martin de Larios , Mike Ravkin , Glen Travis , Jim Keller , Wilbur Krusell
发明人： John Martin de Larios , Mike Ravkin , Glen Travis , Jim Keller , Wilbur Krusell
IPC分类号： B08B300
CPC分类号： H01L21/67051 , B08B3/04 , H01L21/67028 , H01L21/67034 , Y10S134/902
摘要： A method for preparing a semiconductor wafer surface is provided which includes providing a plurality of source inlets and a plurality of source outlets and applying isopropyl alcohol (IPA) vapor gas through the plurality of source inlets to the wafer surface when the plurality of source inlets and outlets are in close proximity to the wafer surface. The method also includes applying a fluid through the plurality of source inlets to the wafer surface while applying the IPA vapor gas, and removing the applied IPA vapor gas and fluid from the wafer surface through the plurality of source outlets.
摘要翻译：提供了一种制备半导体晶片表面的方法，其包括提供多个源入口和多个源出口，并且当多个源入口和出口靠近晶片表面。该方法还包括在施加IPA蒸汽气体的同时将流体通过多个源入口施加到晶片表面，以及通过多个源出口从晶片表面去除所施加的IPA蒸汽气体和流体。

3. 发明授权

US06488040B1 Capillary proximity heads for single wafer cleaning and drying 有权
标题翻译：用于单片清洁和干燥的毛细管接近头
公开(公告)号：US06488040B1
公开(公告)日：2002-12-03
申请号：US09608244
申请日：2000-06-30
申请人： John Martin de Larios , Mike Ravkin , Glen Travis , Jim Keller , Wilbur Krusell
发明人： John Martin de Larios , Mike Ravkin , Glen Travis , Jim Keller , Wilbur Krusell
IPC分类号： B08B300
CPC分类号： H01L21/67051 , B08B3/04 , H01L21/67028 , H01L21/67034 , Y10S134/902
摘要： A wafer cleaner and dryer to be used in wafer manufacturing operations is provided. The wafer cleaner and dryer has a proximity head which moves toward a wafer surface to complete either a cleaning or a drying operation. The proximity head includes a plurality of source inlets where the plurality of source inlets generates a first pressure on a fluid film present on the wafer surface when the proximity head is in a first position that is close to the wafer surface. The proximity head also contains a plurality of source outlets which introduces a second pressure on the fluid film present on the wafer surface when the proximity head is in the first position. The first pressure generated by the plurality of source inlets is greater than the second pressure created by the plurality of source outlets so as to create a pressure difference where the pressure difference causes removal of the fluid film from the wafer surface.
摘要翻译：提供了用于晶片制造操作的晶片清洁器和干燥器。晶片清洁器和干燥器具有朝向晶片表面移动以完成清洁或干燥操作的接近头。邻近头部包括多个源入口，其中当邻近头处于靠近晶片表面的第一位置时，多个源入口在存在于晶片表面上的流体膜上产生第一压力。邻近头还包含多个源极出口，当邻近头处于第一位置时，该出口在晶片表面上存在的流体膜上引入第二压力。由多个源入口产生的第一压力大于由多个源出口产生的第二压力，从而产生压力差，其中压力差导致流体膜从晶片表面移除。

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