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    • 8. 发明公开
    • 전계방출형 표시장치용 전극 형성 조성물 및 이러한조성물의 사용 방법
    • 感光铜导电组合物,使用组合物和真空微电子器件的FED装置的栅极电极的形成或构成方法以及包含电极的照明装置以获得高分辨率和必要的电导率
    • KR1020040073991A
    • 2004-08-21
    • KR1020040009515
    • 2004-02-13
    • 이 아이 듀폰 디 네모아 앤드 캄파니
    • 하야까와,게이이찌로
    • H01B1/02
    • G03F7/0047H01J9/025Y10S430/101Y10S430/102Y10S430/145Y10S430/146Y10S430/151
    • PURPOSE: A photosensitive copper conductive composition, a method for forming or constituting the electrode of a field emission display device by using the composition, and a vacuum microelectronic device and a lighting device containing the electrode prepared by the method are provided, to obtain a thick film conductor having a low resistivity of 100 μ¥Ø or less at a sintering temperature of 450-600 deg.C relatively easily, a high resolution and a good adhesive strength. CONSTITUTION: The photosensitive copper conductive composition comprises a mixture comprising 70 wt% or more of a copper powder having a particle size of 0.2-3 micrometers based on 100 wt% of a copper powder and 1-40 wt% of an inorganic binder having a softening point of 380-580 deg.C based on 100 wt% of a copper powder, wherein the mixture is dispersed in an organic diluent comprising an organic polymer binder, a photoinitiator, a radiation curable monomer and an organic solvent. The composition can be sintered at a temperature of 450-600 deg.C under reductive condition.
    • 目的:提供一种光敏铜导电组合物,通过使用该组合物形成或构成场发射显示装置的电极的方法,以及真空微电子器件和含有通过该方法制备的电极的照明装置,以获得厚的 薄膜导体在450-600℃的烧结温度下具有100μΩØ以下的低电阻率,相对容易,高分辨率和良好的粘合强度。 构成:光敏铜导电组合物包含基于100重量%的铜粉末和70重量%以上的粒径为0.2-3微米的铜粉末和1-40重量%的具有 软化点为380-580℃,基于100重量%的铜粉末,其中该混合物分散在包含有机聚合物粘合剂,光引发剂,可辐射固化单体和有机溶剂的有机稀释剂中。 该组合物可在还原条件下在450-600℃的温度下烧结。
    • 9. 发明公开
    • 배선형성용 하층막 형성재료, 매립재료 및 이들을 사용한배선형성방법
    • 下层材料用于接线和接线形成方法
    • KR1020040047702A
    • 2004-06-05
    • KR1020030085194
    • 2003-11-27
    • 도오꾜오까고오교 가부시끼가이샤
    • 나까무라에쯔꼬와끼야가즈마사
    • G03F7/11
    • G03F7/11G03F7/075G03F7/091H01L21/312H01L21/76802H01L21/76808Y10S430/145Y10S430/146
    • PURPOSE: Lower film material with higher exposure light absorption and excellent resistance to developer used in wiring formation with and a process for wiring formation are provided to use the film material in photoresist stripping solution. CONSTITUTION: The process for wiring formation comprises steps of preparing a lower film; forming a pattern of photoresist; patterning the lower film; forming pattern of wiring; and removing the lower film. The first step is to form the lower film(102) on a semiconductor substrate(101) prepared of a dielectric layer(101b) over a silicon wafer substrate(101a). The second step is to form a photoresist pattern by forming, exposing and developing a photoresist(103) on the lower film(102). The third step is to remove an exposed part of the lower film(102) without the photoresist pattern(104). The fourth step(d) is to form a desired wiring pattern(105) by etching the dielectric layer(101b) using the lower film(102) and the photoresist pattern(104) as a mask. The fifth step is to remove the film(102) and the photoresist pattern(104) remaining on the substrate using photoresist stripping solution.
    • 目的:在光刻胶剥离溶液中使用薄膜材料,其具有较高的曝光光吸收和对布线形成所使用的显影剂的优良抗性和布线形成工艺。 构成:布线形成工艺包括制备下膜的步骤; 形成光致抗蚀剂图案; 图案化下膜; 形成布线图案; 并除去下膜。 第一步是在硅晶片衬底(101a)上形成介电层(101b)的半导体衬底(101)上形成下膜(102)。 第二步是通过在下膜(102)上形成,曝光和显影光致抗蚀剂(103)形成光致抗蚀剂图案。 第三步骤是除去没有光致抗蚀剂图案(104)的下部薄膜(102)的暴露部分。 第四步(d)是通过使用下膜(102)和光致抗蚀剂图案(104)作为掩模蚀刻电介质层(101b)来形成期望的布线图案(105)。 第五步骤是使用光致抗蚀剂剥离溶液去除残留在基板上的膜(102)和光刻胶图案(104)。
    • 10. 发明公开
    • 비노출 부분의 제거가 불필요한 열 민감성 조성물, 상기조성물로 코팅된 네거티브 석판 및 상기 판에 네거티브이미지를 형성하기 위한 방법
    • 去除非特定区域的不确定性的热敏组合物,包含组合物的负面平版印刷板,以及形成负片图像的方法
    • KR1020040026121A
    • 2004-03-27
    • KR1020030046818
    • 2003-07-10
    • 아그파 그래픽스 엔브이
    • 볼리안젤로테타만티안드레아
    • G03F7/022
    • B41C1/1041Y10S430/145Y10S430/146Y10S430/165
    • PURPOSE: A heat-sensitive composition in which removal of the unexposed regions is unnecessary, a negative lithographic plate coated with the composition and a method for forming a negative image thereon are provided to form the image without removing materials and development treatment after the state of exposure with low energy. CONSTITUTION: A heat-sensitive composition forms an image without the removal of material, and does not require any developing treatment after the stage of exposure to heat. The heat-sensitive composition comprises (a) a switchable polymer, (b) an IR absorber(formula I), (c) a triazine compound(formula II), and (d) a novolak resin. A negative lithographic plate comprises a substrate coated with the composition. In a method for obtaining a negative image on the substrate coated with the composition, the heat-sensitive composition is first hydrophilic and then lipophilic after exposure to heat without the removal of material. The negative image is obtained by applying the small quantity of energy to the composition.
    • 目的:提供不需要去除未曝光区域的热敏组合物,涂覆有组合物的负版印刷板及其上形成负像的方法,以形成图像而不去除材料和显影处理 低能量曝光 构成:热敏组​​合物在没有去除材料的情况下形成图像,并且在曝光阶段之后不需要任何显影处理。 热敏组合物包含(a)可切换聚合物,(b)IR吸收剂(式I),(c)三嗪化合物(式II)和(d)酚醛清漆树脂。 负平版印刷版包括涂覆有该组合物的基材。 在涂覆有组合物的基材上获得负像的方法中,热敏组合物首先是亲水性的,然后暴露于热而不去除材料的亲油性。 通过对组合物施加少量的能量来获得负像。