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    • 9. 发明公开
    • 반도체 레이저장치
    • 半导体激光器件
    • KR1020020027222A
    • 2002-04-13
    • KR1020010061109
    • 2001-10-04
    • 파나소닉 주식회사
    • 사몬지가츠야다카야마도루이마후지오사무유리마사아키
    • H01S5/30
    • H01S5/32308H01S5/20H01S5/2004H01S5/2009H01S5/2206H01S5/221H01S5/2231H01S5/3213
    • PURPOSE: A semiconductor laser device is provided to prevent the phenomenon of thermal saturation, thereby improving an optical efficiency. CONSTITUTION: A semiconductor laser device includes an active layer(4), an n-type cladding layer(2) of Alx1Ga1-x1As and a p-type cladding layer(6) of (AlxGa1-x)yIn1-yP for defining a barrier height. The p-type cladding layer(6) for defining a barrier height contains more component elements than the n-type cladding layer(2). The potential difference between the conduction band edges of the p-type cladding layer(6) for defining a barrier height and the active layer(4) is greater than the potential difference between the conduction band edges of the n-type cladding layer(2) and the active layer(4). The carriers in the active layer(4) are prevented from overflowing into the p-type cladding layer(6) and a material having a high thermal conductivity is used for the n-type cladding layer(2) to prevent the phenomenon of thermal saturation, thereby providing improved optical output.
    • 目的:提供半导体激光器件以防止热饱和现象,从而提高光学效率。 构成:半导体激光器件包括有源层(4),Al x Ga 1-x AsAs的n型包层(2)和用于限定屏障的(Al x Ga 1-x)y In 1-y P的p型覆层(6) 高度。 用于限定势垒高度的p型覆层(6)包含比n型覆层(2)更多的构成要素。 用于限定势垒高度的p型覆层(6)的导带边缘与有源层(4)之间的电位差大于n型覆层(2)的导带边缘之间的电位差 )和有源层(4)。 有源层(4)中的载流子被阻止溢出到p型覆层(6)中,并且n型覆层(2)使用具有高热导率的材料来防止热饱和现象 ,从而提供改进的光输出。
    • 10. 发明公开
    • 반도체레이저의 제조방법
    • 制造半导体激光的方法
    • KR1020020000504A
    • 2002-01-05
    • KR1020010035261
    • 2001-06-21
    • 로무 가부시키가이샤
    • 기무라다카시
    • H01S5/30
    • H01S5/2231H01S5/221
    • PURPOSE: To grow a good light-confinement layer when forming a ridge semiconductor laser. CONSTITUTION: A ridge-shaped upper second clad layer 6 and a contact layer 7 are formed by etching, using a mask 8 made of SiO2. Subsequently, a light- confinement layer 10 made of Aly2Ga(1-y2)As is selectively formed on both sides of a ridge part 12 by using the mask 8 according to MOCVD. At this moment, trimethylgallium is used as a gallium supply material, and trimethylaluminum is used as an aluminum supply material. A substrate temperature is set at 500 to 750°C.
    • 目的:在形成脊状半导体激光器时生长良好的光限制层。 构成:使用由SiO 2制成的掩模8,通过蚀刻形成脊形的上部第二覆盖层6和接触层7。 随后,通过使用根据MOCVD的掩模8,在脊部12的两侧选择性地形成由Aly2Ga(1-y2)As制成的光限制层10。 此时,使用三甲基镓作为镓供给材料,使用三甲基铝作为铝供给材料。 基板温度设定在500〜750℃。