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    • 1. 发明公开
    • 반도체 장치
    • 半导体器件
    • KR1020090122106A
    • 2009-11-26
    • KR1020080118725
    • 2008-11-27
    • 미쓰비시덴키 가부시키가이샤
    • 요시우라야스히로이노우에마사노리
    • H01L29/861
    • H01L29/0619H01L29/0649H01L29/0653H01L29/0834H01L29/1016H01L29/74H01L29/7805H01L29/7811H01L29/861H01L29/8611
    • PURPOSE: A semiconductor device is provided to improve breakdown resistance by suppressing the concentration of a current in an external terminal of an anode. CONSTITUTION: A semiconductor device includes a first conductive semiconductor substrate(1), a second conductive anode(2), a guard ring(6), a first conductive cathode, and a second conductive cathode impurity area. The first conductive semiconductor substrate includes a first main surface and a second main surface to face each other. The second conductive anode is formed in the first main surface of the semiconductor substrate. The guard ring surrounds the anode with a preset interval. The first conductive cathode is formed on the second main surface of the semiconductor substrate. The second conductive cathode impurity area is formed in the area opposite to the guard ring in the cathode.
    • 目的:提供一种半导体器件,通过抑制阳极外部端子中的电流浓度来提高耐击穿性。 构成:半导体器件包括第一导电半导体衬底(1),第二导电阳极(2),保护环(6),第一导电阴极和第二导电阴极杂质区域。 第一导电半导体衬底包括第一主表面和第二主表面以彼此面对。 第二导电阳极形成在半导体衬底的第一主表面中。 保护环以预设间隔围绕阳极。 第一导电阴极形成在半导体衬底的第二主表面上。 第二导电阴极杂质区域形成在阴极中与保护环相对的区域中。