专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

KR1020100093290A 몰드 성형되는 전자 장치, 이의 제조 방법과 제조 금형 및 이의 응용된 전자장치 有权
标题翻译：通过成型形成的电子设备，用于制造其的方法和模具，使用该电子设备的电子应用
公开(公告)号：KR1020100093290A
公开(公告)日：2010-08-25
申请号：KR1020090012410
申请日：2009-02-16
申请人： 삼성전기주식회사
发明人： 이득우 , 성재석 , 이대규 , 양태석 , 전영호
IPC分类号： H05K5/00 , G11B20/00
CPC分类号： H05K5/065 , B29C45/14065 , B29C45/14655 , B29C2045/14147 , B29L2031/3061 , B29L2031/3481 , H01H9/0228 , H01H9/0271 , H01H9/04 , H01H2009/0285 , H01H2221/09
摘要： PURPOSE: It interlinks the cable as the fixed clamp to substrate and the electronic device for being molded and shaped, and the manufacturing method thereof, the making mold and the applied electronic device mold the whole. In that way the bending of the cable, and the durability about the push-pull can be improved. CONSTITUTION: In the substrate(20), the circuit component is mounted. The cable(30) transfers the external signal to substrate. Clamp fixes the cable on substrate. It into one body molds substrate and clamp to the resinous material and the casing molding unit(12) forms the overall look. By being mounted in substrate and pressing, it offers signal and the driving part GBN. The driving part is molded with the casing molding unit and the driving part mold casing part into one body molded and shaped.
摘要翻译：目的：将作为固定夹的电缆与基板和模制和成形的电子装置相互连接，其制造方法，制模和应用电子装置整体模制。以这种方式，可以提高电缆的弯曲以及推挽的耐久性。构成：在基板（20）中，安装电路元件。电缆（30）将外部信号传送到基板。夹具将电缆固定在基板上。将其模制到一个主体中，模制基板并将其夹紧到树脂材料上，并且壳体模制单元（12）形成整体外观。通过安装在基板和按压中，它提供信号和驱动部分GBN。驱动部件被模制成壳体模制单元和驱动部分模具壳体部分成为一体模制和成型。

2. 发明授权

KR101026050B1 몰드 성형되는 전자 장치, 이의 제조 방법과 제조 금형 및 이의 응용된 전자장치 有权
标题翻译：通过成型形成的电子器件，其制造方法和模具，通过使用它们进行电子应用
公开(公告)号：KR101026050B1
公开(公告)日：2011-03-30
申请号：KR1020090012410
申请日：2009-02-16
申请人： 삼성전기주식회사
发明人： 이득우 , 성재석 , 이대규 , 양태석 , 전영호
IPC分类号： H05K5/00 , G11B20/00
CPC分类号： H05K5/065 , B29C45/14065 , B29C45/14655 , B29C2045/14147 , B29L2031/3061 , B29L2031/3481 , H01H9/0228 , H01H9/0271 , H01H9/04 , H01H2009/0285 , H01H2221/09
摘要： 본 발명의 일 실시예에 따른 몰드 성형되는 전자 장치는 회로부품이 실장되는 기판; 상기 기판으로 외부의 신호를 전달하는 케이블; 상기 케이블을 상기 기판에 고정하는 클램프; 및 상기 기판 및 클램프를 수지재로 일체로 몰딩하여 전체 외관을 형성하는 케이싱 몰딩부;를 포함할 수 있다.

3. 发明授权

KR101255475B1 배선용 차단기 有权
标题翻译：模制电路断路器
公开(公告)号：KR101255475B1
公开(公告)日：2013-04-16
申请号：KR1020110117013
申请日：2011-11-10
申请人： 엘에스산전 주식회사
发明人： 백기호
IPC分类号： H01H73/02 , H01H71/10
CPC分类号： H01H9/02 , H01H3/38 , H01H3/46 , H01H71/10 , H01H71/12 , H01H73/02 , H01H73/06 , H01H2009/0285
摘要： PURPOSE: A molded case circuit breaker is provided to prevent the transfer of an arc by preventing the height increase of a product, thereby reducing the size of a space where the arc is transferred. CONSTITUTION: An operation unit(600) moves a movable contact part(400) with the operation of an open/close unit(500). An electrode shaft(621) is installed at one side of an upper enclosure(100) which is the exterior of a front chamber. A first link component(610) includes an upper link and a lower link. One side of a second link component(620) is rotatably connected to the lower link. The other side of a third link component(630) is rotatably connected to the movable contact part.
摘要翻译：目的：提供一种塑壳断路器，通过防止产品的高度增加来防止电弧的转移，从而减小电弧传输空间的大小。构成：操作单元（600）通过打开/关闭单元（500）的操作来移动可动接触部分（400）。电极轴（621）安装在作为前室的外部的上壳体（100）的一侧。第一链路组件（610）包括上链路和下链路。第二连杆部件（620）的一侧可旋转地连接到下部连杆。第三连杆部件（630）的另一侧可旋转地连接到可动接触部分。

4. 发明公开

KR1020090036501A 인몰드 성형 터치 모듈과 그 제조 방법 无效
标题翻译：模具成型触摸模块及其制造方法
公开(公告)号：KR1020090036501A
公开(公告)日：2009-04-14
申请号：KR1020080017729
申请日：2008-02-27
申请人： 티피케이 터치 솔루션스 인코포레이션
发明人： 수,셍-핀 , 리,민-이
IPC分类号： G06F3/041 , G06F3/02
CPC分类号： H05K5/0017 , H01H2009/0285 , Y10T29/4913 , Y10T29/49156 , G06F3/041 , G06F3/0412 , G06F3/0416 , G06F2203/04103
摘要： An in-mould molding touch module and a method for manufacturing the same are provided to decrease the defection rate and reduce the risk of the exposure to dusts by completing an electrode layer, which consists of a glass thin file and an ITO, through an injecting molding process. A transparent conducting substrate(1) includes an inner surface(11) and an outer surface(12). The inner surface has a capacitive electrode layer(2) formed thereon. A capacitive electrode layer is a touch sense circuit(21) made of the ITO. The outer surface is configured for touching the touch sense circuit. A molding rind is integrated to contain a periphery(13) of the transparent conducting substrate via the in-mould injecting mode. The transparent conducting substrate is made of a transparent glass thin film, and the ITO is coated on the inner surface of the transparent conducting substrate via a vacuum sputtering mode. The molding rind includes an outer surface corresponding to a contour of a cavity. In-mould injecting, the outer surface is prone to combine with the outer surface of the transparent conducting plate to be arranged in a plane. Thus the in-mould molding touch module has a thin thickness, and has no ladder like thickness and gap arranged between the joint surfaces.
摘要翻译：提供模内成型触摸模块及其制造方法，以通过注射成型玻璃薄文件和ITO构成的电极层来降低脱模率并降低暴露于粉尘的风险成型工艺。透明导电基板（1）包括内表面（11）和外表面（12）。内表面上形成有电容电极层（2）。电容电极层是由ITO制成的触摸感测电路（21）。外表面被配置为触摸触摸感测电路。整形成型外皮，通过模内注入模式包含透明导电基材的周边（13）。透明导电基板由透明玻璃薄膜制成，ITO通过真空溅射模式涂覆在透明导电基板的内表面上。成型外皮包括对应于空腔轮廓的外表面。在模内注射中，外表面容易与透明导电板的外表面结合以布置在平面中。因此，模内成型触摸模块具有薄的厚度，并且在接合表面之间没有布置有阶梯状的厚度和间隙。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式