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    • 1. 发明公开
    • 절연 전선, 코일 및 전기·전자기기, 및 절연 전선의 제조 방법
    • 绝缘电线,线圈和电气/电子设备,以及绝缘电线的制造方法
    • KR1020170078608A
    • 2017-07-07
    • KR1020177009500
    • 2015-09-08
    • 후루카와 덴키 고교 가부시키가이샤후루카와 마그넷트 와이야 가부시키가이샤
    • 사이토다케시이케다케이스케후쿠다히데오
    • H01B7/02H01B3/30H01B13/24
    • H01B7/0275C08L67/025C08L79/08C08L81/06H01B3/30H01B3/301H01B3/306H01B3/42H01B3/427H01B3/441H01B7/02H01B13/00H01B13/14H01F5/06H01B13/24
    • 절연전선의부분방전개시전압을높이고, 200℃를초과하는고온에서도, 기계적특성이우수하고, 내열열화가억제된절연전선, 코일및 전기·전자기기, 및절연전선의제조방법을제공한다. 도체의외주에, 압출피복수지층을포함하는, 적어도 1층의전선피막을가지는절연전선으로서, 압출피복수지층이, 서로비유전율이다른수지 (A)와수지 (B)의혼합수지로이루어지고, 수지 (A)가, 폴리에테르에테르케톤, 폴리에테르케톤케톤, 폴리에테르케톤, 폴리에테르에테르케톤케톤, 폴리에테르케톤에테르케톤케톤및 폴리케톤으로부터선택되는폴리알릴에테르케톤수지이며, 수지 (B)가, 200℃에서의비유전율이상기수지 (A)보다낮은비불소계의수지이며, 상기혼합수지의혼합질량비[수지 (A)의질량:수지 (B)의질량]가 90:10 ~ 51:49이며, 또한전선피막전체의비유전율에있어서, 25℃상대습도 50%에서의비유전율에대한, 200℃에서의비유전율의비의값이, 1.20 미만인절연전선, 코일, 전기·전자기기및 절연전선의제조방법.
    • 分离的增加的导线的局部放电起始电压,即使在高温下超过200℃,提供了力学性能yiwoosu和绝缘热劣化被抑制电线,线圈,和电气和电子器件,以及制造该绝缘电线的方法。 上的导体,由具有电线被覆的绝缘导线的外周,至少一个层包括多个挤出包覆树脂层的,挤出包覆树脂层的数量,次郎的另一介电常数hapsu其它树脂(A)华数载体(B)uihon 树脂(a)是一种聚醚醚酮,聚醚酮酮,聚醚酮,聚醚醚酮酮,聚醚酮醚,以及酮酮和聚醚酮中选择聚烯丙基醚酮树脂,和树脂(B) 一个,超过200℃eseoui移相器树脂(a)无氟低介电常数的树脂,混合树脂的混合质量比[通过树脂的质量份的(a):将树脂(B)的质量]为90:10 - 51:49 ,并根据所述整体的相对介电常数生产电线被覆的,绝缘电线,线圈,电气和电子装置的25℃的相对湿度和绝缘电缆,其相对介电常数eseoui的比的值,200℃下的相对介电常数eseoui 50%,小于1.20 方式。
    • 7. 发明公开
    • 유전율이 매우 낮은 간층 유전체를 위한 나노 다공성중합체 필름
    • 用于具有非常低介电常数的中间层电介质的纳米聚合物膜
    • KR1020000035596A
    • 2000-06-26
    • KR1019990051635
    • 1999-11-19
    • 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드
    • 오닐마크레오나드로베슨로이드맬론버고인쥬니어윌리엄프랭클린랭삼마이클
    • C08J7/04B82B3/00
    • H01L21/02118C08J9/28C08J2201/0502C08J2201/0542H01B3/306H01B3/42H01B3/427H01B3/442H01L21/02203H01L21/02282H01L21/312H01L21/31695
    • PURPOSE: A nanoporous polymer film which overcomes the drawbacks of film thickness, dielectric constant, porosity, stability and adhesion of the prior art, and has low dielectric constant nanoporous thin films with good adhesion for use in dielectric layers for integrated circuits and various microelectronic devices, thereby allows the achievement of the high performance films and polymeric interlayer dielectrics in the reduced line dimensions contemplated by the electronic fabrication industry is provided. CONSTITUTION: A nanoporous polymer film is produced by following method comprising the steps of: providing a polymer in a solution with at least two solvents for the polymer, wherein a lowest boiling solvent and a highest boiling solvent have a difference in their respective boiling points of approximately 50°C or greater; forming a film of the polymer in solution with the at least two solvents on a substrate; removing a predominant amount of the lowest boiling solvent; contacting the film with a fluid which is a non-solvent for the polymer, but which is miscible with the at least two solvents; and forming a nanoporous film having average pore size in the film of less than 10 micrometer and low dielectric constant.
    • 目的:克服现有技术的膜厚度,介电常数,孔隙率,稳定性和粘附性的缺点的纳米多孔聚合物膜,并且具有用于集成电路和各种微电子器件的介电层中具有良好粘合性的低介电常数纳米多孔薄膜 ,从而允许实现由电子制造工业预期的减小的线尺寸的高性能膜和聚合物层间电介质。 构成:通过以下方法制备纳米多孔聚合物膜,其包括以下步骤:在溶液中提供聚合物至少两种用于聚合物的溶剂,其中最低沸点溶剂和最高沸点溶剂的沸点相差 大约50°C以上; 在溶液中用基材上的至少两种溶剂形成聚合物膜; 去除主要量的最低沸点溶剂; 使膜与用于聚合物的非溶剂的流体接触,但与至少两种溶剂可混溶; 并且在薄膜中形成平均孔径小于10微米和低介电常数的纳米孔膜。